LFBGA144 Search Results

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-1 ball A1 index area E A A2 A1 detail X e1 e C C A B C Æv Æw b 1/2 e y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b y ∅w M C N M L K e J H e2 G F E D C B A ball A1 index area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA144 package SOT644-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot512

Abstract: LFBGA-144
Contextual Info: PDF: 1999 Jun 09 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 10 x 10 x 1.05 mm SOT512-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A M ZE L K J H e G F E D C B A

Contextual Info: P-LFBGA144-1313-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.3 TYP. 1/Aug.25,1999

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-2 ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b 1/2 e C C A B C y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8

LQFP64 reel size

Abstract: STA2058 STA5620 LFBGA144 teseo teseo 2 data output LQFP64 STA2058EX timer2 A2F4
Contextual Info: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor

Contextual Info: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.30 TYP. 1/Aug. 25, 1999

LFBGA144

Abstract: MO-205 sot644
Contextual Info: PDF: 2000 Oct 17 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.90 mm SOT644-1 B D A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A N M L e K J

Contextual Info: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor

LFBGA144

Abstract: MO-205
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b y1 C y ∅w M C N M L K e

Contextual Info: P-LFBGA144-1313-0.80 Mirror finish Package material Ball material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb Solder plating( 5 m) 0.40 TYP. 1/Jun.23,1998

Contextual Info: P-LFBGA144-1111-0.80 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.30 TYP. 1 版/99.8.25

Contextual Info: P-LFBGA144-1313-0.80 Mirror finish 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.40 TYP. 1/Jun. 23, 1998

AT91SAM3U4

Abstract: at91sam3 1N1308 MAR 735 REGULATOR IC 7912 pin identify AT91SAM3U4E SAM3u1 AT91SAM3U 3961 G.E 0x20180
Contextual Info: Features • Core • • • • • • – ARM Cortex®-M3 revision 2.0 running at up to 96 MHz – Memory Protection Unit MPU – Thumb®-2 instruction set Memories – From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,

STM32W108

Abstract: stm32f103 DAC STM8L151 PROGRAMMER FOR STM32F103 stm32f107 stm32f103 spi stm32f105 STM32 PWM output developer kit ST10F273 programmer schematic STM32-PRIMER2
Contextual Info: 62 7x 10 M32 M8 R7 R9 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STM32 STM8 STR7 STR9 Family STM32 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins

STM32F103xC

Abstract: STM32F103xC ADC1 CF 4093 N STM32F103xC boot STM32F103Rx STM32F103xE STM32F103xx STM32F103VC g717 stm32f103ve
Contextual Info: STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features FBGA • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

arm stm32 f103

Abstract: stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144
Contextual Info: STM32F103xF STM32F103xG XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Preliminary data Features FBGA • Core: ARM 32-bit Cortex -M3 CPU with MPU – 72 MHz maximum frequency,

Contextual Info: STR71xFxx STR710RZ ARM7TDMI 32-bit MCU with Flash, USB, CAN, 5 timers, ADC, 10 communication interfaces Features • ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory

STM32F20xxx reference manual

Contextual Info: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M3 CPU 120 MHz max with Adaptive real-time accelerator (ART

STM32F103VC

Abstract: STM32F103RC STM32F103xE STM32F10* I2C errata 548-72 STM32F103ZD USART STM32F101RC STM32F101RD stm32f103ve errata
Contextual Info: STM32F101xC/D/E and STM32F103xC/D/E Errata sheet STM32F101xC/D/E and STM32F103xC/D/E high-density device limitations Silicon identification This errata sheet applies to the revisions Z and Y of the STMicroelectronics STM32F101xC/D/E access line and STM32F103xC/D/E performance line high-density

ARM7TDMI System Peripherals

Abstract: program key lock ic 4013 154WA SAM7SE512 at91sam7sexx
Contextual Info: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – EmbeddedICE In-circuit Emulation, Debug Communication Channel Support