HP4258 Search Results

MIFARE Card IC Coil Design Guide

Abstract: mifare s50 mifare s50 MIFARE MF1ICS2005 Mifare MF1 IC S 70
Contextual Info: MF1 IC S20 05 Sawn bumped 120µm wafer addendum Rev. 3.0 — 18 July 2007 Product data sheet 141130 PUBLIC 1. General description The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

ic u11

Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work

MF1ICS5005

Abstract: mifare s50 MIFARE MIFARE Card IC Coil Design Guide mifare s50 LCR meter for ICs package S5005
Contextual Info: MF1 IC S50 05 Bumped sawn wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 102032 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

MIFARE s70 chip

Abstract: Philips MF1 IC S70 General Wafer Specification MIFARE s70 UV-tape MIFARE Card IC Coil Design Guide S7001 MIFARE Card Coil Design Guide
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Sawn wafer on UV-tape MF1 IC S70 01

MIFARE Card IC Coil Design Guide

Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01

Contextual Info: Multilayer Chip Inductors MLC20 Dimensions In. MLC20 A .1261.008 B .063 + .008 C* .024+ .008 C .043 ±.011 D .020+ .011 Allied Part Number Inductance Tolerance (^H) (%) Q Min. SRF Test Freq. (MHz) Min. (MHz) DCR Max. (G) Rated Current (mA) MLC20-R047M* .047

X118

Abstract: S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC bumped sawn wafer on UV-tape addendum Rev. 3.1 — 4 April 2007 Product data sheet 101831 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

Contextual Info: RoHS Multilayer Chip Inductors MLC20 0.043±0.008 0.126±0.008 Dimensions: 1.09±0.20 (3.20±0.20) Inches (mm) 0.063±0.008 (1.60±0.20) 0.043±0.008 (1.09±0.20) 0.047 (1.19) 0.078 (1.98) Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq.

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 S50 mifare mf1 ic s50 uv-tape S5005
Contextual Info: MF1 IC S50 05 Sawn wafer on UV-tape addendum Rev. 3.2 — 18 April 2007 Product data sheet 101932 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP

MIFARE s70 chip

Abstract: Philips MF1 IC S70 MIFARE Card IC Coil Design Guide ICS70 S7001
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape

MIFARE Card Coil Design Guide

Abstract: MF0ICU1 LCR meter for ICs package contactless Functional Specification
Contextual Info: MF0 IC U10 01 120 mm Bumped unsawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 127632 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless smart card IC designed for card IC coils following the

mifare s50 MIFARE

Abstract: MF1 S50 mifare s50 Card Mifare 1 S50 S50 Application Note MF1 IC S50 Mifare MF1 S50 LCR meter for ICs package
Contextual Info: MF1 IC S50 06 Wafer specification addendum Rev. 3.2 — 16 March 2007 Product data sheet 075932 PUBLIC 1. General description The MF1 ICS 50 06 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

ibis format

Abstract: IBIS wafer map format ic u11 MF-0
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Bumped Wafer Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors March 2003 Philips Semiconductors Product Specification Rev. 3.0 March 2003

MIFARE Card IC Coil Design Guide

Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS

Philips MF1 IC S50

Abstract: Philips Mifare 1 S50 mf1 s50 Mifare MF1 S50 Specification FCP2 Flip Chip Package FCP2 Philips Mifare 1 S50 specifications MF1 IC S50 mifare s50 mifare s50 MIFARE
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.1 October 2004 Flip Chip Package Specification MF1 FCP2 S50

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 IC S 70 MIFARE s70 chip X118 AN MIFARE Card Coil Design Guide 101730 S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader

MOA4 S50

Abstract: MOA4 MOA4 package specification MOA4 Package mifare s50 MIFARE mf1 s50 mifare s50 "Chip card module"
Contextual Info: MF1 MOA4 S50 Contactless Chip Card Module Specification Rev. 3.2 — 19 December 2006 Product data sheet 083032 PUBLIC 1. General description 1.1 Addendum This document gives specifications for the product MF1 MOA4 S50. The MF1 MOA4 S50 is the integrated circuit MF1 ICS50 in the package SOT500BA2.

AN MIFARE Card Coil Design Guide

Abstract: marking code s20 LCR meter for ICs package MIFARE Card Coil Design Guide MF1ICS5006
Contextual Info: MF1 IC S20 07 Sawn wafer on UV-tape addendum Rev. 1.1 — 16 March 2007 Product data sheet 132311 PUBLIC 1. General description The MF1 ICS 20 20 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MLC20

Contextual Info: RoHS Multilayer Chip Inductors MLC20 0.043±0.008 0.126±0.008 Dimensions: 1.09±0.20 (3.20±0.20) Inches (mm) 0.063±0.008 (1.60±0.20) 0.043±0.008 (1.09±0.20) 0.047 (1.19) 0.078 (1.98) Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq.

MF0 IC U1X

Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Contextual Info: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1

MIFARE Card Coil Design Guide

Abstract: uv-tape mifare s50 mifare s50 MIFARE MF1 IC S50 LA 7124
Contextual Info: MF1 IC S50 07 Sawn bumped wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 118832 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

LA 7124

Abstract: mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 CONTACTLESS SMART CARD READER
Contextual Info: MF1 IC S50 07 Sawn wafer addendum Rev. 3.2 — 16 March 2007 Product data sheet 118732 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

Contextual Info: Multilayer Chip Inductors Dimensions In. MLC20 A MLC20 A .126 ± .008 C B .063 ± .008 B D C .043 ± .008 D .020 ± .012 E .078 G F .054 G .047 Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq. (MHz) E SRF Min. (MHz) DCR Max. (Ω) Rated

ic u11

Abstract: uv-tape HP4258 ibis format IBIS wafer map format MIFARE Card IC Coil Design Guide philips 22c la 4620 ic
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004