IPC9502 Search Results

PD-68 photodiode

Abstract: COC1465 CPC1465B CPC1465B-TR EIA-481-2 J-STD-020A LH1465AAE P2000AA61 IPC9502
Contextual Info: CPC1465 SHDSL/ISDN DC Termination IC Features Description Bridge rectifier for polarity correction Uses inexpensive opto-coupler for dc signalling Electronic inductor, breakover, and latch circuits Current limiting and excess power protection circuits ANSI SHDSL and ISDN compatible

k1b0

Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Contextual Info: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability

RELAY DE ESTADO SOLIDO

Abstract: reles ESTADO solido diodo potencia optoacoplador hoja de datos de diodo ANTENA transformador manual circuitos integrados circuitos integrados diodo silicio
Contextual Info: Ventajas de los Relés de Estado Sólido respecto a los Relés Electromecánicos AN 145 Hoja de aplicación 1. Introducción Muchos diseños electrónicos pueden aprovechar las mejores prestaciones de los relés de estado sólido SSR, Solid-State Relays en relación con los relés electromecánicos (EMR, Electro-Mechanical Relays) para

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

512 volt 100 current scr

Abstract: AN-100 CPC7583 GR-1089-CORE IPC-9502
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 20 pin or 28 pin SOIC or 28 pin micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

IPC9502

Abstract: SO8 package fairchild FDS7066N3 FDS7066N7 soldering station IPC-9502
Contextual Info: Application Note 7006 June 2004 Guidelines for Using Fairchild's SO-8 FLMP Dennis Lang, Applications Engineer Introduction The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package. The FLMP SO-8 employs

C02CE

Contextual Info: CPC1465 SHDSL/ISDN DC Termination IC Features • • • • • • • • • • Description Bridge rectifier for polarity correction Uses inexpensive opto-coupler for dc signalling Electronic inductor, breakover, and latch circuits Current limiting and excess power protection circuits

clare mercury mercury-wetted contact relay

Abstract: clare mercury-wetted relay mercury wetted relay, double contact clare mercury relay cp clare relay mercury wetted OPTOCOUPLER 4-PIN failure modes REED RELAY clare sodium vapor lamp inrush current optomos relays array clare relay mercury
Contextual Info: Advantages of Solid-State Relays Over Electro-Mechanical Relays Application Note AN-145 1. Introduction Many electronic designs can take advantage of the improved performance of solid-state relays SSRs relative to that of electro-mechanical relays (EMRs)

Line Driver SHDSL

Abstract: shdsl transceiver GlobespanVirata CPC1465D CPC1465DTR LDA101 LH1465AAE P1800SC P2000SC IPC9502
Contextual Info: CPC1465 SHDSL/ISDN DC Termination IC Features Description • Meets wetting sealing current requirements per ITU-T G.991.2 • Integrated bridge rectifier for polarity correction • Uses inexpensive opto-coupler for dc signalling • Electronic inductor, breakover, and latch circuits

AN-100

Abstract: CPC7583 GR-1089-CORE J-STD-020A
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability

Contextual Info: CPC7593 Line Card Access Switch Features • • • • • • • • • • • • • • Description TTL logic level inputs for 3.3V logic interfaces Smart logic for power up / hot plug state control Improved switch dv/dt immunity of 500 V/µs Small 20 pin or 28 pin SOIC or 28 pin

PD-68 photodiode

Abstract: bridge rectifier ic opto coupler 5 lead shdsl transceiver COC1465 CPC1465B CPC1465B-TR EIA-481-2 J-STD-020A LH1465AAE
Contextual Info: CPC1465 SHDSL/ISDN DC Termination IC Features • • • • • • • • • • Description Bridge rectifier for polarity correction Uses inexpensive opto-coupler for dc signalling Electronic inductor, breakover, and latch circuits Current limiting and excess power protection circuits

IPC9502

Abstract: IPC-9502 MLT 22 047 T1-601-1991
Contextual Info: CPC1465 SHDSL/ISDN DC Termination IC Features Description • Meets wetting sealing current requirements per ITU-T G.991.2 • Integrated bridge rectifier for polarity correction • Uses inexpensive opto-coupler for dc signalling • Electronic inductor, breakover, and latch circuits

AN-100

Abstract: CPC7581 GR-1089-CORE J-STD-020A
Contextual Info: CPC7591 Line Card Access Switch Features • • • • • • • • • • • • • • TTL logic level inputs for 3.3V logic interfaces Smart logic for power up / hot plug state control Improved switch dv/dt immunity of 500 V/µs Small 16-pin SOIC or micro-leadframe package

IPC-7525

Abstract: IPC-9502 IPC9502 IPC7525 FDS7066N7 defect analysis to-220 Solder paste stencil life FDS7066N3 J-STD-020B 96SC
Contextual Info: www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild’s SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package,

relais schema

Abstract: clare reed relais CELLULE PV relais ssr schema GRANDE circuit logique electronique pratique Commande moteur Relais relais statique reed relais
Contextual Info: Avantages des relais statiques par rapport aux relais électromécaniques Note d’application AN-145 1. Introduction Cette note d’application détaille les avantages d’un relais statique, dénommé dans ce document SSR Solid State Relay sur un relais électromécanique (EMR, Electro

reedrelais quecksilber

Abstract: CPC1035 relais GSM STROM RELAIS and gatter clare reed relais DA relais CPC7581BA MIT-101 CP Clare CPC7582BA
Contextual Info: Vorteile von Halbleiterrelais SSRs gegenüber elektromechanischen Relais (EMRs) Anwendungs-Note AN-145 1. Einführung Viele elektronische Schaltungen können die Vorteile der besseren Leistung von Halbleiterrelais (solid-state relays = SSRs) gegenüber elektromechanischen Relais

IPC-7525

Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
Contextual Info: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal

IPC-9502

Abstract: ZTX 351 CPC5620
Contextual Info: CPC5620/CPC5621 RMS 3kV Isolation LITELINK III Phone Line Interface IC DAA Features LITELINK III is a single-package silicon phone line interface (PLI) DAA used in voice and data communication applications to make connections between host equipment and telephone networks.

IPC9502

Abstract: IPC-9502
Contextual Info: CPC5620/CPC5621 RMS 3kV Isolation LITELINK III Phone Line Interface IC DAA Features LITELINK III is a single-package silicon phone line interface (PLI) DAA used in voice and data communication applications to make connections between host equipment and telephone networks.