LFBGA340 Search Results

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA340 package SOT913-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA340: plastic low profile fine-pitch ball grid array package; 340 balls; body 12 x 12 x 1 mm D SOT913-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e ball A1

BGB210S

Abstract: CHINA tv kit service code T3G7210 a1208 T7210 PCF50 TFBGA105 PNX5225 TD-SCDMA PCF50626
Contextual Info: Complete solution for TD-HSDPA/EDGE with dual-mode automatic handover T3G7210 - T7210 best-in-class system solution for feature phones and modems The T3G7210 dual-mode TD-HSDPA/EDGE solution brings 3G functionality to the China market. It is a state-of-the-art

PNX5225

Abstract: T7211 CHINA tv kit service code T7210 3G HSDPA TD60291 PCF50626 GNS7560 ARM926EJ bluetooth encoder h.264
Contextual Info: Complete solution for TD-HSDPA/EDGE with dual-mode automatic handover T7210/T7211 best-in-class system solution for feature phones and modems The T7210 / T7211 dual-mode TD-HSDPA/EDGE solution brings 3G functionality to the China market. It is a state-ofthe-art design that offers best-in-class multimedia