KOVAR Search Results

Contextual Info: MATERIAL DECLARATION SHEET Model # 2036-xx-xxLF Product Line GDT Compliance Date Q1 2005 RoHS Compliant* Yes* see note below No. Construction element Material group MSL 1 Material weight [g] 1 Center electrode Copper Alloy 0.222 2 Lateral electrode Kovar

Contextual Info: GaAs 1C SPDT Switch Reflective DC-18 GHz EBAlpha AS018R2-65 Features • Broadband D C -1 8 GHz 0.388 9.86 mm 0.0 7 0 (1 .7 8 mm) 0.115 (2.92 m m )- ■ Reflective, Short ± 0.002 KOVAR 0.164 (4.16 mm) j ■ 5 Lead Hermetic Package 0.328 (8.33 mm) ■ Capable of Meeting MIL-STD

Contextual Info: r MEAIM TIME BETWEEN FAILURE MTBF CASE II Over the past 25 years, MITEQ has supplied thou­ sands of different models of microwave hybrid ampli­ fiers to the industry. The same amplifier built in a kovar chassis, hermeti­ cally sealed, using commercial parts, but screened in

SM105

Abstract: kovar
Contextual Info: RMSIONS ZONE DESCRIPTION REV DATE APPROMD 0,023/0,027 Au/Ni over Kovar For reference only APPROVAL -M-pulse Y-pulse Microwave Inc. 576 Charcot Ave. San Jose,CA 95131 mpulsemw.com Port No. SM105 SIZE APPROVAL DATE: PACKAGE DWG NO. REV Q.A MANAGER SCALE

Contextual Info: Product content sheet Name: Crystal Units Type: ASV-Series Country of origin： China Structural Substances Part Part Weight Material mg Cover 23.100 mg Kovar Base 94.088 mg Ceramic IC Wire Blank Epoxy Electrode Total 0.840 0.012 2.000 1.800 mg mg mg mg

Contextual Info: MATERIAL CONTENT DATA SHEET Name: Crystal Oscillator Type: ASF1 Series 5032 Country of origin： China Structural Substances Part Part Weight (mg) Cover 9.840 mg Base 41.750 mg Blank Epoxy 1.300 mg 1.000 mg Electrode Total 0.060 mg 53.950 mg Material Kovar

Contextual Info: Micro-D Hermetic Micro-D Hermetic Connectors Solder Mount 177-140H and 177-704H Solder these 177-140 and 704 hermetic Micro-D connectors. Featuring a matched glass-to-metal seal, these socket receptacles are designed for panel mounting. Kovar Shells and Contacts comply with applicable MILDTL-83513 requirements and are 100% intermateable with

Micro-D Hermetic Connectors

Contextual Info: glass-to-metal seal MIL-DTL-83513 Micro-D hermetic connectors for high pressure/low leakage applications M IL-DTL-83513 type Micro-D hermetic connectors feature machined Kovar shells and contacts with moisture resistant plating and paired with high performance contacts that make these connectors an excellent solution

Contextual Info: SILICON PHOTOTRANSISTOR “PILL PACK” 61055 TYPE G S 1020 m u OPTOELECTRONIC PRODUCTS DIVISION GENERAL DESCRIPTION M INIATURE LIGHT S E N S O R FO R HIGH-DENSITY MOUNTING GLASS/CERAMIC/KOVAR H ERM ETIC PACKAGED Mii 61055 is an N-P-N Planar Silicon Transistor in a package designed to be mounted in a double­

Contextual Info: GaAs 1C SPDT Switch Reflective DC-18 GHz ESAlpha AS018R2-65 Features •65 ■ Broadband D C -18 GHz 0 .3 8 8 9 .8 6 m m 0 0 .0 7 0 (1 .7 8 m m 0 .1 1 5 (2 .9 2 m m ) ■ Reflective, Short ± 0.002 ■ 5 Lead Hermetic Package in IS^$ KOVAR 0 .1 6 4 (4 .1 6 m m ) {

Contextual Info: CAD DCN GENERATED CONTROLLED DRAWING DOCUMENT PRODUCT DATA DRAWING DWG.NO. 2975-6200 ENG. FILE COPY MATERIAL: BODY: STAINLESS STEEL PER AMS-5640, UNS S30300, TYPE I. CONTACT : BERYLLIUM COPPER PER ASTM-B-196, ALLOY Cl7300, COND. TD04. PIN: KOVAR PER ASTM-F15-61P.

Contextual Info: Micro-D Hermetic Micro-D Hermetic Connectors Solder Mount 177-140H and 177-704H Solder these 177-140 and 704 hermetic Micro-D connectors. Featuring a matched glass-to-metal seal, these socket receptacles are designed for panel mounting. Kovar Shells and Contacts comply with applicable MILDTL-83513 requirements and are 100% intermateable with

MIL-DTL-83513

Contextual Info: MIL-DTL-83513 Type Connectors 177-705H and 177-706H MIL-DTL-83513 Type Micro-D Hermetic Connectors Rear Panel Mount with O-Ring Fluorosilicone O-Ring eliminates the cost of soldering the connector to a bulkhead. Kovar Shells and Contacts comply with applicable MILDTL-83513 requirements and are 100% intermateable

Contextual Info: Micro-D Hermetic Connectors Rear Panel Mount With O-Ring 177-705H and 177-706H Flourosilicone O-Ring eliminates the cost of soldering or welding the connector to a bulkhead. Kovar Shells and Contacts comply with applicable MILDTL-83513 requirements and are 100% intermateable

Contextual Info: Semiconductor Laser LNC803PS High Power Output Semiconductor Laser ø5.6 +0 –0.025 ø4.3±0.1 ø3.55±0.1 Overview LD 110˚±1˚ 0.4±0.1 ø1.0 min. 2.3±0.2 1.27 0.25 Reference slot Kovar glass LD pellet 1.2±0.1 Stable single horizontal mode oscillation

Contextual Info: Semiconductor Laser LNC801PS High Power Output Semiconductor Laser ø5.6 +0 –0.025 ø4.3±0.1 ø3.55±0.1 Overview LD 110˚±1˚ 0.4±0.1 ø1.0 min. 2.3±0.2 1.27 0.25 Reference slot Kovar glass LD pellet 1.2±0.1 Stable single horizontal mode oscillation

G7 diode

Contextual Info: v01.1006 G7 – 7 LEAD GLASS/METAL HERMETIC SMT PACKAGE PACKAGE OUTLINES G7 Package Outline Drawing NOTES: 1. PACKAGE MATERIAL: WHITE ALUMINA 92%. 2. CONDUCTOR TRACES MATERIAL: THICK FILM TUNGSTEN. 3. LEAD, BASE, COVER MATERIAL: KOVAR . 4. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN.,

ceramic package

Abstract: LH250
Contextual Info: v00.1206 LH250 – CERAMIC HERMETIC SMT PACKAGE PACKAGE OUTLINES LH250 Package Outline Drawing NOTES: 1. PACKAGE MATERIAL: CERAMIC & KOVAR. 2. LEAD AND GROUND PADDLE PLATE: GOLD 40 - 80 MICROINCHES. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IN NON-CUMULATIVE.

Corning 7052

Abstract: 7052 glass 7052 g16 smt hermetic packages PCB land
Contextual Info: v00.0902 G16 – 16 LEAD GLASS/METAL HERMETIC SMT PACKAGE PACKAGE OUTLINES G16 Package Outline Drawing NOTES: 1. PACKAGE MATERIAL: ALUMINA LOADED BOROSILICATE GLASS. 2. LEAD, BASE, COVER MATERIAL: KOVAR #7052 CORNING . 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN.,

tensolite

Abstract: 231CCSF
Contextual Info: v00.0406 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER

tensolite

Abstract: C4 Package
Contextual Info: v00.0206 C-4 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-4 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Contextual Info: v00.0206 C-5 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-5 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

kovar

Abstract: tensolite
Contextual Info: v00.0406 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

RF threshold detector

Contextual Info: BUILT-IN TEST DETECTOR AMPLIFIERS ABIT SERIES FEATURES • External threshold control via voltage divider or external power supply • Independent TTL output • Up to 1/2 watt CW power output • Hermetically sealed Kovar chassis capable of meeting rigorous military environments