LQP31A Search Results

LQP21A

Abstract: LQP31A Murata LQP21A 8j04
Contextual Info: SURFACE MOUNT INDUCTORS LQP21A/31 Series The LQP21A/LQP31A series com prises chip coils with a tight inductance tolerance, ±2%, achieved in a small chip area. Murata achieves this by forming the coil with precision film technology. This coil is excellent in the high-frequency circuits of radio

LQS33N

Abstract: LQN2A JIS C 0806
Contextual Info: SURFACE MOUNT INDUCTORS PACKAGING 8c STORAGE Packaging Units L W T Reflow Taping W idth Appearance Flow Product Na m e 2.0 1.25 0.9 1.25 O O 8 4,000 — 1,000 3.2 1.6 1.8 O o 8 2,000 — — LQH3N/3C 3.2 2.5 2.0 o o 8 2,000 — — LQH N 4N 4.5 3.2 2.6 o

Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS u P C 8 1 1 9 T , u P C 8 1 2 0 T VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE DESCRIPTION The ^¡PC8119T and ^¡PC8120T are silicon monolithic integrated circuits designed as variable gain amplifier. Due to

Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS

tzbx4n100bc110

Abstract: MA2810-1 tz03p450fr LQH3NR27M92 kf 470 replacements transistors RPE110COG2R2C100V LQH3N220K04 DE1410E 1022R DE7100F222MVA1-KC
Contextual Info: DESIGN ENGINEERING KITS ★ KIT-GRM39 CAPACITORS— CHIB M O N O LITH IC • ■ ■ ■ ■ ■ muFfntn Part No. Miniature size Wide capacitance, TC, voltage and tolerance range Industry standard sizes 8mm and 12mm tape and reel for auto-placements Barrier layer termination systems for wave, reflow or vapor phase solder

LDC33

Contextual Info: CIRCUIT MODULE H ybrid 1C C O M P O N E N T S F O R M O U N T IN G O N H Y B R ID IC ’S: FEATURES A h ig h ly fu n c tio n a l a n d in te g ra te d c irc u it c a n be re a liz e d by in te g ra tin g v a rio u s c h ip c o m p o n e n ts and s e m ic o n d u c to rs on o n e s u b s tra te . M u ra ta E le c tro n ic s

LQN2A

Abstract: 75156 PLL 2400 MHZ PC8109T
Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8106T, µPC8109T 2.0 GHz UPCONVERTER ICs FOR CELLULAR AND CORDLESS TELEPHONES The µPC8106T and µPC8109T are silicon monolithic integrated circuits designed as upconverter series for the transmission stage of cellular and cordless telephones. Due to operation on 3 V and mini-mold package, these

LQG21

Abstract: LQN2A LQP21 coil LQP21A LQS33N LQS33 lqp21
Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD RECOMMENDED SOLDERING CONDITIONS 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N, LQM32C, LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other

ipc8109

Abstract: IPC8109T
Contextual Info: PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCU ITS /¿P C 8 1 0 6 T , /IP C 8 1 0 9 T 1.9 GHz UPCONVERTER ICs FOR CELLULAR AND CORDLESS TELEPHONES The juPC8106T and /iPC8109T are silicon monolithic integrated circuits designed as upconverter series for

UC 4863

Abstract: ic isl 887
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

LQS33N

Contextual Info: CHIP INDUCTORS m u ffn tn These ultra small, high performance chip inductors feature a low direct current resistance and outstanding high frequency characteristics. Each series has a unique structure specifically designed with a wide range of values suitable for various appli­

Contextual Info: PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS ¿tPC8119T, ¿iPC8120T GAIN CONTROL AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE DESCRIPTION ¿¡PC8119T and ¿¡PC8120T are silicon monolithic integrated circuits designed as gain control amplifier. Due to 100

Contextual Info: _ DATA SHEET_ M F r / BIPOLAR ANALOG INTEGRATED CIRCUITS / ¿ í P C 8 1 6 T B , ¿ í P C 8 1 9 T B SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES DESCRIPTION The ^¡PC8106TB and ^¡PC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for

567 tone

Abstract: bipolar transistor 2.4 ghz s-parameter DCS1800 PC8109TB
Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8106TB, µPC8109TB SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for

A 68063

Abstract: marking c2m
Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8119T, µPC8120T VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE DESCRIPTION The µPC8119T and µPC8120T are silicon monolithic integrated circuits designed as variable gain amplifier. Due to

Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8119T, µPC8120T VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE DESCRIPTION The µPC8119T and µPC8120T are silicon monolithic integrated circuits designed as variable gain amplifier. Due to

DCS1800

Abstract: marking c2d
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

A 68063

Abstract: PDC800M uPC8119 equivalent 22582
Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8119T, µPC8120T VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE DESCRIPTION The µPC8119T and µPC8120T are silicon monolithic integrated circuits designed as variable gain amplifier. Due to

Contextual Info: SURFACE MOUNT INDUCTORS PACKAGING & STORAGE P a c k a g in g U n its S o ld e r in g D im e n s io n s m m o> O) .E Q» A p p e a ra n c e P ro d u ct N a m e O Chip Coil 3 LL c 03 •a o C/D 3 o s 3 <f>180m m Reel <^330m m Reel B u lk (B a g ) c 'a .

Contextual Info: SURFACE MOUNT INDUCTORS LQP11A/21A/31A Series The LQP Series is comprised of chip ceils with a tight inductance tolerance, ±2%, achieved in a small chip area. Murata achieves this by forming the coil with precision film technology. This coil is excellent in the high-frequency circuits of