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    MMC VERSION 4 Search Results

    MMC VERSION 4 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10067847-511RLF
    		Amphenol Communications Solutions SD/MMC Visit Amphenol Communications Solutions
    10067847-201RLF
    		Amphenol Communications Solutions SD/MMC Visit Amphenol Communications Solutions
    10067847-601RLF
    		Amphenol Communications Solutions SD/MMC Visit Amphenol Communications Solutions
    10125837-001SPGLF
    		Amphenol Communications Solutions 10125837-001SPGLF-SMALL MOQ VERSION Visit Amphenol Communications Solutions
    10125836-03-001SP
    		Amphenol Communications Solutions 10125836-03-001SP-SMALL MOQ VERSION Visit Amphenol Communications Solutions

    MMC VERSION 4 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SDHC specification

    Abstract: SD host controller vhdl tsmc 0.18um GPS clock code using VHDL GPS clock code using verilog vhdl code for memory card digital clock using logic gates sdio sdio memory silicon fingerprint technology
    Contextual Info:  Compatibility  SD Memory Card version 2.00 including SDHC SDIO-HOST  SDIO Card version 2.00 SD/SDIO/MMC Card Host Controller Core  SDIO Host Specification ver-  MMC Card version 3.31 sion 1.00  General SD interface features  SD1/SD4 modes of operation


    Original     		PDF

    HBM 00-01H

    Abstract: HE11020F mmc sd 2001 MMC version 2.11 LQFP80 MMC specification version 1.4
    Contextual Info: HE11020F Confidential 2001 / 7 / 17 version 0.96 USB to ATA/ATAPI/SD/MMC Interface Controller 1 General Description This chip provides a high-performance interface to bridge USB and ATA/ATAPI/SD/MMC compliance device, therefore, it could be used to connect IDE hard disk, CD-ROM, CD-RW, Compact Flash card, MMC or SD


    Original     		HE11020F 12MHz HBM 00-01H HE11020F mmc sd 2001 MMC version 2.11 LQFP80 MMC specification version 1.4 PDF

    K9F1G08U0A

    Abstract: SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics
    Contextual Info: W86L157 WINBOND MMC CARD CONTROLLER -I- Publication Release Date: December 2, 2004 Revision 0.7 W86L157 Preliminary Revision History VERSION ON WEB PAGES DATES VERSION 1 - 2/2004 0.5 First published. 2 16 4/6/2004 0.6 Add 48-pin LQFN package 3 18, 19 12/2/2004


    Original     		W86L157 W86L157 48-pin produ480, K9F1G08U0A SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics PDF

    W86L388

    Abstract: 23GIO 48-PIN NDS352P W86L388D do-15 footprint sd5d14 MMC Electronics America
    Contextual Info: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 08/2001 0.50 First published. 2 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of


    Original     		W86L388D W86L388D W86L388 23GIO 48-PIN NDS352P do-15 footprint sd5d14 MMC Electronics America PDF

    DIM200PHM33-F000

    Contextual Info: DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module Replaces June 2003 version, issue PDS5606-2.1 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability


    Original     		DIM200PHM33-F000 PDS5606-2 PDS5606-3 DIM200PHM33-F000 PDF

    DIM800NSM33-F000

    Abstract: PDS5615-2 4800 8 PIN IC
    Contextual Info: DIM800NSM33-F000 DIM800NSM33-F000 Single Switch IGBT Module Replaces April 2004 version, issue PDS5615-2.1 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability


    Original     		DIM800NSM33-F000 PDS5615-2 PDS5615-3 DIM800NSM33-F000 4800 8 PIN IC PDF

    iCreate Technologies

    Abstract: icreate
    Contextual Info: i5141-TG i5141-TG SD/MMC Memory Card Controller Datasheet Version 1.1 iCreate Technologies Corporation 2006/9/28 2006 iCreate Technologies Corporation Page 1 / 20 iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.


    Original     		i5141-TG i5141-TG iCreate Technologies icreate PDF

    723 ic internal diagram

    Abstract: DIM400GDM33-A000
    Contextual Info: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Preliminary Information Replaces September 2001, version DS5495-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM400GDM33-A000 DS5495-1 723 ic internal diagram DIM400GDM33-A000 PDF

    DIM800DCM12-A000

    Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS


    Original     		DIM800DCM12-A000 DS5548-2 DS5548- DIM800DCM12-A000 PDF

    DIM200PLM33-A000

    Contextual Info: DIM200PLM33-A000 DIM200PLM33-A000 IGBT Chopper Module Preliminary Information Replaces issue April 2003, version DS5597-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM200PLM33-A000 DS5597-1 DS5597-2 DIM200PLM33-A000 PDF

    DIM2400ESM12-A000

    Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003


    Original     		DIM2400ESM12-A000 DS5536-2 DS5529-3 33arantee DIM2400ESM12-A000 PDF

    DIM1600FSM12-A000

    Abstract: 6x transistor
    Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000 6x transistor PDF

    bi-directional switches IGBT

    Abstract: DIM400PBM17-A000 bidirectional switch igbt matrix converter
    Contextual Info: DIM400PBM17-A000 DIM400PBM17-A000 IGBT Bi-Directional Switch Module Preliminary Information Replaces issue June 2002, version DS5524-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM400PBM17-A000 DS5524-2 bi-directional switches IGBT DIM400PBM17-A000 bidirectional switch igbt matrix converter PDF

    DIM1800ESM12-A000

    Contextual Info: DIM1800ESM12-A000 DIM1800ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5529-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003


    Original     		DIM1800ESM12-A000 DS5529-2 DS5529-3 33arantee DIM1800ESM12-A000 PDF

    DIM1600FSM17-A000

    Abstract: DS5455-2
    Contextual Info: DIM1600FSM17-A000 DIM1600FSM17-A000 Single Switch IGBT Module Replaces May 2001, version DS5455-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5455-2.0 March 2002


    Original     		DIM1600FSM17-A000 DS5455-1 DS5455-2 DIM1600FSM17-A000 PDF

    DIM1200FSM12-A000

    Contextual Info: DIM1200FSM12-A000 DIM1200FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5547-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5547-3.0 March 2003


    Original     		DIM1200FSM12-A000 DS5547-2 DS5547-3 DIM1200FSM12-A000 PDF

    DIM800FSM12-A000

    Contextual Info: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5531-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5531-3.0 March 2003


    Original     		DIM800FSM12-A000 DS5531-2 DS5531-3 DIM800FSM12-A000 PDF

    DIM1600FSM12-A000

    Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000 PDF

    DIM1200FSM17-A000

    Contextual Info: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces May 2001, version DS5456-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-2.0 March 2002


    Original     		DIM1200FSM17-A000 DS5456-1 DS5456-2 2400y DIM1200FSM17-A000 PDF

    DIM2400ESM12-A000

    Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003


    Original     		DIM2400ESM12-A000 DS5536-2 DS5529-3 33arantee DIM2400ESM12-A000 PDF

    DIM1200FSM12-A000

    Contextual Info: DIM1200FSM12-A000 DIM1200FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5547-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5547-3.0 March 2003


    Original     		DIM1200FSM12-A000 DS5547-2 DS5547-3 DIM1200FSM12-A000 PDF

    DIM400DDM12-A000

    Abstract: DS5532-3
    Contextual Info: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Replaces July 2002, version DS5532-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5532-3.0 March 2003


    Original     		DIM400DDM12-A000 DS5532-2 DS5532-3 3300Varantee DIM400DDM12-A000 PDF

    nissei capacitor MMX

    Abstract: nissei MMX MMC nissei capacitor 450v 22 700M nissei capacitor Metallized Polyester Film Box Capacitors nissei capacitors
    Contextual Info: Products Summary Dimensions Characteristic graph METALLIZED POLYESTER FILM CAPACITOR Type MMX Features Smaller version of MMC type. Very small size, achieved by our unique manufacturing method. Highly reliable because of its self-healing performance. Uniform flame-retardant epoxy resin coating through the latest resin technology. This provides


    Original     		1000hr 500hr 630Vo-p, 707Vp-p nissei capacitor MMX nissei MMX MMC nissei capacitor 450v 22 700M nissei capacitor Metallized Polyester Film Box Capacitors nissei capacitors PDF

    THGBM4G4D1HBAIR

    Abstract: THGBM4G6D2HBAIR P-VFBGA153-1113-0 toshiba 16GB Nand flash emmc thgbm4g5d1hbair Toshiba emmc THGBM4G7D2GBAIE THGBM4G8D4GBAIE THGBM 4GB eMMC toshiba
    Contextual Info: Card Interface : e･MMC｜MLC NAND｜TOSHIBA Semiconductor & Storage Products. Page 1 of 2 Card Interface : e･MMC The interface of e･MMC is compliant with Version 4.41 of the JEDEC e･MMC™ standard for high-speed memory cards. Users can easily use e･MMC™ in various products as an embedded MMC memory device e･MMC™-compliant . Since e･MMC™


    Original     		128GB P-TFBGA169-1418-0 P-FBGA169-1418-0 P-TFBGA169-1216-0 P-VFBGA153-1113-0 THGBM4G4D1HBAIR THGBM4G6D2HBAIR toshiba 16GB Nand flash emmc thgbm4g5d1hbair Toshiba emmc THGBM4G7D2GBAIE THGBM4G8D4GBAIE THGBM 4GB eMMC toshiba PDF