HQFP208 Search Results

HQFP208-P-2828-0

Abstract: HQFP 208 D1561 PAD105
Contextual Info: 208P6H-A Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Lead Material Alloy 42 MD e JEDEC Code – Weight g 5.39 157 b2 208 ME HD D 156 1 I2 Symbol HE E Recommended Mount Pad 105 52 53 104 A L1 F b y A1 c A2 e A A1 A2 b c D E e HD

Contextual Info: HQFP208-C-3939-0.65 Radiation fin 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 アルミナ コバール 半田ディップ(5~50µm) 25.9 TYP.

HQFP208-P-2828-0

Abstract: HQFP 208
Contextual Info: 208P6Z-E Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Planning b2 208 ME D 157 1 156 I2 Recommended Mount Pad E HE Symbol 105 52 53 104 F A L1 A1 c A2 e b L y Detail F

ZD MARK 22

Abstract: PRQP0208KE-B MAX2828
Contextual Info: JEITA Package Code P-HQFP208-28x28-0.50 RENESAS Code PRQP0208KE-B Previous Code FP-208E/FP-208EV MASS[Typ.] 5.3g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 156 105 157 104 Reference Symbol

HQFP208-C-3939-0

Contextual Info: HQFP208-C-3939-0.65 Radiation fin 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Solder dipping (5~50µm) 25.9 TYP.

MB91F594

Abstract: MB91F59BC
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-3v0-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *

MB91F5

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-2v1-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *

SH7750

Abstract: SH7750S HS7750KCM02HE Hitachi DSA00382 SDMR-3
Contextual Info: SuperH Family E10A Emulator Additional Document for User’s Manual SH7750 E10A HS7750KCM02HE Renesas Microcomputer Development Environment System SuperH Family / SH7750 Series Specific Guide for the SH7750 E10A Emulator Rev.1.00 2004.2.17 Cautions Keep safety first in your circuit designs!

hitachi sh3

Abstract: fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller
Contextual Info: MICROCONTROLLER WORKSHOPS Graphic Controller 1 1 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com 1 PC graphics sets standards 2 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com

MB86290

Abstract: HQFP-208 HQFP208 MB86290A MB86291 MB86833 V832 video SIGNAL CAPTURE MOBILE LCD DISPLAY Texture mapping
Contextual Info: MB86291< <SCARLET> > Graphics Controller Specifications Revision 1.0 March 2001 Copyright FUJITSU LIMITED 1998, 1999 ALL RIGHTS RESERVED All Rights Reserved The information in this document has been carefully checked and is believed to be reliable. However, Fujitsu Limited assumes no responsibility for inaccuracies.

SH7750

Abstract: SH7750R pfce nec QFP-208
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

ba732

Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 1 章 パッケージの分類 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 1 章部分とな

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

ADE-702-196A

Abstract: Hitachi DSA0084 SH7750 SH7750S SH7751
Contextual Info: Hitachi Microcomputer Development Environment System SH7750 E10A Emulator User’s Manual ADE-702-196A Rev. 2.0 01/15/01 Hitachi, Ltd. HS7750KCM01HE Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

Denso L 918 8

Abstract: Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D
Contextual Info: The Reliability Data Program October 1, 1996 Expanded Version Index • • • • • • HTOL High Temperature Operating Life . 85/85 (Bias Moisture Life). PCT (Unbiased Pressure Pot).

BGA256

Abstract: HQFP208 QFP-208 SH7750
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

HQFP-208

Abstract: hitachi CONNECTOR 2 PIN 2514-6002 BGA256 HQFP208 QFP-208 SH7750R h-udi
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

PAL AM 16v8

Abstract: 9-JP32 FR30 HQFP208 SAA7111A SH7750 V832 IC 2V5 R100R0
Contextual Info: SCARLET Subboard Documentation  Fujitsu Microelectronics Europe GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany History Revision V1.0 V1.1 V1.2 Date 12.03.01 06.06.01 05.07.01 Comment New Document Update redesign of board New board plan 2

GR-253-CORE

Abstract: HQFP-208 MB86692 FB155 intel atom microprocessor HQFP208
Contextual Info: Product Flyer September 1998 MB86692 FireBurst 155 ATM 155Mbps Multi-PHY Device Version 1.0 FML/NPD/FB155/FL/1963 The FireBurst155 ATM 155Mbps Multi-PHY Device is a highly integrated termination concentrator for ATM LAN/WAN applications. Implementing four UNI/NNI ports on a single device

121C-2

Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

425M

Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3

HS7750KCI01H

Abstract: SH7750 E10A Emulator SH7750 SH7750S SH7751 tab 173
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

XC95XXXL

Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
Contextual Info: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

PAL AM 16v8

Abstract: JP46 74ALS34 Hitachi TANTAL scarlet FR30 HQFP208 SAA7111A SH7750 V832
Contextual Info: SCARLET Subboard Documentation  Fujitsu Microelectronics Europe GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany History Revision V1.0 V1.1 V1.2 Date 12.03.01 06.06.01 05.07.01 Comment New Document Update redesign of board New board plan 2