LCC 18 PIN PACKAGE Search Results

QFJ018-P-R285-4

Contextual Info: PLASTIC LEADED CHIP CARRIER 18 PIN PLASTIC LCC-18P-M04 EIAJ code : ∗QFJ018-P-R285-4 Lead pitch 50mil Package width x package length 285 × 490mil Lead shape J bend Sealing method Plastic mold 18-pin plastic QFJ PLCC (LCC-18P-M04) 18-pin plastic QFJ (PLCC)

LCC 18 Pin Package

Abstract: QFJ018-P-R285-3
Contextual Info: PLASTIC LEADED CHIP CARRIER 18 PIN PLASTIC LCC-18P-M03 EIAJ code : ∗QFJ018-P-R285-3 Lead pitch 50mil Package width x package length 285 × 425mil Lead shape J bend Sealing method Plastic mold 18-pin plastic QFJ PLCC (LCC-18P-M03) 18-pin plastic QFJ (PLCC)

LCC 18 Pin Package

Abstract: 26PIN 26-PIN MB81C466-10 20-PIN
Contextual Info: Section 2 CMOS DRAMs — At a Glance Maximum Acc««« Tlm« n« Capacity Package Option« 262144 bits (262144wx 1b) 16-pin 18-pin Plastic Plastic DIP LCC 262144 bits (65536w x 4b) 18-pin 18-pin 20-pin 18-pin 18-pin 20-pin 26-pin Plastic Ceramic Plastic Plastic

Contextual Info: 2N3700HR Hi-Rel 80 V, 1 A NPN transistor Datasheet - production data Features BVCEO 80 V IC max 1A HFE at 10 V - 150 mA >100 1 2 3 3 3 TO-18 4 1 1 2 2 LCC-3 LCC-3UB Pin 4 in LCC-3UB is connected to the metallic lid Figure 1. Internal schematic diagram • Hermetic packages

LCC 18 Pin Package

Abstract: QFJ018-P-R285-3 18pin Plastic QFJ LCC 16 Pin Package
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index LCC-18P-M03 EIAJ code :∗QFJ018-P-R285-3 18-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 285 × 425 mil Lead shape

QFJ018-P-R285-4

Abstract: LCC 18 Pin Package
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index LCC-18P-M04 EIAJ code :∗QFJ018-P-R285-4 18-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 285 × 490 mil Lead shape

SOC2222A

Abstract: 520100204 15mAIB 520100205R SOC2222ARHRT JANS2N2222AUB 2N2222A marking code 2N2222A* LCC SOC2222ARHRG 2N2222A st marking
Contextual Info: 2N2222AHR Hi-Rel 40 V, 0.8 A NPN transistor Datasheet - production data Features Parameter ESCC JANS BVCEO min 40 V 50 V 1 2 3 IC max 0.8 A hFE at 10 V - 150 mA 100 TO-18 3 3 4 1 1 2 • Hermetic packages 2 LCC-3 LCC-3UB • ESCC and JANS qualified Pin 4 in LCC-3UB is connected to the metallic lid.

520100204R

Abstract: SOC2222ARHRT JANS2N2222AUB JANSR2N2222AUB JS2222 J2N2222A JANS2N2222AUBT JANSR2N2222AUBT 520100212R 520100204
Contextual Info: 2N2222AHR Hi-Rel 40 V, 0.8 A NPN transistor Datasheet — production data Features Parameter BVCEO min ESCC 1 JANS 40 V 2 3 50 V IC max 0.8 A hFE at 10 V - 150 mA 100 TO-18 3 3 4 1 1 2 2 • Hermetic packages LCC-3UB LCC-3 • ESCC and JANS qualified Pin 4 in LCC-3UB is connected to the metallic lid.

"18-Pin LCC"

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-18 JEDEC OUTLINE
Contextual Info: 18 Pin LCC 18 PIN CERAMIC LEADLESS CHIP CARRIER INCHES E SYMBOL R1 D R D1 NOTES 0.092 0.112 2.34 2.84 - b 0.020 0.030 0.51 0.76 - D 0.275 0.295 6.99 7.49 - D1 0.175 0.215 4.45 5.46 - D2 0.070 0.080 1.78 2.03 - E 0.340 0.360 8.64 9.14 - E1 0.240 0.280 6.10

Contextual Info: ASÎÿ Aì 's‘f h •f 'p o p ‘ Si DRAM srvr . ' ' Ö83C , 1 * »RAM 256K X 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES m |U 2 18 17 *A8 16 Q 4 15 A6 NC AZ 7

520100204

Contextual Info: 2N2222AHR Hi-Rel 40 V, 0.8 A NPN transistor Datasheet - production data Features Parameter ESCC JANS BVCEO min 40 V 50 V 1 2 3 TO-18 3 IC max 0.8 A hFE at 10 V - 150 mA 100 3 4 1 1 2 • Hermetic packages 2 LCC-3 UB • ESCC and JANS qualified Pin 4 in LCC-3UB is connected to the metallic lid.

J2N2222

Abstract: soc2222
Contextual Info: 2N2222AHR Hi-Rel 40 V, 0.8 A NPN transistor Datasheet - production data Features Parameter ESCC JANS BVCEO min 40 V 50 V 1 2 3 TO-18 3 IC max 0.8 A hFE at 10 V - 150 mA 100 3 4 1 1 2 • Hermetic packages 2 LCC-3 UB • ESCC and JANS qualified Pin 4 in LCC-3UB is connected to the metallic lid.

MT4C1259

Contextual Info: MT4C1259 883C 256K x 1 DRAM AUSTIN SEMICONDUCTOR, INC. DRAM 256K x 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) 2 /W/E /R/A/S NC AD AZ MARKING • Timing 100ns access 120ns access

Contextual Info: AS4C1259 883C 256K X 1 DRAM AUSTIN SEM IC O N D U C TO R , INC. « p DRAM 256K x 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES • Industry standard pinout and timing

smd T4C

Abstract: mt4c1004
Contextual Info: DRAM 4 MEG X 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-90622 • MIL-STD-883 18-Pin DIP FEATURES OPTIONS Packages C eram ic DIP (300 m il) C eram ic DIP (400 mil) C eram ic LCC C eram ic SOJ C eram ic ZIP

Contextual Info: A S D MT4C1259 883C 256K X 1 DRAM AUSTIN SEMICONDUCTOR, INC. D R A M 2 5 6 K X 1 D R A M FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES • Industry standard pinout and timing

AS4C1259

Abstract: ba816 CSR1010
Contextual Info: ASÍ? AUSTIN SEMICONDUCTOR, INC. 2? 9J ? ? Í : 256K X 1 DRAM 256K DRAM 1 DRAM X FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES • Industry standard pinout and timing • All inputs, outputs and clocks are fully TTL

Contextual Info: a 28-Leadless LCC Package E-28A Dimensions shown in inches and (mm) 0.100 (2.54)1 0.064 (1.63) 0.055 (1.40) 0.045 (1.14) 0.075 (1.91) REF 26 25 18 19 0.458 (11.63) 0.442 (11.23) SQ 28 0.050 ±0.005 (1.27 ±0.13) 0.028 (0.71) 0.022 (0.56) 1 NO 1 PIN INDEX

Contextual Info: SCOPE: CMOS, 12-Bit Multiplying D/A Converter Device Type: -01 -02 Generic Number: MX7541S x /883B MX7541T(x)/883B Case Outline(s). Outline Letter Q E Mil-Std-1835 GDIP1-T18 or CDIP2-T18 CQCC1-N20 Case Outline Package Code 18 Lead CERDIP J18 20-Pin Ceramic LCC L20

Contextual Info: SCOPE: CMOS, 12-Bit Multiplying D/A Converter Device Type: -01 -02 Generic Number: MX7541S x /883B MX7541T(x)/883B Case Outline(s). Outline Letter Q E Mil-Std-1835 GDIP1-T18 or CDIP2-T18 CQCC1-N20 Case Outline Package Code 18 Lead CERDIP J18 20-Pin Ceramic LCC L20

Contextual Info: ASÍ} AUSTIN SEMICONDUCTOR, INC. A¿ í£ 1259 3íí 256K X 1 DRAM 256K X 1 DRAM DRAM FAST PAG E MODE AVAILABLE AS M ILITARY SPE C IFIC A TIO N S PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES • Industry standard pinout and timing

Contextual Info: FU JITSU MOS Memories • MB85204-10, MB85204-12, MB85204-15 262,144 X 4-Bit Dynamic Random Access Memory SIP Module Description The Fujitsu MB85204 is a fully decoded, 262,144 word x 4-bit NMOS dynamic random access memory module consisting of four MB81256 DRAMs in 18-pad LCC packages mounted on a 24-pin

TL 1838

Abstract: Neutron sensitive PIN diode
Contextual Info: H A R R IS S E M I C O N D U C T O R FRX234D, FRX234R FRj 234H Radiation Hardened N-Channel Power MOSFETs June 1994 Package Features • 2.5A, 250V, RDS(on) = 0.7000 LCC 18 PIN • Second Generation Rad Hard MOSFET Results From New Design Concepts • Gamma

Contextual Info: 2N3700HR Hi-Rel 80 V, 1 A NPN transistor Datasheet - production data Features BVCEO 80 V IC max 1A HFE at 10 V - 150 mA >100 1 2 3 3 3 TO-18 4 1 1 2 2 LCC-3 UB Pin 4 in UB is connected to the metallic lid Figure 1. Internal schematic diagram • Hermetic packages