HT2004 Search Results

lb 123t

Abstract: HLB123T 123T LB123T
Contextual Info: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2006.02.20 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits

Contextual Info: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2004.09.30 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits

McKenzie

Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
Contextual Info: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing

ASTM-B487-79

Abstract: McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130
Contextual Info: Ultra Low Profile DIP Sockets E L E C T R O N I C S MX McKenzie Socket Division Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking ULTRA LOW PROFILE OPTIONS

Contextual Info: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold

Contextual Info: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell

McKenzie socket division

Contextual Info: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions

QQ-B-750

Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
Contextual Info: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force

011B

Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
Contextual Info: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory

BERG strip 40 pin single row

Abstract: E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79
Contextual Info: SIP Sockets E L E C T R O N I C S flMK McKenzie Socket Division SHORTER SOLDER TAIL — NO TRIMMING .1 6 5 4 ,1 9 , .265 1 (6.73) .100 .0 2 0 - OUR MOST POPULAR CONTACT .165 (4,19) .230 (5,84) .030 (0,76) .020 — (0,51) (2 .5 4 ) (0.51) f .290 (7.37) .125

Contextual Info: Elevated SIP Sockets ELECTRONICS mac M cKenzie S ocket D ivisio n Features • Elevated Sockets allow for greater package density • Allows stacking of PCB • Maximizes airfow • Available in Hi-Temp P P S Insulator material STANDARD TEMPERATURE — UL 94V-0 THERMOPLASTIC

Contextual Info: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS

mil-m-24519 molding plastics

Abstract: McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL
Contextual Info: Open and Closed Frame DIP Sockets E X TR A LO N G S O LD E R TAILS ,i§ .116 2,951 H r1 i U 1 1 , Fj83 (+, 65 x x x . T TYP . . . A ll contact styles ^ a r e available in our Patented PPC Disposable Carrier System. Specify PPC in part number. 1.17 3

Contextual Info: fUKC M cKenzie Socket Division — r .585 ' 14,86 •250 V (6,35) G .180 .018— (0,46) (4.57) TYP Specify Specify Plating/Material Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10p" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003

McKenzie socket division

Contextual Info: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold

862S

Abstract: FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division
Contextual Info: fnKC McKenzie Socket Division — r .460 r .585 I 14,86 •250 (6,35) 1 ,210(11’,68) Plating/Material Specify Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10|j" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003 857S 200|j" Tin/Brass

mckenzie

Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
Contextual Info: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS

Contextual Info: Mal@4 -MaSe DIP Headers E L E C T R O N I C S fflex M cKenzie Socket Division Insulator Options Low Profile Options ,. 020- .050 1.27 I I T (0 .51 ) _ L .335 ,.085, I (2.]6) 1 (8,51) TYP I I £ 1 .104 (2,64) I-.070 (1,78) .299 (7.60) r TTT25 (3.18) .020 '

st178

Abstract: diode E1110 CK705 ecg semiconductor replacement guide CS1237 ME1120 TE1088 1N942 1N733A Delco DTG-110B transistor
Contextual Info: S Y L V A N IA ECG S e m ic o n d u c to r L in eREPLACES OVER 35,000 TYPES introduction The ECG line of semiconductors is designed to minimize replacement parts inventory for the tech­ nician and yet economically meet replacement needs of the wide variety of entertainment equipment

triac zd 607

Abstract: hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p
Contextual Info: & SEM ICO N DU CTO R This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Professional service techni­ cian. The information contained herein is based on an analysis of the published

McKenzie

Abstract: 157b n001b McKenzie technology
Contextual Info: REV DESCRIPTION ECO. A10. DATE N-001BC INITIAL DRAWING RELEASE 1 /2 0 /9 9 ,020 ,050 THK 030 SCR 157B CQTY, 10 NDTESi 1. CONTACT MATERIAL! □UTER SHELLi BRASS ALLDY 36 0, 1 /2 HARD PER Q Q -B -6 2 6 . INNER CONTACT: BERYLLIUM COPPER, ALLDY 172 PER Q Q -C -5 3 3 .