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    W86L388 Price and Stock

    Winbond Electronics Corp W86L388D

    Host I/F to Secure Digital (R)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com W86L388D 740
    • 1 $35.19
    • 10 $35.19
    • 100 $9.09
    • 1000 $7.91
    • 10000 $7.91
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    W86L388 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    W86L388D Winbond Electronics W86L388D Winbond Host Interface SD/MMC Memory Card Bridge Original PDF

    W86L388 Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: W86L388D Data Sheet W86L388D Winbond Host Interface SD/MMC Memory Card Bridge -i- Publication Release Date: May 17, 2005 Revision 1.0 W86L388D Table of Content1. GENERAL DESCRIPTION . 1


    Original     		PDF W86L388D W86L388D

    W86L388

    Abstract: 23GIO 48-PIN NDS352P W86L388D do-15 footprint sd5d14 MMC Electronics America
    Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 08/2001 0.50 First published. 2 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of


    Original     		PDF W86L388D W86L388D W86L388 23GIO 48-PIN NDS352P do-15 footprint sd5d14 MMC Electronics America

    Untitled

    Abstract: No abstract text available
    Text: W86L388D Data Sheet W86L388D Winbond Host Interface SD/MMC Memory Card Bridge -i- Publication Release Date: May 17, 2005 Revision 1.0 W86L388D Table of Content1. GENERAL DESCRIPTION . 1


    Original     		PDF W86L388D W86L388D

    Untitled

    Abstract: No abstract text available
    Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 2 1 08/2001 0.50 First published. 4/26/2005 0.6 Added lead free package W86L388-DG in ordering information 3 4


    Original     		PDF W86L388D W86L388-DG applica886-35-770066

    MS-6G

    Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
    Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :


    Original     		PDF Z200-PCN-PA20070101 14X20MM 14X14MM G600F) 48LQFP SB5627 W6694ACD SB5627001 MS-6G ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f