JESD201 B Search Results

JESD201

Abstract: JESD 201 whisker JESD 201 class 1A
Contextual Info: Tin Whisker Growth Results on Tin Surface Finished Products Rev. A, 02 May 2007 Whisker growth test methods and conditions per JESD-201 and JEDEC22a121.01. In case of deviation between the two methods, JESD-201 was used. Definitions per JESD-201 and JEDEC22a121.01

Contextual Info: CSM Current Sense MELF Resistor y iabilit logy • Rel y t Techno i l a n via w Qu o t-D Cos Specifications Per • IEC 60115-1, 60115-2 • CECC 40101 CSM • DIN 44061 Features B L • High power handling with superior reliability and stability D • Conformal multi-layer coating against humidity

Contextual Info: EFP - Enhanced Film Power MELF Resistor y iabilit logy • Rel y t Techno i l a n via w Qu o t-D Cos Specifications Per • IEC 60115-1, 60115-2 • CECC 40101 EFP • DIN 44061 Features B L • High power handling D • Superior reliability and stability

JESD201

Abstract: HV10 HV20 HV60 SM20
Contextual Info: KEMET Specialty Ceramic Revision Nil, 23 Apr 2008 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

CDA 194

Contextual Info: KEMET Surface Mount Conductive Polymer - KO CAP Revision E, 15 January 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

60Sn-40Pb

Abstract: T368 T35X MAR 618 transistor T110 T140 T363 Kemet Tantalum code KEMET T368 CASE A T322 SERIES
Contextual Info: KEMET Through-Hole Tantalum Revision C, 12 Mar 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

IDT7134LA55JG

Abstract: Ablestik 2200D ICS433M-65LF MPC94551EF IDT821004JG EME-G600 IDT7202LA50J IDT71321SA55JGI ICS1522MLF IDT71256SA35SOG1
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0705-03 DATE: 20-Sep-2007 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: SOIC and PLCC (Green Package) Refer to Attachment II for the affected part numbers

J-STD-020 MSL Rating

Abstract: mil J-STD-020
Contextual Info: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

Contextual Info: KEMET Surface Mount Ceramic Revision H, 9 June 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

JESD201

Abstract: A700 equivalent A700
Contextual Info: KEMET Surface Mount Aluminum Revision D, 12 March 07 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

JESD22a121

Abstract: JESD201 JESD201 B
Contextual Info: KEMET Surface Mount Ceramic Revision A, 1 Novembert 2011 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer

JESD201

Abstract: 90Sn10Pb kemet CWR29 JESD22a121 CWR29 JESD201 B kemet cwr09 JESD cwr29 capacitor soldering T497
Contextual Info: KEMET Surface Mount Tantalum Revision H, 11 March 2008 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party

kemet CWR29 datasheet

Abstract: JESD22a121 cwr29 capacitor code MCV CWR29 MAR 618 transistor T496 T497 T498 T499
Contextual Info: KEMET Surface Mount Tantalum Revision E, 15 January 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party

50A-5G

Contextual Info: MM Metal Film MELF Resistor y iabilit logy • Rel y t Techno i l a n via w Qu o t-D Cos Specifications Per • IEC 115-1 115-2 • CECC 40101 MM • DIN 44061 Features B L • SMD enabled structure D • Conformal coating against humidity • Excellent solderability termination

JESD22A121

Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Contextual Info: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were

Contextual Info: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the expected operating conditions of the electronics application. With this in mind, ISSI now includes

Contextual Info: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the operating conditions of the electronics application. With this in mind, ISSI recently added synchronous

CRM1076DJ

Abstract: ICS954123BFLF ICS671GI-16LF ICS954148AFLF IDT5V5218PGGI crm 1066c ics633 IDTQS5V993-5QI ics954148af ICS950913CF
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0704-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 4/30/2007 SOIC, TSSOP, SSOP, QSOP, MLF, PDIP

Contextual Info: VS-30CTQ.SHM3, VS-30CTQ.-1HM3 Series www.vishay.com Vishay Semiconductors High Performance Schottky Rectifier, 2 x 15 A D2PAK FEATURES TO-262 • 175 °C TJ operation • Center tap configuration • Very low forward voltage drop • High frequency operation

Contextual Info: VS-20CTQ150SHM3, VS-20CTQ150-1HM3 www.vishay.com Vishay Semiconductors High Performance Schottky Rectifier, 2 x 10 A TO-263AB D2PAK FEATURES TO-262AA • 175 °C TJ operation • Center tap configuration • Low forward voltage drop • High frequency operation

"STMicroelectronics general terms and conditions of Sale"

Abstract: STPS30L120CT W931 STPS30L120 STM date code TO-220 STMicroelectronics to-220 date code STMicroelectronics date code TO-220 STPS20S100CT stps20m100 STTH10LCD06CT
Contextual Info: PRODUCT INFORMATION LETTER PIL APM-DIS/09/5183 Notification Date 12/25/2009 APM - ASD & IPAD Division Rectifiers in TO-220 packages: Electroplated Lead Finishing in Longgang plant. 1/10 PIL APM-DIS/09/5183 - Notification Date 12/25/2009 Production process involved

JESD201

Abstract: SXP3100SX diode A1A.50 SXP3100S
Contextual Info: TS-S08D022B May 2008 10Gb/s XFP Optical Transceiver Module SXP3100SX Multirate, 850nm VCSEL, PIN-PD, RoHS-6, COM Features ‹ Commercial Temperature Range -5 to 70C (COM) ‹ Multi-Speed (9.95 OIF-VSR, 10.5GFC, IEEE802.3ae 10.3Gb/s, 11.1 Gb/s FEC) ‹ Low Power Consumption < 1.25W COM

SXP3100SX-M

Abstract: EIA-455 SXP3100SX ic MIP 391 SXP3101 XFP EVALUATION BOARD PRBS23 SPX3101 SXP3100S Aux monitoring
Contextual Info: TS-S08D022G February, 2010 850nm 10Gb/s XFP Optical Transceiver Modules SXP3100S_ Family SXP3100SX: Multi-rate, Commercial Temperature COM SXP3100SN: 8.5GFC, Commercial Temperature (COM) SXP3100SX-M: Multi-rate, Extended Temperature (EXT) SXP3100SN-M: 8.5GFC, Extended Temperature (EXT)

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL