JEDEC MO 225 Search Results

mo-047 texas

Abstract: 84XX MO-047 MO-052
Contextual Info: 3M Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment

84XX

Abstract: MO-047 MO-052 TS-2147-02
Contextual Info: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment

84XX

Abstract: MO-047 MO-052 TS-2147-03
Contextual Info: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment

MO-047

Abstract: MO-052 8444-11B1-RK-TP
Contextual Info: 3M Chip Carrier Sockets Low Profile, Four-Row, Through-Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow

MO-047

Abstract: MO-052 8444-11B1-RK-TP 8420-11B1-RK-TP 8452
Contextual Info: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment

Contextual Info: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

VFBGA

Abstract: 52-ball Vfbga package BA 9513
Contextual Info: DOCUMENT CONTROL NO. PD - 2017 REVISION: A DATE: 03/09/05 1 Notes: 1 Controlling dimensions in millimeters 2) Ref: JEDEC MO-225B/BA Pericom Semiconductor Corporation 3545 N. 1st Street, San Jose, CA 95134 1-800-435-2335 • www.pericom.com DESCRIPTION: 52-Ball, Very Thin Profile Fine Pitch Ball Grid Array, VFBGA

VFBGA

Abstract: BSC -23-01n15 45-ball
Contextual Info: 2.00 BSC 3.00 ± 0.10 0.50 BSC 6.00 ± 0.10 5.00 BSC 0.50 BSC 0.50 BSC 1 0.18 MIN 0.60 MIN 1.00 MAX DATE: 05/25/05 Notes: 1 All dimensions are in millimeters 2) Ref JEDEC: MO-225B Ref.) DESCRIPTION: 45-Ball, Very Thin Profile Fine Pitch Ball Grid Array - VFBGA

DDR DIMM pinout micron 184

Contextual Info: 128MB, 256MB x72, ECC , PC3200 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory

MT9VDDT1672A

Abstract: MT9VDDT3272A PC2100 PC2700 DDR DIMM pinout micron 184
Contextual Info: 128MB, 256MB x72, ECC 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory

Contextual Info: 128MB, 256MB x72, ECC , PC3200 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory

Contextual Info: 128MB, 256MB x72, ECC , PC3200A 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A - 128MB MT9VDDT3272A - 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory

JEC 0.1 SO

Abstract: LA 5461 74081
Contextual Info: I 5.550 +.0 O 5 /-.O I0 M B.97 +0 .I3 / - 0 .2 5 • 290 (7.37) 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni).

DDR DIMM pinout micron 184

Abstract: MT9VDDT1672A MT9VDDT1672AG-40B MT9VDDT3272A MT9VDDT3272AG-40B PC3200
Contextual Info: 128MB, 256MB x72, ECC , PC3200 184-Pin DDR SDRAM DIMM DDR SDRAM DIMM MT9VDDT1672A – 128MB MT9VDDT3272A – 256MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin dual in-line memory

Contextual Info: 64MB, 128MB x72, ECC 184-PIN DDR SDRAM DIMM DDR SDRAM DIMM MT5VDDT872A – 64MB MT5VDDT1672A – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin, dual in-line memory

109 RAP

Contextual Info: 64MB, 128MB x72, ECC 184-PIN DDR SDRAM DIMM DDR SDRAM DIMM MT5VDDT872A – 64MB MT5VDDT1672A – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC-standard 184-pin, dual in-line memory

MT46V32M16P

Contextual Info: 128MB, 256MB x72, SR PC3200 184-PIN DDR SDRAM UDIMM DDR SDRAM DIMM MT5VDDT1672A – 128MB MT5VDDT3272A – 256MB For the latest data sheet, please refer to the Micron Web site: www.micron.com/products/modules Features Figure 1: 184-Pin DIMM (MO-206) • JEDEC standard 184-pin, dual in-line memory

Contextual Info: 64MB, 128MB x72, ECC 200-PIN DDR SDRAM SODIMM SMALL-OUTLINE DDR SDRAM DIMM MT5VDDT872H – 64MB MT5VDDT1672H – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 200-Pin SODIMM (MO-224) • JEDEC standard 200-pin, small-outline, dual in-line

DDR SDRAM Component Micron technology

Abstract: MO-224 PC2100 PC2700 mt46v8m16
Contextual Info: 64MB, 128MB x72, ECC 200-PIN DDR SDRAM SODIMM SMALL-OUTLINE DDR SDRAM DIMM MT5VDDT872H – 64MB MT5VDDT1672H – 128MB For the latest data sheet, please refer to the Micronâ Web site: www.micron.com/moduleds Features Figure 1: 200-Pin SODIMM (MO-224) • JEDEC standard 200-pin, small-outline, dual in-line

Contextual Info: I 5.550 + .0 0 5 /-.0 1 0 140.97 + 0 .13/-0.25 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni). 7 . SEE CHART FOR FORK/HOLE PRESENCE AND PLATING OPTION.

Contextual Info: F R E E S C A L E SEMICONDUCTOR, ALL RI GH TS RESERVED. TITLE: INC. MECHANICAL OUTLINE T O —2 7 2 W B , 16 LEAD GULL WING P L A S T IC PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASA10532D REV: F CASE NUMBER: 1329A-04 20 JUN 2007 STANDARD: JEDEC MO-253 BA

Contextual Info: CELESTICA» 16M x 64 EDO BUFFERED DIMM FEATURES • • • • • • • • 168-pin industry standard 8 -byte Dual-in-line memory module JEDEC compliant: 21 -C, Fig. 4-13 A,B,C,D,H Release 5 No. 95 MO-161 CAS, WE, OF and Address lines are buffered High performance, CMOS

BSV20A

Abstract: 10n60m NS1110 BSX84 L51A NS1116 dm-58 550n 2N695 2N725
Contextual Info: SYMBOLS & CODES EXPLAINED S YMBOL S & CODES C O M M O N TO MO RE T H A N ONE T E C H N I C A L SECTI ON LINE No. TYPE No. ▼ — New Type + — Revised Specifications # - Non-JEDEC type manufactured outside u :s .a . t Switching type, also listed in Section 12