L22V10G Search Results

Contextual Info: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest

22V10G-7

Contextual Info: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages w ith addi­ tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous

22V10G

Contextual Info: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest

Contextual Info: L22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­