LFBGA64 Search Results

LFBGA64

Abstract: sot744
Contextual Info: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E

LFBGA64

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C

LFBGA64

Contextual Info: PDF: 2003 Feb 05 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e H e G F

LFBGA64

Abstract: sot686
Contextual Info: PDF: 2002 Mar 11 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm D SOT686-1 A B ball A1 index area A A2 E A1 detail X e1 C e 1/2 e y y1 C ∅v M C A B b ∅w M C K J e H

sot534

Contextual Info: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm SOT534-1 D ball A1 index area A2 A E A1 detail X A ∅w M b y v A ZD e ZE H G F e E D C B A 1 2 3 4 5 6

Contextual Info: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm D SOT686-1 A B ball A1 index area A A2 E A1 detail X e1 C e 1/2 e y y1 C ∅v M C A B b ∅w M C K J e H G F e2 E D 1/2 e C B A ball A1 index area

Contextual Info: JEITA Package Code P-LFBGA64-7x7-0.80 RENESAS Code PLBG0064GA-A w S B D Previous Code 64FHE w S A MASS[Typ.] 0.1g A b A1 S AB ZD e A e H G F B E E D C A ZE y S B 1 x4 v 2 3 4 5 6 7 8 Index mark Laser mark S Index mark Reference Symbol D E v w A A1 e b x

circuit of smart hearing aid

Abstract: ir photodiode amplifier rs232 RCore DSP Architecture highpass rf filter WOLA reference wola 0X4010
Contextual Info: BELASIGNA 250 High-Performance Programmable Audio Processing System Introduction BELASIGNA 250 is a complete programmable audio processing system, designed specifically for ultra−low−power embedded and portable digital audio systems. This high−performance chip builds on

ST70150

Abstract: LBGA288 LFBGA64 ST70136 TQFP64 T1.413 ADSL WT-062
Contextual Info: prom2 9-09-2002 12:40 Pagina 1 PROMETHEUS ADSL Residential Gateway Complete reference design bridges from ADSL to residential LANs ST70150 l Support digital signal processing equipments for one ADSL CPE channel ITU-R l Compliant with ITU 992.1 (ADSL full rate) annex A (ADSL

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

W29GL256P

Abstract: W29GL256
Contextual Info: W29GL256P 256M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE W29GL256P Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1 FEATURES . 1

Contextual Info: Ordering number : ENA1539A LC70310KBG CMOS LSI Noise Canseller IC http://onsemi.com Overview The LC70310KBG is a noise-cancellation IC that uses an original digital signal processor DSP designed for audio applications as the core and integrates the serial PCM interface and host CPU interface on a single chip. In addition,

xr20m1172il32-f

Abstract: HVQFN32 Sc2698 SC16C654BIBM,128 SCC2681AC1A44 SC16C752B SCC2691AC1A28 SC28L198
Contextual Info: High-speed UARTs and Bridge ICs Advanced serial-interface solutions NXP UART applications Fastest baud rate: 20 Mbps SC16C85xS } General Interface U  ART controller is part of the serial data communication of a system. A UART is used to convert parallel data to serial data, and from serial

64-pin BGA thermal resistance

Abstract: arm Str711f TQFP144 TQFP64 ISO7816-3 LFBGA144 LFBGA64 STR710F AN1781 diode p115
Contextual Info: STR71xF ARM7TDMI 16/32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES PRELIMINARY DATA • ■ ■ ■ ■ Memories – Up to 256+16 Kbytes Flash memory 100,000 cycles endurance, 20 yrs retention – Up to 64 Kbytes RAM – External Memory Interface (EMI) for up to 4

dla001

Abstract: STA013B FC12 B2H18
Contextual Info: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,

V18 marking

Abstract: 106 16K 736 STR710 0x64FF
Contextual Info: STR71xF ARM7TDMI 32-bit MCU with Flash, USB, CAN 5 timers, ADC, 10 communications interfaces • Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash ■ Memories – Up to 256Kbytes Flash program memory 10 kcycles endurance, 20 yrs retention @

W29GL064C

Contextual Info: W29GL064C 64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: October 18, 2011 Preliminary - Revision E BLANK W29GL064C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1

LFBGA64

Abstract: STA015 STA015B STA015T TQFP44
Contextual Info: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC

dla001

Abstract: LFBGA64 STA015 STA015B STA015T TQFP44 STA013 AN-1250 D98AU904
Contextual Info:  STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY PRODUCT PREVIEW SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC

TSB41AB2E

Contextual Info: INTEGRATED CIRCUITS PDI1394P23 2-port/1-port 400 Mbps physical layer interface Preliminary data Philips Semiconductors 2001 Jul 18 Philips Semiconductors Preliminary data 2-port/1-port 400 Mbps physical layer interface 1.0 FEATURES • Fully supports provisions of IEEE 1394–1995 Standard for high

W25R128FV

Abstract: W25Q128JV W25R128F W25Q128FV W25Q128F USON-8 W25Q80DL W978H6KB W25Q80BVSSIG
Contextual Info: 2014 PRODUCT SELECTION GUIDE Mobile DRAM Specialty DRAM Code Storage Flash Memory Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing

mlt 22

Abstract: star delta starter single line drawing LQFP144 "7 segment display" 3102 STR712FR2H6 ISO7816-3 LFBGA144 LFBGA64 LQFP64 STR710
Contextual Info: STR71xF ARM7TDMI 32-bit MCU with Flash, USB, CAN 5 timers, ADC, 10 communications interfaces Features • ■ ■ ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory

simple srs wow schematic

Abstract: schematic diagram DVI to rca DB25 LPT dvi dual link schematic AN1250 G723 LFBGA64 STA015 TQFP44 STA013
Contextual Info: AN1250 APPLICATION NOTE STA014/STA015 MPEG LAYER III DECODER AND ADPCM CODEC by Marco Veneri 1. INTRODUCTION The STA015 device is an MPEG Layer III audio decoder with ADPCM compression / decompression capabilities and BYPASS mode for auxiliary audio sources post-processing