JEDEC TQFP 10*10 1.0 MM Search Results

TQFP JEDEC tray

Contextual Info: HEAT PROOF 105.0 7 135°C MAX PPE 17.5 A' 15.45 21.00 A TQFP 14x20×1.0 6×12=72 135.9 UNIT : mm 23.5 25.40 17.80 279.4 315.0 322.6 SECTION A – A' Applied Package 100-pin Plastic TQFP (1.0mm thick) 5.62 6.35 7.62 23.5 Quantity (pcs) MAX. 72 Tray Material

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

JEDEC TQFP 10*10 1.0 MM

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

I. C. OSCILLATOR, CLOCK 154 MHz- Qual

Abstract: ICS843S06 A0905-01 G700 JESD22-A118 TQFP-48 JESD22-A104 IN4144 obsolete ic cross reference 155.52MH
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0905-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 15, 2009 7 mm x 7 mm x 1.4 mm TQFP-48 (Green) Date Effective: Contact: Title: Phone #: Fax #:

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

CS-007

Abstract: Amkor Electronics Amkor mold compound
Contextual Info: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld

TQFP 100 pin ic

Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Contextual Info: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink

BGA and QFP Package mounting

Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Contextual Info: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density

ADG732

Abstract: ADG726 S16A S16B design of 16-1 multiplexer SU48 6-PIN s9ad
Contextual Info: a 16-/32-Channel, 4 ⍀ +1.8 V to +5.5 V, ؎2.5 V Analog Multiplexers ADG726/ADG732 FEATURES 1.8 V to 5.5 V Single Supply ؎2.5 V Dual-Supply Operation 4 ⍀ On Resistance 0.5 ⍀ On Resistance Flatness 48-Lead TQFP or 48-Lead 7 mm ؋ 7 mm CSP Packages Rail-to-Rail Operation

Contextual Info: a 16-/32-Channel, 4 ⍀ +1.8 V to +5.5 V, ؎2.5 V Analog Multiplexers ADG726/ADG732 FEATURES 1.8 V to 5.5 V Single Supply ؎2.5 V Dual-Supply Operation 4 ⍀ On Resistance 0.5 ⍀ On Resistance Flatness 48-Lead TQFP or 48-Lead 7 mm ؋ 7 mm CSP Packages Rail-to-Rail Operation

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

JEDEC MS-026 BED

Abstract: footprint jedec MS-026 TQFP 144 100-PIN TQFP XILINX DIMENSION
Contextual Info: H XILIN X XC95144XL High Performance CPLD S e p te m b e r 28, 1 9 9 8 V e rs io n 1.0 Preliminary Product Specification Features Power E stim ation • • • • Power dissipation in CPLDs can vary substantially depend­ ing on the system frequency, design application, and output