JEDEC TRAY DIMENSION Search Results

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

NEC 2701

Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.

2701 NEC

Abstract: nec 2701
Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension

NEC 2701

Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524
Contextual Info: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

nec 2701

Abstract: JEDEC tray dimension 2701 NEC LA-0518A-1 QFP JEDEC tray
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 S C D R Q 41 40 160 1 F G H I J M P K S N S L NOTE ITEM 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm (0.004 inch) of

QFP JEDEC tray

Abstract: MAX. 50 Tray
Contextual Info: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 208 pin QFP 28 x 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end S C D Q 208 1 R 53 52 F G H I J M P K N S S L M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

48-pin TSOP I

Contextual Info: Packing Name JEDEC Tray TSOP I 12x20 48 pin TSOP (I) (12 × 20) detail of lead end 1 48 F G R Q 24 L 25 S E P I A J C S K N S NOTES 1) Controlling dimension 3) "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX. <0.489 inch MAX.>) EIAJ CODE Weight (Reference Value)

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H I S G C D N M J L S K B M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

U 821 B

Abstract: 0020L
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end S T R 1 A∗3 L Q 25 U H N C S J I S G B K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E 1 P 25 A M D M K N C S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

U 821 B

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end U Q L R T 1 25 A∗3 D M S M K C N G S B S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H J I G N C S B L S K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F P E 1 14 A H I G B C N D M S S J L K M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F E 1 14 A D M P M S N C S B K L G I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 detail of lead end F P E 1 22 A H G I S N C D M L S B M K NOTE 1. Controlling dimension J millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E P 1 25 A M D M K C N S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

48-pin TSOP I

Abstract: tray tsop 1220 JEDEC TRAY
Contextual Info: Packing Name JEDEC Tray TSOP I 12x20 48 pin TSOP (I) (12 × 20) detail of lead end 1 48 E S L Q R 24 G 25 F K N M M D S S I B C J A P NOTES 1) Controlling dimension ITEM Millimeter. 2) Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.

S144

Abstract: S144S1-YKC JEDEC FBGA 11
Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 13x13×1.46 144 pin FBGA 13 × 13 A W S B B B 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D P NM L K J HG F E DC B A P Index mark Q W S A J I Y1 S H R S K S E F φM L M G S A B NOTES 1. Controlling dimension millimeter.

transistor r 606 j

Abstract: f 630
Contextual Info: Packing JEDEC Tray Name FBGA 16x16×1.26 224 pin FBGA 16 × 16 A W S B B B 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D V U T R P NM L K J HG F E D C B A P Index mark Q W S A J I R H S K F S L E φM M G S A B NOTES 1. Controlling dimension millimeter.

Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 15x15×1.46 176 pin FBGA 15 × 15 A W S B B B 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D U T RP NM L K J H G F E D C B A P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B NOTES 1. Controlling dimension

b 108 b

Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 11x11×1.46 108 pin FBGA 11 × 11 A W S B B B 12 11 10 9 8 7 6 5 4 3 2 1 A C D M L K J H G F E D C B A P Index mark Q W S A J I Y1 S H R S K S E F φM L M G S A B NOTES 1. Controlling dimension millimeter. 2. Each ball centerline is located within φ 0.08 mm of