IC CHIP 7400 Search Results

ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

Abstract: ICODE1 Label ICs wafer map
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors April 2000 I•CODE1 Chip Specification Rev. 2.1 April 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS

ICS30

Abstract: "reset quiet bit" 6C15 ICODE1 Label ICs
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.2 Public Philips Semiconductors January 2005 1 Chip Specification Rev. 2.2 January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1

ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

Abstract: snw-fq-627 6C15
Contextual Info: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors July 2000 Product Specification SL1 ICS31 01 Rev. 1.2 1 Contents 1 CONTENTS 2 2 DEFINITIONS

6C15

Abstract: Icode antenna design str 6707 diagram guide ICODE Coil design guide IBIS wafer map format -250/IBIS wafer map format
Contextual Info: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.3 Public Philips Semiconductors January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4

str 6707 diagram guide

Abstract: ICS30 6C15 UV INK SPECIFICATION
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 I•CODE1 Label IC Chip Specification Product Specification Revision 2.2 Public Philips Semiconductors January 2005 I•CODE1 Chip Specification Rev. 2.2 January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4

data sheet IC 7400

Abstract: pin DIAGRAM OF IC 7400 str 6707 diagram guide ICS30 IC chip 7400 td 1410 "reset quiet bit" IC 7400 data sheet internal circuit diagram of 7400 IC internal diagram of 7400 IC
Contextual Info: INTEGRATED CIRCUITS SL1 ICS30 01 I•CODE1 Label IC Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors 2000-05-02 I•CODE1 Chip Specification Rev. 2.1 May 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4

cosmic

Contextual Info: VCE IC = = 4500 V 150 A ABB HiPakTM IGBT Module 5SNG 0150P450300 Doc. No. 5SYA 1593-02 Nov 10 • Ultra low loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • High insulation package • AlSiC base-plate for high power cycling capability

Contextual Info: VCE IC = = 4500 V 1200 A ABB HiPakTM IGBT Module 5SNA 1200G450300 Doc. No. 5SYA 1401-03 04-2012 Ultra low-loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC Industry standard package High power density AlSiC base-plate for high power cycling capability

Contextual Info: VCE IC = = 4500 V 150 A ABB HiPakTM IGBT Module 5SNG 0150P450300 Doc. No. 5SYA 1593-04 07-2013 • Ultra low loss, rugged SPT+ chip-set  Smooth switching SPT+ chip-set for good EMC  High insulation package  AlSiC base-plate for high power cycling capability

igbt 5SNG

Abstract: IC 7400 configuration 5SNG0150P450300 5SNG 0150P450300
Contextual Info: VCE IC = = 4500 V 150 A ABB HiPakTM IGBT Module 5SNG 0150P450300 Doc. No. 5SYA 1593-02 Sep 09 • Ultra low loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • High insulation package • AlSiC base-plate for high power cycling capability

Contextual Info: VCE IC = = 4500 V 150 A ABB HiPakTM IGBT Module 5SNG 0150P450300 Doc. No. 5SYA 1593-04 07-2013 •    Ultra low loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC High insulation package AlSiC base-plate for high power cycling

Contextual Info: VCE IC = = 4500 V 150 A ABB HiPakTM IGBT Module 5SNG 0150P450300 Doc. No. 5SYA 1593-03 04-2012 Ultra low loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC High insulation package AlSiC base-plate for high power cycling capability AlN substrate for low thermal

5SNA0800J450300

Contextual Info: VCE IC = = 4500 V 800 A ABB HiPakTM IGBT Module 5SNA 0800J450300 Doc. No. 5SYA1402-01 Mar. 12 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

Contextual Info: VCE IC = = 4500 V 650 A ABB HiPakTM IGBT Module 5SNA 0650J450300 Doc. No. 5SYA 1598-02 Jan 09 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

IC 7400 configuration

Abstract: 5SNA1200G450300
Contextual Info: VCE IC = = 4500 V 1200 A ABB HiPakTM IGBT Module 5SNA 1200G450300 Doc. No. 5SYA 1401-01 Mar 09 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

IC 7400 configuration

Contextual Info: VCE IC = = 4500 V 650 A ABB HiPakTM IGBT Module 5SNA 0650J450300 Doc. No. 5SYA 1598-03 Apr 12 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

5SNA0650j450300

Contextual Info: VCE IC = = 4500 V 650 A ABB HiPakTM IGBT Module 5SNA 0650J450300 Doc. No. 5SYA 1598-01 May 08 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

Contextual Info: VCE IC = = 4500 V 1200 A ABB HiPakTM IGBT Module 5SNA 1200G450300 Doc. No. 5SYA 1401-04 01-2014 • Ultra low-loss, rugged SPT+ chip-set  Smooth switching SPT+ chip-set for good EMC  Industry standard package  High power density  AlSiC base-plate for high power

Contextual Info: VCE IC = = 4500 V 800 A ABB HiPakTM IGBT Module 5SNA 0800J450300 Doc. No. 5SYA1402-01 Mar. 12 •     Ultra low-loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC Industry standard package High power density AlSiC base-plate for high power cycling

IC 7400 configuration

Contextual Info: VCE IC = = 4500 V 800 A ABB HiPakTM IGBT Module 5SNA 0800J450300 Doc. No. 5SYA1402-00 July 09 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

5SNA1200G450300

Abstract: 1200G450300 cosmi
Contextual Info: VCE IC = = 4500 V 1200 A ABB HiPakTM IGBT Module 5SNA 1200G450300 PRELIMINARY Doc. No. 5SYA 1401-00 Dec 08 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

5SNA1000G450300

Abstract: cosmi 5SNA 1000G450300
Contextual Info: VCE IC = = 4500 V 1000 A ABB HiPakTM IGBT Module 5SNA 1000G450300 PRELIMINARY Doc. No. 5SYA 1597-00 Oct 07 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

Contextual Info: VCE IC = = 4500 V 650 A ABB HiPakTM IGBT Module 5SNA 0650J450300 PRELIMINARY Doc. No. 5SYA 1598-00 Nov 07 • Ultra low-loss, rugged SPT+ chip-set • Smooth switching SPT+ chip-set for good EMC • Industry standard package • High power density • AlSiC base-plate for high power

5SNA 1200G450300

Contextual Info: VCE IC = = 4500 V 1200 A ABB HiPakTM IGBT Module 5SNA 1200G450300 Doc. No. 5SYA 1401-04 01-2014 •     Ultra low-loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC Industry standard package High power density AlSiC base-plate for high power cycling