LFBGA516 Search Results

LFBGA-516

Contextual Info: Package outline LFBGA516: plastic low profile fine-pitch ball grid array package; 516 balls; body 14 x 14 x 1.2 mm B D SOT965-1 A ball A1 index area E A A2 A1 detail X e1 e AF AD AB Y V M C C A B C y y1 C AE AA e W U T R e2 N M L K F M AC P H ∅v ∅w b 1/2 e

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA516 package SOT965-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

PNX5221

Abstract: LFBGA516 LFBGA-516 voice record to SD card ARM9 processor ARM926 ARM926EJ arm9 architecture block diagram of MP3 player with video block diagram of speech to text converter
Contextual Info: High-speed mobile multimedia Philips Nexperia cellular multimedia baseband PNX5221 for GSM/GPRS/EDGE/UMTS This highly integrated baseband controller for GSM, GPRS, EDGE, and UMTS handsets forms the basis of Philips’ Nexperia cellular system solutions and lets manufacturers

TLF35584

Abstract: TLE9180 Infineon TLE9180 TC297 TC27x TLE8758 TC23x TC299 TC297 aurix TC298
Contextual Info: Highly Integrated and Performance Optimized 32-bit Microcontrollers for Automotive and Industrial Applications www.infineon.com/TriCore Content 2 TriCore Family Concept 3 Evolution of TriCore™ Generations 4 TriCore™ Based Product Roadmap 5 PRO-SIL™ Safety Concept

TLF35584

Abstract: TC27x TLE9180 TC275T AURIX TC277T TC29x TLE8000 Tc264 BGT24ATR12
Contextual Info: Highly Integrated and Performance Optimized 32-bit Microcontrollers for Automotive and Industrial Applications www.infineon.com/TriCore 2 Contents TriCore Family Concept 04 TriCore™ Based Product Roadmap 06 PRO-SIL™ Safety Concept 07 TriCore™ for Powertrain Applications