WHISKER Search Results

Contextual Info: VS-HFA08TB120HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 8 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 2 whisker test 2 • Material categorization:

Contextual Info: VS-HFA25TB60HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 25 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 2 whisker test • Material categorization:

Cu6Sn5

Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are

Contextual Info: 561 Hillgrove Avenue • LaGrange, Illinois • 60525-5997 • U.S.A. Phone: 708 354-1040 • Fax: (708) 354-2820 • http://www.grayhill.com Lead Free Tin Whiskering Study Grayhill DIP Switches May 11, 2004 Revision A 561 Hillgrove Avenue • LaGrange, Illinois • 60525-5997 • U.S.A.

Contextual Info: Tin Whisker Growth Experiment 1. Sample: DO-204 SMA TO-220 RS4M Matte tin (Matte tin) (Bright tin) (Bright tin) 10 Pcs 10 Pcs 10 Pcs 10 Pcs 2. Plating thickness: Typ. 5um 3. Post baking after plating: 150℃ for 1 Hr. 4. Environment condition (Humidity): 85℃ / 85%RH

Contextual Info: www.johansondielectrics.com TIN LEAD PLATED, HIGH CAPACITANCE MLCCS Johanson Dielectrics’ tin lead plated products are offered for high reliability, aerospace, and other applications where tin whiskering is a concern. The plating is tin lead over nickel barrier with 5% minimum lead content. The

in4151

Abstract: IN4150 IN4153 IN4153 diode N4150 1N4150 1N4151 1N4153 IEC134
Contextual Info: • bbSB'm N AUER 202 ooab^oa 1N4150 1N4151 1N4153 hapx PHILIPS/DISCRETE bTE D ULTRA-HIGH-SPEED SILICON DIODES Whiskerless diodes in su b m in ia tu re DO -35 envelopes. T he IN 4 1 5 0 is p rim a rily intended fo r general purpose use in co m p u te r and in d u stria l applications.

Contextual Info: VS-HFA16PB120HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 16 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 1A whisker test • Material categorization:

Contextual Info: VS-HFA50PA60CHN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 2 x 25 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 1A whisker test • Material categorization:

XCKT2106N12

Abstract: ZCE06
Contextual Info: Product Data Sheet XCKT2106N12 Limit Switch , Cat Whisker ZCE06 , Conduit Entrance (0.5" NPT) List Price $78.00 USD Availability Stock Item: This item is normally stocked in our distribution facility. Technical Characteristics Actuation Any Direction Actuator Action

IEC 60947-5-1 limit switch

Abstract: IEC 60947-5-1 XCKP2106N12 60947-5-1 IEC 60947-5-1 schneider EN 60947-5-1 limit switch IEC 60947-5-1 switch DC-13 schneider cat 6 cable schneider fuse class GG
Contextual Info: Product data sheet Characteristics XCKP2106N12 limit switch XCKP - cat's whisker - 1NO+1NC snap - 1/2NPT Range of product OsiSense XC Series name Standard format Product or component type Limit switch Device short name XCKP Sensor design Compact Body type

Infineon diffusion solder

Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Contextual Info: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com

a55z

Contextual Info: SGA-5589 Product Description SGA-5589Z Product Features The matte tin finish on Sirenza’s lead-free package utilizes a post annealing process to mitigate tin whisker formation and is RoHS compliant per EU Directive 2002/95. This package is also manufactured with green molding compounds that contain no antimony trioxide nor halogenated fire retardants.

SGA-5486Z

Abstract: AN-075 SGA-5486 sga5486z SIRENZA MARKING
Contextual Info: SGA-5486 Product Description SGA-5486Z Product Features • Now available in Lead Free, RoHS The matte tin finish on Sirenza’s lead-free package utilizes a post annealing process to mitigate tin whisker formation and is RoHS compliant per EU Directive 2002/95. This

schematic diagram intel atom

Abstract: DE-AC03-76SF00098 schematic diagram atom Cu6Sn5 Acta Materialia
Contextual Info: Acta Materialia 51 2003 6253–6261 www.actamat-journals.com Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction W.J. Choi a,∗ 1, T.Y. Lee a 2, K.N. Tu a, N. Tamura b, R.S. Celestre b, A.A. MacDowell b, Y.Y. Bong c, Luu Nguyen c

Contextual Info: VS-HFA30PB120HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 30 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 1A whisker test • Material categorization: 

Contextual Info: New Product VS-HFA30PB120HN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 30 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 1A whisker test • Material categorization:

ALLOY leadframe C7025

Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,

FeNi42

Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Contextual Info: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.

Contextual Info: 1N4148 1N4446 1N4448 J V HIGH-SPEED SILICON DIODES Whiskerless diodes in subminiature DO-35 envelopes. These diodes are primarily intended for fast logic applications. QUICK REFERENCE DATA Continuous reverse voltage VR max. Repetitive peak reverse voltage

Contextual Info: New Product VS-HFA30TA60CHN3 www.vishay.com Vishay Semiconductors HEXFRED Ultrafast Soft Recovery Diode, 2 x 15 A FEATURES • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • AEC-Q101 qualified, meets JESD 201 class 1A whisker test • Material categorization:

DE-AC03-76SF00098

Abstract: Cu3Sn Cu6Sn5 sncu0.7
Contextual Info: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720

Whisker test data

Abstract: OY Series Composition
Contextual Info: Whisker Test Data OX/OY Series Carbon Composition Resistors Ambient Temp./ Humidity Test condition: • 30°C±2 • 60%RH±3 • 4000hrs Ohmite Mfg. Co. Type Plating Treatment 500 hrs. No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 No.9 No.10 Ave. Max. Min. 1000 hrs. No.1

in4151

Abstract: IN4150 IN4153 diode IN4153 N4150 1N4151 1N4153 1N4150 IEC134 colourcoded diodes
Contextual Info: • bbSB'm 1N4150 1N4151 1N4153 OOEb'îOB 202 H A P X N APIER P HILI PS/D ISCR ETE b^E » ULTRA-HIGH-SPEED SILICON DIODES Whiskerless diodes in su b m in ia tu re DO -35 envelopes. T he IN 4 1 5 0 is p rim a rily intended fo r general purpose use in co m p u te r and in d u stria l applications.