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    INTEL PIN GRID ARRAY PPGA Search Results

    INTEL PIN GRID ARRAY PPGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TRS10E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS6E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 6 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS3E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 3 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation

    INTEL PIN GRID ARRAY PPGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    sl5l5

    Abstract: KC80526LY400256 Pentium 3 SL52R FSB 800 PRESCOTT 800 GC80503CS166EXT/SL3B8 SY028 SY016 GC80503CS166EXT KC80526LY400256 SL546 GC80503CSM66166
    Text: Infrastructure Processor Division IA Product Line Overview November 1, 2004 Curt Durrant Copyright 2004 Intel Corporation The Intel logo and Intel are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries.


    Original     		E7520 E7320 E7501 E7501 sl5l5 KC80526LY400256 Pentium 3 SL52R FSB 800 PRESCOTT 800 GC80503CS166EXT/SL3B8 SY028 SY016 GC80503CS166EXT KC80526LY400256 SL546 GC80503CSM66166 PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    uFCBGA 478 pin

    Abstract: Chipsets mpga478 RJ80530VY400256 RK80530RY009256 810E2 RJ80530 FV80524RX366128 celeron 815 RB80526RX566128
    Text: Intel R Celeron(R) Processors for Embedded Computing US Home | Intel Worldwide Where to Buy | Training & Events | Contact Us | About Intel Advanced Hardware Design Products Processors Embedded Components Embedded Intel Architecture Processors Intel® Celeron®


    Original     		478-pin 478-pin 370-pin 440MX 440BX uFCBGA 478 pin Chipsets mpga478 RJ80530VY400256 RK80530RY009256 810E2 RJ80530 FV80524RX366128 celeron 815 RB80526RX566128 PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    FV80524RX366128

    Abstract: RB80526RY850128 RB80526RX566128 celeron 566 celeron 850 FV80524RX300128 FV80524RX433128 FC-PGA 370 intel 440bx intel 810 chipset
    Text: product brief Intel Celeron® Processors for Applied Computing Celeron® Processor Product Highlights Performance • 300, 366, 433, 566, 733, 850 MHz, and 1.2 GHz processor speeds ■ 32K L1 cache 16K code and 16K data ■ 128K integrated L2 cache; 256K for 1.2 GHz


    Original     		440BX 815/E, 810E2 USA/0901/5K/IL11188D FV80524RX366128 RB80526RY850128 RB80526RX566128 celeron 566 celeron 850 FV80524RX300128 FV80524RX433128 FC-PGA 370 intel 440bx intel 810 chipset PDF

    FC-PGA

    Abstract: PC MOTHERBOARD CIRCUIT diagram pentium MOTHERBOARD CIRCUIT diagram pin diagram of pentium III PROCESSOR how to check ic on motherboard 8080 intel microprocessor pin diagram AD1021 SECC material 245264 PGA370
    Text: Intel Pentium® III processor Thermal Metrology for CPUID 068h family processors October 1999 Document Number: 245301-001 Intel® Pentium® III Processor Thermal Metrology for 068x family processors Intel CONFIDENTIAL – Internal Use Only until publication date


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    82371E

    Abstract: FV80524RX366128 intel pentium with mmx 440BX PCIset ppga package 440BX 82371EB 82443BX FV80524RX300128 273229
    Text: Intel Celeron Processor for Embedded Applications PRODUCT HIGHLIGHTS High Performance • Integrated L2 cache 128 Kbytes ■ Dynamic execution technology ■ MMX™ technology ■ 66 MHz multi- transaction system bus with L2 cache interface ■ 16K code and 16K data


    Original     		64-bit 5K/IL0142 82371E FV80524RX366128 intel pentium with mmx 440BX PCIset ppga package 440BX 82371EB 82443BX FV80524RX300128 273229 PDF

    Nidec fan p4 intel

    Abstract: avc fan 12V intel 82380 SB 21150 chips 69000 cherry mobile d15 tv MOTHERBOARD CIRCUIT diagram chips 69030 a74310 AP-388 82801 g SCHEMATIC DIAGRAM
    Text: Intel Applied Computing Solutions Guide For Industrial PC and Transaction Terminal Platforms February 2000 Order Number: 273271-001 THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL,


    Original     		74HCT125 74ALS 74ACT05 74LCT14 Nidec fan p4 intel avc fan 12V intel 82380 SB 21150 chips 69000 cherry mobile d15 tv MOTHERBOARD CIRCUIT diagram chips 69030 a74310 AP-388 82801 g SCHEMATIC DIAGRAM PDF

    P54CS

    Abstract: TT8050366166 P55C TT8050266-133 TT8050266133
    Text: Product Change Notification PCN#: 777 Please contact your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


    Original     		TT8050266133 TT8050366166 SY019/ SL26T P54CS TT8050366166 P55C TT8050266-133 TT8050266133 PDF

    Bulk Decoupling 430TX

    Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
    Text: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)


    Original     		32-Bit 64-Bit 166-MHz Core/66-MHz 266-MHz 16-Kbyte pdf/2000/273209 Bulk Decoupling 430TX Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503 PDF

    242690

    Abstract: celeron pga370 MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD CIRCUIT diagram pga 370 motherboard-mounted celeron 633 celeron 633 128 celeron MOTHERBOARD CIRCUIT diagram FC-PGA 370 intel celeron 633 celeron 466
    Text: Intel Celeron® Processor up to 1.10 GHz Datasheet • ■ ■ ■ ■ ■ ■ Available at 1.10 GHz, 1 GHz, 950 MHz, 900 MHz, 850 MHz, 800 MHz, 766 MHz, 733 MHz, 700 MHz, 667 MHz, 633 MHz, 600 MHz, 566 MHz, 533 MHz, 533A MHz, 500 MHz, 466 MHz, 433 MHz, 400 MHz, 366 MHz, 333 MHz,


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    TL 6921

    Abstract: Motherboard PGA 370 sc242 0665H FC-PGA2 370 0660H
    Text: Intel Celeron® Processor up to 1.10 GHz Datasheet • ■ ■ ■ ■ ■ ■ Available at 1.10 GHz, 1 GHz, 950 MHz, 900 MHz, 850 MHz, 800 MHz, 766 MHz, 733 MHz, 700 MHz, 667 MHz, 633 MHz, 600 MHz, 566 MHz, 533 MHz, 533A MHz, 500 MHz, 466 MHz, 433 MHz, 400 MHz, 366 MHz, 333 MHz,


    Original     		m/support/processors/celeron/sb/cs-007445 com/products/27199 15-Sep-2011 BX8052. TL 6921 Motherboard PGA 370 sc242 0665H FC-PGA2 370 0660H PDF

    intel celeron 633

    Abstract: celeron 667 370 intel celeron 633 128 66 1.7v 440EX
    Text: Intel Celeron® Processor up to 1.10 GHz Datasheet • ■ ■ ■ ■ ■ ■ Available at 1.10 GHz, 1 GHz, 950 MHz, 900 MHz, 850 MHz, 800 MHz, 766 MHz, 733 MHz, 700 MHz, 667 MHz, 633 MHz, 600 MHz, 566 MHz, 533 MHz, 533A MHz, 500 MHz, 466 MHz, 433 MHz, 400 MHz, 366 MHz, 333 MHz,


    Original     		desig366128 FV80524RX366128 128-KB BX80524R366128 FV80524RX333128 FV80524RX300128 BX80524P333128 BX80524R333128 intel celeron 633 celeron 667 370 intel celeron 633 128 66 1.7v 440EX PDF

    socket AM2 pinout

    Abstract: celeron pga370 MOTHERBOARD CIRCUIT diagram PGA370 ap909 schematic diagram of TV memory writer am2 SOCKET PIN LAYOUT P6 MOTHERBOARD SERVICE MANUAL pentium 3 pga370 MOTHERBOARD CIRCUIT diagram BR17 ink cartridge electrical pinout
    Text: Pentium III Processor for the PGA370 Socket at 500 MHz to 1 GHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Available in 1B GHz, 933, 866, 800EB, 733, 667, 600EB, and 533EB MHz for a 133 MHz system bus Available in 900, 850, 800, 750, 700, 650,


    Original     		PGA370 800EB, 600EB, 533EB 133MHz socket AM2 pinout celeron pga370 MOTHERBOARD CIRCUIT diagram PGA370 ap909 schematic diagram of TV memory writer am2 SOCKET PIN LAYOUT P6 MOTHERBOARD SERVICE MANUAL pentium 3 pga370 MOTHERBOARD CIRCUIT diagram BR17 ink cartridge electrical pinout PDF

    processor cross reference

    Abstract: No abstract text available
    Text: MOBI LE PENTI UM P R O C E S S O R WITH MMX T E C H N O L O G Y CONTENTS PAGE PAGE 3.7. Pin Reference Tables.30 1.0. M I C R O P R O C E S S O R A R C H IT E C T U R E O V E R V I E W . 4


    OCR Scan     		243292B processor cross reference PDF

    Pentium MMX 233

    Abstract: 243185
    Text: PENTIUM PROCESSOR WITH MMX TECHNOLOGY 3.0. ELECTRICAL SPECIFICATIONS This section describes the electrical differences between the Pentium processor with MMX technology and the Pentium processor 133/150/166/200, as well as the AC and DC specifications of the Pentium processor with MMX


    OCR Scan     		133/150/166/200-based Pentium MMX 233 243185 PDF