HVQFN40 Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN40 package SOT618-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: 4 1  +9 SOT618-6 HVQFN40; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 September 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW

HVQFN-40

Abstract: HVQFN40 MO-220 sot618
Contextual Info: Package outline Philips Semiconductors HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A A1 E c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e

HVQFN40

Abstract: HVQFN-40 SOT618-1 sot618 HY 2004 solder paste
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN40 package SOT618-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-6 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 L 20 C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 terminal 1 index area

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e y1 C v M C A B w M C b 1/2 e 11 y 20 L 21 10 e e2 Eh 1/2 e 1

Contextual Info: Package outline HVQFN40R: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; resin based; body 5 x 5 x 0.8 mm B D SOT945-1 A terminal 1 index area E A detail X e1 e L1 1/2 e v w b 11 20 M M C C A B C y1 C y L 21 10 e e2 Eh 1/2 e

HVQFN40

Abstract: SOT618-1
Contextual Info: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN40: plastic, heatsink very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A4 A E detail X e1 b e C v M B 11 y y1 C w M 20 v M A L 21 10

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-5 terminal 1 index area E A A1 c detail X e1 e 1/2 e ∅v ∅w b 11 20 M M C C A B C y1 C y L 10 21 e e2 Eh 1/2 e 1 terminal 1

HVQFN40

Abstract: MO-220 philips l 6.1 SOT618-1
Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-7 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 20 L C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 30 terminal 1

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1

cb20

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1

Contextual Info: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-4 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1

UM10204

Abstract: UBA3077HN HVQFN40 ocp 8101
Contextual Info: UBA3077HN Three-channel switched-mode LED driver Rev. 1 — 8 February 2011 Objective data sheet 1. General description The UBA3077HN is a high efficiency LED driver in an HVQFN40 package for general LED lighting or backlighting LCD displays. Operating from a supply of 10 V to 42 V, it can drive up to 3 strings of 20 LEDs each. The

jedec package MO-220

Abstract: HVQFN40 MO-220 SOT618-1
Contextual Info: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN40: plastic, heatsink very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A4 A E detail X C e1 1/2 e e y y1 C ∅v M C A B b 11 ∅w M C

PN533

Abstract: NXP PN533 USB Interface IC NXP ISO 14443-4 nfc antenna design NXP JESC22-C101-C PN5331B3HN Near field communication TDA8029
Contextual Info: PN533 Near Field Communication NFC controller Rev. 3.3 — 16 July 2012 158233 Product short data sheet PUBLIC 1. General description The PN533 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is

jcop31

Abstract: PCF7921 NXP PN533 JCOP PN533 MOB4 package JCOP21 JCOP41 P5CN072 pdm1.1
Contextual Info: Smart solutions for smart services ISO 14443 ISO 15693 NXP Contactless Reader Systems Reader ICs MF RC500 100 64 8-bit parallel MF RC530 100 64 8-bit parallel, SPI MF RC531 100 64 8-bit parallel, SPI SL RC400 100 64 8-bit parallel CL RC632 100 64 8-bit parallel, SPI

LPC2148 i2c

Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.

samtec connector

Abstract: HVQFN40 ADC1415S080 HVQFN-40 ADC1415S065 ADC1210S Analysis on the ADC buffer cmos high power Buffer Amplifier ADC1010S
Contextual Info: NXP single 14-bit, 125 Msps ADC with input buffer & CMOS/ LVDS DDR outputs ADC1115S series, ADC1215S series and ADC1415S series Single-channel ADC with input buffer for High-IF applications Supporting sample rates up to 125 MSPS, this single-channel, 10 to 14 bit ADC delivers

FAF 45 DIODE SMD

Abstract: FAF 45 DIODE FR07* diode RDS decoder FAF 37 DIODE old fm radio diagram FAF 37 DIODE smd TEA5764HN electrical table tea5764
Contextual Info: TEA5764HN FM radio + RDS Rev. 02 — 9 August 2005 Product data sheet 1. General description The TEA5764HN is a single chip electronically tuned FM stereo radio with Radio Data System RDS and Radio Broadcast Data System (RBDS) demodulator and RDS/RBDS decoder for portable application with fully integrated IF selectivity and demodulation.

an10133

Abstract: capacitor 100nf 16v x7r 10 1005 murata TEA5767/68 Garage Door Opener remote circuit diagrams philips rf manual balanced modulator ic 1496 2.4GHz Cordless Phone circuit diagram A case 10uf (10v) ±20% Chip Tantal TEA5767 working principle scanner block diagram
Contextual Info: Philips RF Manual product & design manual for RF small signal discretes 3rd edition July 2003 APPENDIX / documentation/rf_manual Document number: 4322 252 06385 Date of release: July 2003

Prestigio nobile 150

Abstract: diagram HANNSTAR j mv 4 Prestigio lad1 12vdc msi MOTHERBOARD SERVICE MANUAL LYNX SM 30 diagram HANNSTAR k mv diagram HANNSTAR k mv 4 IC25N040ATMR Insyde bios manual
Contextual Info: PRESTIGIO NOBILE 150 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4

diagram HANNSTAR k mv

Abstract: 8089P diagram HANNSTAR j mv 4 diagram HANNSTAR k mv 4 LF-H41S ALC101 diagram motherboard hannStar K MV USBHUB W83L950 hannstar j mv 1
Contextual Info: SERVICE MANUAL FOR 8089P BY: Ally.Yuan Repair Technology Research Department /EDVD Mar.2004 8089P N/B Maintenance Contents 1. Hardware Engineering Specification ………………………………………………………………………. 4 1.1 Introduction ………………………………………………………………………………………………………………… 4