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    O28 PACKAGE Search Results

    O28 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    O28 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    O28 Package Cypress Semiconductor Shrunk Small Outline Packages Original PDF

    O28 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    51-85062-C

    Abstract: package
    Text: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28


    Original     		PDF 20-Lead 24-Lead 28-Lead 150-Mil) 51-85072-B 34-Pin 51-85083-B 48-Lead 51-85061-C 51-85062-C package

    34-pin

    Abstract: No abstract text available
    Text: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56


    Original     		PDF 20-Pin 28-Lead 34-Pin 48-Lead 56-Lead

    O28 Package

    Abstract: small outline
    Text: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram


    Original     		PDF 20-Pin 51-85077-B 28-Lead 210-Mil) 51-85079-B 150-Mil) 51-85072-B 34-Pin 51-85083-B O28 Package small outline

    MAB 01D

    Abstract: c336 transistors connect water level sensor to msp430 DIODE c336 MSP430C337 MSP430P337 MSP430C336 2R5 PTC LS29
    Text: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4


    Original     		PDF MSP430x33x SLAS163 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 66customer MAB 01D c336 transistors connect water level sensor to msp430 DIODE c336 MSP430C337 MSP430P337 MSP430C336 2R5 PTC LS29

    MSP430C336

    Abstract: MSP430C337 MSP430P337 LS29 MSP430E
    Text: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4


    Original     		PDF MSP430x33x SLAS163 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 66ocal MSP430C336 MSP430C337 MSP430P337 LS29 MSP430E

    Untitled

    Abstract: No abstract text available
    Text: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4


    Original     		PDF MSP430x33x SLAS163 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 16-Bit

    Untitled

    Abstract: No abstract text available
    Text: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4


    Original     		PDF MSP430x33x SLAS163 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23

    MSP430C336

    Abstract: MSP430C337 MSP430P337
    Text: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4


    Original     		PDF MSP430x33x SLAS163 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 MSP430C336 MSP430C337 MSP430P337

    O28 Package

    Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
    Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 2Mx32 64KBytes WF2M32U-XG2UX O28 Package WF2M32-XXX5 68 lead CQFJ

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES „ „ Access Time of 90, 120, 150ns „ Organized as 2Mx32 Packaging: „ • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 2Mx32 64KBytes WF2M32U-XG2UX WF2M32-XXX5

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF 2Mx32 150ns 64KBytes WF2M32-XXX5 WF2M32U-XG2UX

    footprint cqfp 240

    Abstract: No abstract text available
    Text: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES „ Commercial, Industrial, and Military „ Access Time of 90, 120, 150ns Temperature Ranges „ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF 2Mx32 150ns WF2M32-XXX5 WF2M32U-XG2UX footprint cqfp 240

    O28 Package

    Abstract: No abstract text available
    Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed


    Original     		PDF WS128K32-15XX 128Kx32 66-pin, 128Kx32; 256Kx16 512Kx8 WS128K32-XG2X WS128K32-XHX 128Kx32 O28 Package

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 64KBytes 2Mx32 64KByte 01HXX* 120ns WF2M32-XXX5

    MACH131SP-5YC-7YI

    Abstract: 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates
    Text: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages


    Original     		PDF 5/10/12/15-ns 5/10/12/14/18-ns MACH221 MACH221SP MACH231 MACH231SP MACH211 MACH211SP MACH131SP-5YC-7YI 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates

    28 MHZ crystal

    Abstract: 4 MHz crystal laptop motherboard circuit diagram marking t9d O28 Package OSC XTAL 32.768KHZ xtal 32.768 CY2291 CY2291F CY2291I
    Text: CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I Three-PLL General Purpose EPROM Programmable Clock Generator Features Benefits • Three integrated phase-locked loops Provides all necessary system clocks in a single package • EPROM programmability


    Original     		PDF CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I 28 MHZ crystal 4 MHz crystal laptop motherboard circuit diagram marking t9d O28 Package OSC XTAL 32.768KHZ xtal 32.768 CY2291 CY2291F CY2291I

    mach210 die

    Abstract: AP-Q mach schematic mach 1 family MACH Programmer PAL 007 PAL 007 A PAL 007 c Pal programming MACH111SP
    Text: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages SpeedLocking – guaranteed fixed timing up to 16 product terms


    Original     		PDF 5/10/12/15-ns 5/10/12/14/18-ns interco14, MACH221SP MACH231 MACH231SP MACH211 MACH211SP mach210 die AP-Q mach schematic mach 1 family MACH Programmer PAL 007 PAL 007 A PAL 007 c Pal programming MACH111SP

    MACH211SP

    Abstract: mach schematic MACH111SP
    Text: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages


    Original     		PDF 5/10/12/15-ns 5/10/12/14/18-ns MACH221SP MACH231 MACH231SP MACH211 MACH211SP MACH211SP mach schematic MACH111SP

    smd a17 power

    Abstract: 94611 smd a7 transistor smd transistor a4 smd transistor A6 3 WS512K32-XXX top mark smd A9
    Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120nS ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611


    Original     		PDF WS512K32-XXX 512Kx32 120nS 66-pin, 512Kx32, 1024Kx16 01HMX 100nS 02HMX smd a17 power 94611 smd a7 transistor smd transistor a4 smd transistor A6 3 WS512K32-XXX top mark smd A9

    ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM

    Abstract: SPLL
    Text: CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I Three-PLL General Purpose EPROM Programmable Clock Generator Features Benefits • Three integrated phase-locked loops Provides all necessary system clocks in a single package • EPROM programmability


    Original     		PDF CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I CY2291 CY2291I CY2291F CY2292 CY2292I CY2292F CY2295 ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM SPLL

    Untitled

    Abstract: No abstract text available
    Text: WE128K32-XXX HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Times of 120, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400 ■ ■ ■ ■ ■ ■ ■ ■


    Original     		PDF WE128K32-XXX 128Kx32 300ns 66-pin, 128Kx32; 256Kx16 512Kx8 01H5X 02H5X 03H5X

    smd A018

    Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
    Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm


    Original     		PDF WS512K32-XXX 512Kx32 512Kx32, 1Mx16 09HMX 10HMX 05HNX 06HNX 07HNX 08HNX smd A018 top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8

    CQFP 52 lead

    Abstract: footprint cqfp 68 ACT-F4M32A
    Text: ACT–F4M32A High Speed 128 Megabit Sector Erase FLASH Multichip Module Advanced CIRCUIT TECHNOLOGY Features www.aeroflex.com/act1.htm • 8 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 4M x 32 ■ +5V Power Supply / +5V Programing Operation


    Original     		PDF F4M32A MIL-STD-883 SCD3866 CQFP 52 lead footprint cqfp 68 ACT-F4M32A

    Untitled

    Abstract: No abstract text available
    Text: fax id: 2053 CYPRESS PRELIMINARY C YM 1861V33 2,048K X 32 3.3V Static RAM Module Features • H igh-density 3.3V 64-megabit SRAM module • 32-bit Standard F ootprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs packages mounted on an epoxy laminate substrate. Four chip


    OCR Scan     		PDF 1861V33 64-megabit 32-bit CYM1861V33 72-pin 64-pin CYM1821, CYM1831, CYM1836, CYM1841)