JEDEC PIN1 QFN TAPE & REEL Search Results

ATMEL 740

Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
Contextual Info: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

TPS59611

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

TPS59610

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

40spq

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

TI QFN marking

Abstract: TPS59611
Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

CDC857-2

Abstract: CY2SSTV857-32
Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

CDC857-2

Abstract: CY2SSTV857-32
Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

CDC857-2

Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

CDC857-2

Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

JEDEC MO 224

Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
Contextual Info: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps

FMS2016-001

Abstract: FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die
Contextual Info: FMS2016-001 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch High isolation: >30dB at 1.8GHz Low Insertion loss: 0.65dB at 1.8GHz Excellent low control voltage performance

tps5161

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

CDC857-2

Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

PC3200-Compliant

Contextual Info: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32

TSC2020

Contextual Info: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •

TI QFN marking

Contextual Info: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •

Contextual Info: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •

lf24a

Abstract: fs211 CY2544FI CY2544 CY2546
Contextual Info: CY2544 CY2546 PRELIMINARY Quad PLL Programmable Clock Generator with Spread Spectrum Features Benefits • Four fully integrated phase-locked loops PLLs • Input Frequency range: — External crystal: 8 to 48 MHz — External reference: 8 to 166 MHz clock

FMS2016-005-TB

Abstract: FMS2016-005TR FMS2016-005 FMS2016-005-TR FMS2016QFN MIL-HDBK-263
Contextual Info: FMS2016-005 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch NiPdAu finish for Military and High reliability applications High isolation: >30dB at 1.8GHz Excellent low control voltage performance