Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN40 package SOT618-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN40
OT618-2
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Untitled
Abstract: No abstract text available
Text: 4 1 +9 SOT618-6 HVQFN40; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 September 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW
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OT618-6
HVQFN40;
OT618-6
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HVQFN-40
Abstract: HVQFN40 MO-220 sot618
Text: Package outline Philips Semiconductors HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A A1 E c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e
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HVQFN40:
OT618-3
MO-220
HVQFN-40
HVQFN40
MO-220
sot618
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HVQFN40
Abstract: HVQFN-40 SOT618-1 sot618 HY 2004 solder paste
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN40 package SOT618-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN40
OT618-1
OT618-1
HVQFN-40
SOT618-1
sot618
HY 2004
solder paste
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-6 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 L 20 C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 terminal 1 index area
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HVQFN40:
OT618-6
MO-220
sot618-6
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e y1 C v M C A B w M C b 1/2 e 11 y 20 L 21 10 e e2 Eh 1/2 e 1
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HVQFN40:
OT618
OT618-2
MO-220
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40R: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; resin based; body 5 x 5 x 0.8 mm B D SOT945-1 A terminal 1 index area E A detail X e1 e L1 1/2 e v w b 11 20 M M C C A B C y1 C y L 21 10 e e2 Eh 1/2 e
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HVQFN40R:
OT945-1
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HVQFN40
Abstract: SOT618-1
Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN40: plastic, heatsink very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A4 A E detail X e1 b e C v M B 11 y y1 C w M 20 v M A L 21 10
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HVQFN40:
OT618-1
MO-220
HVQFN40
SOT618-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-5 terminal 1 index area E A A1 c detail X e1 e 1/2 e ∅v ∅w b 11 20 M M C C A B C y1 C y L 10 21 e e2 Eh 1/2 e 1 terminal 1
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HVQFN40:
OT618-5
MO-220
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HVQFN40
Abstract: MO-220 philips l 6.1 SOT618-1
Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C
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HVQFN40:
OT618-1
MO-220
HVQFN40
MO-220
philips l 6.1
SOT618-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-7 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 20 L C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 30 terminal 1
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HVQFN40:
OT618-7
MO-220
sot618-7
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1
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HVQFN40:
OT618-3
MO-220
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cb20
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1
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HVQFN40:
OT618-1
OT618-1
MO-220
cb20
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-4 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1
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HVQFN40:
OT618-4
protru75
MO-220
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UM10204
Abstract: UBA3077HN HVQFN40 ocp 8101
Text: UBA3077HN Three-channel switched-mode LED driver Rev. 1 — 8 February 2011 Objective data sheet 1. General description The UBA3077HN is a high efficiency LED driver in an HVQFN40 package for general LED lighting or backlighting LCD displays. Operating from a supply of 10 V to 42 V, it can drive up to 3 strings of 20 LEDs each. The
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UBA3077HN
UBA3077HN
HVQFN40
UM10204
ocp 8101
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jedec package MO-220
Abstract: HVQFN40 MO-220 SOT618-1
Text: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN40: plastic, heatsink very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A4 A E detail X C e1 1/2 e e y y1 C ∅v M C A B b 11 ∅w M C
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HVQFN40:
OT618-1
MO-220
jedec package MO-220
HVQFN40
MO-220
SOT618-1
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PN533
Abstract: NXP PN533 USB Interface IC NXP ISO 14443-4 nfc antenna design NXP JESC22-C101-C PN5331B3HN Near field communication TDA8029
Text: PN533 Near Field Communication NFC controller Rev. 3.3 — 16 July 2012 158233 Product short data sheet PUBLIC 1. General description The PN533 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is
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PN533
PN533
80C51
4443A
14443B
NXP PN533
USB Interface IC NXP
ISO 14443-4
nfc antenna design NXP
JESC22-C101-C
PN5331B3HN
Near field communication
TDA8029
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jcop31
Abstract: PCF7921 NXP PN533 JCOP PN533 MOB4 package JCOP21 JCOP41 P5CN072 pdm1.1
Text: Smart solutions for smart services ISO 14443 ISO 15693 NXP Contactless Reader Systems Reader ICs MF RC500 100 64 8-bit parallel MF RC530 100 64 8-bit parallel, SPI MF RC531 100 64 8-bit parallel, SPI SL RC400 100 64 8-bit parallel CL RC632 100 64 8-bit parallel, SPI
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RC500
RC530
RC531
RC400
RC632
RC522
RS232
EV700
EV800
jcop31
PCF7921
NXP PN533
JCOP
PN533
MOB4 package
JCOP21
JCOP41
P5CN072
pdm1.1
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LPC2148 i2c
Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Text: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.
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OT363
SC-88)
LPC2148 i2c
BGB210S
lpc2148 interfacing 2.8" TFT LCD DISPLAY
BGB210
embedded c code to interface lpc2148 with sensor
BGW200
TDA8932T
tda8920bj
NXP PN531
TDA8947J equivalent
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samtec connector
Abstract: HVQFN40 ADC1415S080 HVQFN-40 ADC1415S065 ADC1210S Analysis on the ADC buffer cmos high power Buffer Amplifier ADC1010S
Text: NXP single 14-bit, 125 Msps ADC with input buffer & CMOS/ LVDS DDR outputs ADC1115S series, ADC1215S series and ADC1415S series Single-channel ADC with input buffer for High-IF applications Supporting sample rates up to 125 MSPS, this single-channel, 10 to 14 bit ADC delivers
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14-bit,
ADC1115S
ADC1215S
ADC1415S
14-bit
HVQFN40
ADC1415S,
ADC1215S
samtec connector
ADC1415S080
HVQFN-40
ADC1415S065
ADC1210S
Analysis on the ADC
buffer cmos
high power Buffer Amplifier
ADC1010S
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FAF 45 DIODE SMD
Abstract: FAF 45 DIODE FR07* diode RDS decoder FAF 37 DIODE old fm radio diagram FAF 37 DIODE smd TEA5764HN electrical table tea5764
Text: TEA5764HN FM radio + RDS Rev. 02 — 9 August 2005 Product data sheet 1. General description The TEA5764HN is a single chip electronically tuned FM stereo radio with Radio Data System RDS and Radio Broadcast Data System (RBDS) demodulator and RDS/RBDS decoder for portable application with fully integrated IF selectivity and demodulation.
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TEA5764HN
TEA5764HN
FAF 45 DIODE SMD
FAF 45 DIODE
FR07* diode
RDS decoder
FAF 37 DIODE
old fm radio diagram
FAF 37 DIODE smd
electrical table
tea5764
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an10133
Abstract: capacitor 100nf 16v x7r 10 1005 murata TEA5767/68 Garage Door Opener remote circuit diagrams philips rf manual balanced modulator ic 1496 2.4GHz Cordless Phone circuit diagram A case 10uf (10v) ±20% Chip Tantal TEA5767 working principle scanner block diagram
Text: Philips RF Manual product & design manual for RF small signal discretes 3rd edition July 2003 APPENDIX / documentation/rf_manual Document number: 4322 252 06385 Date of release: July 2003
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BB202,
BF1107/8
BGA6589
BGA6589.
BGA6589
an10133
capacitor 100nf 16v x7r 10 1005 murata
TEA5767/68
Garage Door Opener remote circuit diagrams
philips rf manual
balanced modulator ic 1496
2.4GHz Cordless Phone circuit diagram
A case 10uf (10v) ±20% Chip Tantal
TEA5767
working principle scanner block diagram
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Prestigio nobile 150
Abstract: diagram HANNSTAR j mv 4 Prestigio lad1 12vdc msi MOTHERBOARD SERVICE MANUAL LYNX SM 30 diagram HANNSTAR k mv diagram HANNSTAR k mv 4 IC25N040ATMR Insyde bios manual
Text: PRESTIGIO NOBILE 150 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4
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PC536
MAXIM1907)
82801DBM
W83L950D
PLL207-151
VT6105LOM
8089P
Prestigio nobile 150
diagram HANNSTAR j mv 4
Prestigio
lad1 12vdc
msi MOTHERBOARD SERVICE MANUAL
LYNX SM 30
diagram HANNSTAR k mv
diagram HANNSTAR k mv 4
IC25N040ATMR
Insyde bios manual
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diagram HANNSTAR k mv
Abstract: 8089P diagram HANNSTAR j mv 4 diagram HANNSTAR k mv 4 LF-H41S ALC101 diagram motherboard hannStar K MV USBHUB W83L950 hannstar j mv 1
Text: SERVICE MANUAL FOR 8089P BY: Ally.Yuan Repair Technology Research Department /EDVD Mar.2004 8089P N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4
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8089P
8089P
82801DBM
W83L950D
PLL207-151
VT6105LOM
diagram HANNSTAR k mv
diagram HANNSTAR j mv 4
diagram HANNSTAR k mv 4
LF-H41S
ALC101
diagram motherboard hannStar K MV
USBHUB
W83L950
hannstar j mv 1
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