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    HT2004 Price and Stock

    TE Connectivity URHT-200-4-42-0

    URHT-200/4/42-0
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    DigiKey URHT-200-4-42-0 Bulk 100
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    TE Connectivity URHT-200/4/42-0

    - Bulk (Alt: A35369-001)
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    Avnet Americas URHT-200/4/42-0 Bulk 30 Weeks 100
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    • 1000 $18.10285
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    Interstate Connecting Components URHT-200/4/42-0
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    • 100 $45.8657
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    Master Electronics URHT-200/4/42-0
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    • 100 $38.15
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    Legrand North America LLC HT2004-WH-V1

    Hdtv In-Wall Cable Connect Kit Wh |Legrand Pass & Seymour HT2004-WH-V1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark HT2004-WH-V1 Bulk 1
    • 1 $46.94
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    • 100 $38.64
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    HT2004 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    lb 123t

    Abstract: HLB123T 123T LB123T
    Text: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2006.02.20 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits


    Original     		PDF HT200402 HLB123T HLB123T O-126 183oC 217oC 260oC 10sec lb 123t 123T LB123T

    Untitled

    Abstract: No abstract text available
    Text: HI-SINCERITY Spec. No. : HT200402 Issued Date : 1993.05.15 Revised Date : 2004.09.30 Page No. : 1/4 MICROELECTRONICS CORP. HLB123T NPN EPITAXIAL PLANAR TRANSISTOR Description The HLB123T is designed for high voltage. High speed switching inductive circuits


    Original     		PDF HT200402 HLB123T HLB123T O-126 183oC 217oC 260oC

    McKenzie

    Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
    Text: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing


    OCR Scan     		PDF

    ASTM-B487-79

    Abstract: McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130
    Text: Ultra Low Profile DIP Sockets E L E C T R O N I C S MX McKenzie Socket Division Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking ULTRA LOW PROFILE OPTIONS


    OCR Scan     		PDF Gold/200^ Tin/200ti ASTM-B487-79 McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130

    Untitled

    Abstract: No abstract text available
    Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold


    OCR Scan     		PDF Gold/10p" Gold/200 /Tin/200

    Untitled

    Abstract: No abstract text available
    Text: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell


    OCR Scan     		PDF Gold/200nâ Tin/200p" Gold/200p" Gold/10M

    McKenzie socket division

    Abstract: No abstract text available
    Text: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions


    OCR Scan     		PDF Gold/200 Gold/10 Gold/200n, Tin/200p" McKenzie socket division

    QQ-B-750

    Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
    Text: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force


    OCR Scan     		PDF Gold/200 Gold/200^ Gold/10 QQ-B-750 alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79

    011B

    Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
    Text: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory


    OCR Scan     		PDF CONTACT-160B 011B MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine

    BERG strip 40 pin single row

    Abstract: E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79
    Text: SIP Sockets E L E C T R O N I C S flMK McKenzie Socket Division SHORTER SOLDER TAIL — NO TRIMMING .1 6 5 4 ,1 9 , .265 1 (6.73) .100 .0 2 0 - OUR MOST POPULAR CONTACT .165 (4,19) .230 (5,84) .030 (0,76) .020 — (0,51) (2 .5 4 ) (0.51) f .290 (7.37) .125


    OCR Scan     		PDF Tin/200M" Gold/200M" Gold/10M" 35nts BERG strip 40 pin single row E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79

    Untitled

    Abstract: No abstract text available
    Text: Elevated SIP Sockets ELECTRONICS mac M cKenzie S ocket D ivisio n Features • Elevated Sockets allow for greater package density • Allows stacking of PCB • Maximizes airfow • Available in Hi-Temp P P S Insulator material STANDARD TEMPERATURE — UL 94V-0 THERMOPLASTIC


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS


    OCR Scan     		PDF Gold/200p" old/200 old/10pâ old/200p

    mil-m-24519 molding plastics

    Abstract: McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL
    Text: Open and Closed Frame DIP Sockets E X TR A LO N G S O LD E R TAILS ,i§ .116 2,951 H r1 i U 1 1 , Fj83 (+, 65 x x x . T TYP . . . A ll contact styles ^ a r e available in our Patented PPC Disposable Carrier System. Specify PPC in part number. 1.17 3


    OCR Scan     		PDF Gold/10p" Gold/200 n/200 Gold/200fj" mil-m-24519 molding plastics McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL

    Untitled

    Abstract: No abstract text available
    Text: fUKC M cKenzie Socket Division — r .585 ' 14,86 •250 V (6,35) G .180 .018— (0,46) (4.57) TYP Specify Specify Plating/Material Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10p" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003


    OCR Scan     		PDF

    McKenzie socket division

    Abstract: No abstract text available
    Text: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold


    OCR Scan     		PDF Gold/200 Gold/10p" Gold/200p" Gold/10p McKenzie socket division

    862S

    Abstract: FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division
    Text: fnKC McKenzie Socket Division — r .460 r .585 I 14,86 •250 (6,35) 1 ,210(11’,68) Plating/Material Specify Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10|j" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003 857S 200|j" Tin/Brass


    OCR Scan     		PDF 018-typ 862S FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division

    mckenzie

    Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
    Text: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS


    OCR Scan     		PDF CPPDC300C-118- DC300P-090-FR50 DC600P-118-FR50 mckenzie valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79

    Untitled

    Abstract: No abstract text available
    Text: Mal@4 -MaSe DIP Headers E L E C T R O N I C S fflex M cKenzie Socket Division Insulator Options Low Profile Options ,. 020- .050 1.27 I I T (0 .51 ) _ L .335 ,.085, I (2.]6) 1 (8,51) TYP I I £ 1 .104 (2,64) I-.070 (1,78) .299 (7.60) r TTT25 (3.18) .020 '


    OCR Scan     		PDF TTT25

    st178

    Abstract: diode E1110 CK705 ecg semiconductor replacement guide CS1237 ME1120 TE1088 1N942 1N733A Delco DTG-110B transistor
    Text: S Y L V A N IA ECG S e m ic o n d u c to r L in eREPLACES OVER 35,000 TYPES introduction The ECG line of semiconductors is designed to minimize replacement parts inventory for the tech­ nician and yet economically meet replacement needs of the wide variety of entertainment equipment


    OCR Scan     		PDF Sylvan58MC 09A001-00 66X0003-001 50746A 68X0003 68X0003-001 T-E0137 93B3-3 93B3-4 st178 diode E1110 CK705 ecg semiconductor replacement guide CS1237 ME1120 TE1088 1N942 1N733A Delco DTG-110B transistor

    triac zd 607

    Abstract: hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p
    Text: & SEM ICO N DU CTO R This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Professional service techni­ cian. The information contained herein is based on an analysis of the published


    OCR Scan     		PDF thT404 ZV15A ZY33A ZT696 ZV15B ZY33B ZT697 ZT706 ZV27A ZY62A triac zd 607 hep c6004 2sb504 2SC 968 NPN Transistor sje 607 motorola c6004 diode BY127 specifications K872 af118 Motorola Semiconductor hep c3806p

    McKenzie

    Abstract: 157b n001b McKenzie technology
    Text: REV DESCRIPTION ECO. A10. DATE N-001BC INITIAL DRAWING RELEASE 1 /2 0 /9 9 ,020 ,050 THK 030 SCR 157B CQTY, 10 NDTESi 1. CONTACT MATERIAL! □UTER SHELLi BRASS ALLDY 36 0, 1 /2 HARD PER Q Q -B -6 2 6 . INNER CONTACT: BERYLLIUM COPPER, ALLDY 172 PER Q Q -C -5 3 3 .


    OCR Scan     		PDF N-001BC HT2004, 247-9B16 McKenzie 157b n001b McKenzie technology