J-LEAD, QFP CERAMIC Search Results

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Contextual Info: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid

IPC-SM-780

Contextual Info: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid

4572 smd 8pin

Abstract: 100 PIN "PGA" ALTERA DIMENSION CMGA17-P100E 02D-00194 altera 24pin dip drawing
Contextual Info: Altera Device Package Outlines March 1995, ver. 5 In tro d u c tio n Data Sheet This data sheet provides package outlines for all Altera devices. Package outlines are listed here in ascending pin count order. Table 1 summarizes the maximum lead coplanarity for Altera J-lead and QFP packages:

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

Contextual Info: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul­ tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.

Contextual Info: SONY CXP87500 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description The CXP87500 is a CMOS 8-bit single chip micro­ computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87532/87540. 100 pin PQFP Ceramic

80386SL

Contextual Info: 1C Test Clips Pomona JEDEC PQFP Test Clips Pomona's JEDEC QFP test clips are designed to fit on surface-mounted plastic and ceramic JEDEC chips. Choose from three clip types designed to give you optimum func­ tionality and ease of use for testing, troubleshooting

84 pin PGA socket

Contextual Info: From: DocuFACTSUn] Ph* 949-253-7438 16038801932 Pomona 8-20-99 ll:59ara p. 4 of 6 Model 5998A 240 Lead QFP Test Clip with PGA, .50 mm Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad

PJ71

Abstract: pj71 data PJ-71 M24-P "FRC"
Contextual Info: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP81900 is a CMOS 8-bit single chip micro­ computer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP81952/81960.

Contextual Info: SONY CXP87500 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP87500 is a CMOS 8-bit single chip micro­ computer ot piggyback/evaluator combined type, which is developed for evaluating the function of the

Contextual Info: SONY CXP81800 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP81800 is a CMOS 8-bit single chip micro­ computer of piggyback/evaluator combined type, which is developed for evaluating the function of the

Contextual Info: SONY CXP81900 CMOS 8-bit Single Chip Microcomputer Description The CXP81900 is a CMOS 8-bit single chip micro­ computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP81952/81960. Piggyback/ evaluator type 100 pin PQFP Ceramic

Philips T5 Fluorescent

Contextual Info: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 80 pin PQFP Ceramic The CXP82900 is a CMOS 8-bit single chip microcomputer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP82940/82948/82952/82960.

Contextual Info: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP87300 is a CMOS 8-bit single chip micro­ computer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87352/87360.

Contextual Info: SONY CXP87800 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description The CXP87800 is a CMOS 8-bit single chip micro­ computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87852/87860. 100 pin PQFP Ceramic

XCS3201FN

Abstract: ATT92020 80386SL MC68HC11A1FU
Contextual Info: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable

Contextual Info: SONY CORP/COMPONENT PRODS 50E Ô3623Ô3 D 0003^72 T CXB1504Q-Y SO NY, Dual D Flip-Flop with Set, Reset and Differential I/O T -9 à .-ò 7 -o $ Description Pin Assignm ent The CXB1504Q-Y is an ultra high speed monolithic ECL IC, which contains two D type Flip-Flops with

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

1310 sony

Contextual Info: SONY CORP/COMPONENT PRODS SOE D 0302303 00030^5 7 • CXB1132Q/Q-Y SO N Y. b - o <? - e>5 ~ 9, 8, Dual 4-bit Universal Shift Register Description Pin Assignm ent The C X B 1 1 3 2 Q is an ultra high speed monolithic Universal Shift Register with variable bit length.