JEDEC JESD51-8 BGA Search Results

WEDPN8M72V-XBX

Abstract: AN0019
Contextual Info: AN0019 White Electronic Designs APPLICATION NOTE PBGA THERMAL RESISTANCE CORRELATION INTRODUCTION CALIBRATION, MEASUREMENTS AND MODELING The thermal resistances for the Plastic Ball Grid Array PBGA Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software

PES16T7

Abstract: PES24N3A 16T4 AN-534 JESD-51 PES12N3A DSA0041007 BGA 23X23
Contextual Info: Thermal Management Requirements and Properties of IDT PCI Express® Switches Application Note AN-534 By Sean Sweeney Notes Introduction An effective thermal management strategy is a critical part of any system design. It is therefore essential that IC vendors provide system designers with pertinent thermal characteristics for their devices. IDT

tn0008

Abstract: mobile ddr2 TN-00-08 micron BGA SDRAM
Contextual Info: TN-00-08: Thermal Applications Introduction Technical Note Thermal Applications Introduction This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. The specified temperatures will help ensure the reliability and

Contextual Info: W7264M32V1-XSBX W7464M32V1-XSBX *ADVANCED 512MB 2 x 64M x 32 / 1GB (4 x 64M x 32) NOR Flash Multi-Chip Package 3V Page Mode Memory FEATURES GENERAL DESCRIPTION  Single power supply operation The W7264M32V1-XSBX device is a 3V single power flash memory and utilizes four chips organized as 67,108,864 words. The

avago application bulletin 73

Abstract: Theta-J 370-PH
Contextual Info: HITCE Glass Ceramic Application Specifications Application Bulletin 106 Introduction Flip-Chip on HITCE High Thermal Coefficient of Expansion is an advanced yet affordable flip-chip packaging solution offering enhanced reliability and electrical performance. This application bulletin provides electrical and thermal performance information

VP10Q

Abstract: vn12 ti SN65HVD12D SN65HVD10 SN65HVD10Q SN65HVD11 SN65HVD11Q SN65HVD12 SN75HVD10 SN75HVD11
Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505F − FEBRUARY 2002 − REVISED NOVEMBER 2003 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

BGA 64 PACKAGE thermal resistance

Abstract: G42-88 G38-87 492-Ball
Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

VP10Q

Abstract: VP11Q vn11 VP12* texas SN75176 SN65HVD10 SN65HVD10Q SN65HVD11 SN65HVD11Q SN65HVD12
Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505F − FEBRUARY 2002 − REVISED NOVEMBER 2003 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

SN65HVD10

Abstract: SN65HVD10QDREP SN65HVD11 SN65HVD12 SN65HVD12IDREP SN75176
Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

Sn75176

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

202 ball bga

Contextual Info: Thermal Management Introduction to Thermal Management Ways to Reduce Junction Temperature Thermal considerations are rarely an issue with lowdensity PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

V10QEP

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10ĆEP SN65HVD11ĆEP SN65HVD12ĆEP www.ti.com SGLS278A − DECEMBER 2004 − REVISED JANUARY 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES D Controlled Baseline D D D D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up to

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

RS485 optical

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,

Contextual Info: SN65HVD10,āSN65HVD10Q,āSN75HVD10 SN65HVD11,āSN65HVD11Q,āSN75HVD11 SN65HVD12,āSN75HVD12 www.ti.com SLLS505G − FEBRUARY 2002 − REVISED APRIL 2005 3.3ĆV RSĆ485 TRANSCEIVERS FEATURES DESCRIPTION D Operates With a 3.3-V Supply The SN65HVD10, SN75HVD10,