NITTO GE Search Results

Nitto

Abstract: CY7C199 JESD22
Contextual Info: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:

M24C16K

Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
Contextual Info: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This

MP8000

Abstract: MP-8000 Nitto MP8000 QREE0023 mold compound
Contextual Info: QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO14 package Small Outline Package in Muar plan. This material

t7778a

Abstract: LM24014H LM24014 T7778 T7900 74HC138F LF0B08 T7900 LCD LF0B09 LM2401
Contextual Info: LM24014H Dot Matrix LCD Unit LCD Data Sheet FEATURES DESCRIPTION • Display Format: 240 x 64 The SHARP LM24014H Dot Matrix LCD Unit is a 240 × 64 full dot graphic display unit which consists of gray type STN, transflective mode, positive type with an LCD controller and a CG-ROM. NITTO transflector P1 type R = 66.4% (TYP , T = 30.4% (TYP).

nitto SWT 10

Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Contextual Info: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device

UE-111AJ

Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Contextual Info: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device

Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Sumitomo G700K

Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

ABLEBOND

Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

G700K

Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

mark a7 sot23

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Ablebond 84-1 LMISR4

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

mark a7 sot23

Abstract: J-STD-20A atec 6710S CDA194 mp8000
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

CDA194

Abstract: mark a7 sot23
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

LMISR4

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

nitto GE

Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
Contextual Info: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,

japan servo co

Abstract: "japan servo" Air COnditioner toyama sagami transformer koganei Denko Japan Servo development trends in car manufacture hitachi-metals toner sagami transformer 5
Contextual Info: Data on Environmental Performance Fiscal 1999 í Contents b Environmental Management System GREEN 21 .1 • Hitachi Group Average Green Point Scores .1 • Green Points for Hitachi, Ltd. and Affiliated Firms .1

cirocomm gps receiver

Abstract: cirocomm Cirocomm GPS
Contextual Info: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna