HVQFN36 Search Results

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads 36 terminals; body 6 x 6 x 0.85 mm SOT1092-1 B D D1 A terminal 1 index area E1 E A A4 A1 c detail X e1 e 10 18 C C A B C v w b y y1 C L 19 9 e e2 Eh 1 terminal 1 index area

Contextual Info: Package outline HVQFN36R: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm A B D SOT1000-1 terminal 1 index area E A detail X e1 v w M M C A B C L1 1/2 e e v w b 11 18 C C A B C M M y y1 C L 10

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-2 terminal 1 index area E A A1 c detail X e1 e 10 18 C C A B C v w b y1 C y L 19 9 e e2 Eh 1 27 terminal 1 index area

HVQFN36

Abstract: MO-220 sot818
Contextual Info: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-3 terminal 1 index area E A A1 c detail X e1 e 10 18 C C A B C v w b y1 C y L 19 9 e e2 Eh 1 27 terminal 1 index area

HVQFN36

Contextual Info: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18 L 19 9 e e2 Eh 1 27 terminal 1 index area

HVQFN36

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN36 package SOT818-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN36R: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 5.5 x 4.5 x 0.85 mm A B D SOT1001-1 terminal 1 index area E A detail X e1 v w b e L1 10 18 M M C C A B C y1 C y L e e2 Eh terminal 1 index area

ISP1705

Abstract: isp1705 Hi-Speed Universal Serial Bus host control connector 12 pin micro usb PCB-Design guideline for mobile phone ericsson mini link FPGA programmable switch capacitor mini link ericsson Mini-B plug AN-1008
Contextual Info: AN10081 Interfacing to the ISP1705 Rev. 04 — 11 February 2010 Application note Document information Info Content Keywords isp1705; usb; ulpi; universal serial bus; transceiver; utmi+ low-pin interface; host; peripheral; otg; phy Abstract This document describes how a link can interface to the ISP1705 for host,

HVQFN36

Abstract: isp1705aet
Contextual Info: IMPORTANT NOTICE Dear customer, As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture "ST‐Ericsson". As a result, the following changes are applicable to the attached

CX24116

Abstract: CX24123 NXP Semiconductors DVb-S2 demodulator DVB-S2 demodulator cx24126 CX24118 CX24118A cx24116 pin out cx24123 pin out CX24114
Contextual Info: CX24118A Advanced Modulation Digital Satellite Tuner Rev. 02 — 8 September 2009 Document information Info Keywords Abstract Content Product data sheet CX24118A NXP Semiconductors Advanced Modulation Digital Satellite Tuner Ordering information Type number

isp1705aet

Abstract: ISP1705 isp1705 Hi-Speed Universal Serial Bus host control ISP1705HN HVQFN36 JESD22-A114D MO-220 SMD 6PIN IC MARKING CODE
Contextual Info: ISP1705 ULPI Hi-Speed USB transceiver Rev. 01 — 13 June 2008 Product data sheet 1. General description The ISP1705 is a UTMI+ Low Pin Interface ULPI Hi-Speed Universal Serial Bus (USB) transceiver that is fully compliant with Universal Serial Bus Specification Rev. 2.0,

HVQFN36

Contextual Info: BGX7221 Dual receiver down mixer Rev. 3 — 8 August 2012 Product data sheet 1. General description The BGX7221 device combines a pair of high performance, high linearity down-mixers for use in receivers having a common local oscillator, for instance having main and diversity

Contextual Info: TDA18204HN Cable pre-processor and low-power silicon tuner Rev. 2 — 12 July 2013 Product short data sheet 1. General description TDA18204HN is a cable pre-processor coupled with a low-power silicon tuner to address the front-end part of cable modems and gateways.

HVQFN36

Abstract: isp1715a ISP1715AHNUM usb video player circuit diagram IsP1715 ISP1715AETTM LM 715a DVD player with usb circuit diagram DVD usb player circuit diagram sot912
Contextual Info: ISP1715A ULPI Hi-Speed USB transceiver Rev. 01 — 07 January 2010 Data brief 1. General description Accomplishing the four core values of ST-Ericsson Universal Serial Bus USB products, low power, low cost, range, and robustness, the ISP1715A is designed to meet specific

TJA1100

Abstract: HVQFN36
Contextual Info: NXP OABR * Automotive Ethernet PHY TJA1100 True Automotive PHY for reliable, cost-effective & space-optimized in-vehicle Ethernet Implementing BroadR-Reach technology for transferring 100 Mbps over a single unshielded twisted pair [UTP] cable, the TJA1100 is optimized for automotive use cases

ISP1715A

Abstract: ISP1715 ericsson mini link FPGA programmable switch capacitor mini link ericsson Micro USB Mini-B plug PCB-Design guideline for mobile phone ST OTG controller an3038
Contextual Info: Interfacing to the ISP1715A AN3038 Application note Abstract This document describes how a link can interface to the ISP1715A for host, peripheral, or OTG application. This document also includes the PCB design guidelines when integrating the transceiver into a system.

"MOS Mixer"

Abstract: dual TMB 900 SOT1092-2 HVQFN36
Contextual Info: BGX7220 Dual receiver down mixer Rev. 1 — 8 August 2012 Product data sheet 1. General description The BGX7220 device combines a pair of high performance, high linearity down-mixers for use in receivers having a common local oscillator, for instance having main and diversity

Contextual Info: AN10998 BGX7221 evaluation board application note Rev. 1.0 — 17 August 2012 Application note Document information Info Content Keywords BGX7221, down-mixer, EVB, IP3, CP1, NF, PCB Abstract This application note describes the BGX7221 evaluation board EVB

IsP1715

Abstract: ISP1715AHN HVQFN36
Contextual Info: ISP1715A ULPI Hi-Speed USB transceiver Rev. 02 — 5 August 2009 Product data sheet 1. General description The ISP1715A is a UTMI+ Low Pin Interface ULPI Hi-Speed Universal Serial Bus (USB) transceiver. It is fully compliant with Universal Serial Bus Specification Rev. 2.0,

HVQFN36

Abstract: dual TMB 1800 173 MHz RF receiver "MOS Mixer" SOT1092-2
Contextual Info: BGX7221 Dual receiver down mixer Rev. 3 — 8 August 2012 Product data sheet 1. General description The BGX7221 device combines a pair of high performance, high linearity down-mixers for use in receivers having a common local oscillator, for instance having main and diversity

HVQFN36

Contextual Info: BGX7220 Dual receiver down mixer Rev. 1 — 8 August 2012 Product data sheet 1. General description The BGX7220 device combines a pair of high performance, high linearity down-mixers for use in receivers having a common local oscillator, for instance having main and diversity

isp1705aet

Abstract: ISP1705 isp1705 Hi-Speed Universal Serial Bus host control ISP1705HN JESD22-A114D MO-220 TFBGA36 SMD 6PIN IC MARKING CODE DP HVQFN36
Contextual Info: 34 .807IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. ● Company name - NXP B.V. is replaced with ST-NXP Wireless.

HVQFN36

Abstract: isp1705aet
Contextual Info: IMPORTANT NOTICE Dear customer, As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture "ST‐Ericsson". As a result, the following changes are applicable to the attached