MOTOROLA PACKAGE OUTLINES Search Results

AN1984

Abstract: SOIC16 1320A-02
Contextual Info: Freescale Semiconductor, Inc. MOTOROLA Order number: AN1984 Rev 1, 03/2004 SEMICONDUCTOR TECHNICAL DATA AN1984 Handling Motorola Pressure Sensors By William McDonald Freescale Semiconductor, Inc. INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These

motorola rf Power Transistor

Abstract: an555 motorola transistor handbook motorola rf power dow corning silicone compound
Contextual Info: Order this document by AN555/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN555 MOUNTING STRIPLINE-OPPOSED-EMITTER SOE TRANSISTORS Prepared by: Lou Danley INTRODUCTION The Stripline Opposed Emitter (SOE) package presently used by Motorola for a number of rf power transistors

751E

Abstract: 940C 948F BR1339 ansi y14.5m motorola plastic package outlines
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Ordering Information Device Nomenclature MC 74 XXXX YYYYYY ZZ Motorola Circuit Identifier Package Type •D • DW •M • SD • DT Temperature Range • 74 = –40 to +85°C = = = = = Plastic Narrow JECDEC SOIC Plastic Wide JEDEC SOIC

NXR-1400

Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

transistor nec 8772

Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

MPX4250

Contextual Info: Introduction Data Sheets Quality and Reliability Application Notes Package Outline Dimensions Appendices Glossary and Symbols Device Sample Kits Index and Cross Reference Distributors and Sales Offices Issued Motorola Sensor U.S. Patents: 3858150, 3893228, 3943915, 4100563, 4184189, 4224537, 4243898, 4250452, 4317126,

vhc4316

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74VHC4316 Quad Analog Switch/Multiplexer/ Demultiplexer with Separate Analog and Digital Power Supplies High–Performance Silicon–Gate CMOS D SUFFIX 16–LEAD SOIC PACKAGE CASE 751B–05 The MC74VHC4316 utilizes silicon–gate CMOS technology to achieve

62Sn36Pb2Ag

Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

CBGA 255 motorola

Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

MOTOROLA mac15 TRANSISTOR

Abstract: MCR225-2FP 2FP TRANSISTOR mac21B motorola transistor mac15 MJF10012 MJF16006A RECTIFIER 638 MOTOROLA tolerancing "Power Semiconductor Applications"
Contextual Info: MOTOROLA SC XST RS/ R F MbE D • b 3 b ? 2 S 4 DDTbESl b H MOTb Ç) Selection by Package (continued) THYRISTORS SCRs — Style 2 TRIACs — Style 3 Device T2500BFP T2500DFP T2500MFP T2500NFP MAC21B-4FP MAC218-6FP MAC218-8FP MAC218-10FP MAC228-4FP MAC228-6FP

MOTOROLA TOP MARK

Abstract: motorola package outlines
Contextual Info: MECHANICAL OUTLINES 98ASH98061A D1CT1ONARY PAGE 1128A DO NOT SCALE THIS DRAWING ISSUE 0 DATE 15DEC97 Ä M O TO rtO LJk Semiconductor Products Sector COPYRIGHT 1997 MOTOROLA ALL RIGHTS RESERVED X —« LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA "N

1J27

Contextual Info: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061

Contextual Info: Case Outlines 1 4 -Pin P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F P7 PL | 0 1 0.25 0.0101 t n x — JG I— o I B 1 i c D 14 PL_ [ $ I 0.25(0.0101 © K I t r 1 IT 1 B ® _ J F L- / R X 45J E 3 " SEATING PLANE NOTES'

HF 1932

Contextual Info: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030

TRANSISTOR BJ 026

Contextual Info: PACKAGE OUTLINES NOTES: 1. DIMENSIONING AND TOLERANCING PER SOT-23 2. 3. STYLE 6: PIN 1. S " WLE 12: PIN 1. CATHODE BASE STYLE 7: PIN 1. EMITTER 1.40 1.11 0.0150 0.0200 0.37 0.0701 0.0807 1.78 0.50 2.04 0.0005 0.0034 0.0040 0.013 0.100 0.0070 0.085 0.177 0.0180

Contextual Info: Case Outlines L SUFFIX NOTES 1 DIMENSIONING AND TOLERANCING PER a n d v i i cjj i ono 2 3 CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL DIMENSION F MAY NARROW TO 0.76 0 030 WHERE THE LEAD ENTERS THE CERAMIC BOOY 4 DIM A

C-0120

Contextual Info: T F TMos Package Outlines - A - ► \ 1 C 1 i I t T t- E - * l •*— D 2 PL I s e a t in g p la n e NOTES. 1. DIM ENSIONING AND TOLERANCING PER ANSI Y14 5M, 1982 2 CONTROLLING DIMENSION INCH 3. ALL RULES AND NOTES ASSOCIATED WITH STYLE 3. PIN 1 GATE

powerpc dhrystone

Abstract: e500 I2C boot sequencer SMC 1015 L1 DM9161 pcb MPC826* debug register pir chip POWERPC E500 instruction set E500CORERM DM9161 powerpc dhrystone mips
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2662 Rev. 0, 05/2004 Freescale Semiconductor, Inc. Migrating from PowerQUICC II to PowerQUICC III Nigel Dick NCSD Applications East Kilbrade, Scotland This application note outlines the considerations that are relevant to migrating from the

MC145475DW

Abstract: MC145475P MC145474P MC145474 8 bit 92112 IC 92112 block diagram ADI1523 BR10 MC145472 MC145475
Contextual Info: Order this document by MC145474/D Rev. 1 MC145474 MC145475 ISDN S/T Interface Transceiver Coming through loud and clear. NOTICE PRODUCT ENHANCEMENT AND DATA UPDATE This notice outlines changes made to the first and second printings of the Advance Information

Motorola 206

Contextual Info: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

Theta JB

Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480
Contextual Info: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)

MHLW8000

Abstract: MFF224B BGY88 Application MHW6225 MHW7222 Cable TV Hybrid MFF424B MHW5272A BGY85A MFF124B
Contextual Info: SG382/D RF Semiconductor Division Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products to the CATV market. Three examples of such solutions are the first 860 MHz

PQFN

Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN

mhw6342t

Abstract: MHW9182B Cable TV Hybrid p 1302 capacitor BGY887B MHW6182T MHW6222T 714p cable tv amplifier capacitor cross reference
Contextual Info: SG382/D REV 3 Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products for the CATV market. Continuing our history of leadership in the CATV market,