O28 PACKAGE Search Results

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

O28 Package

Abstract: small outline
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram

MAB 01D

Abstract: c336 transistors connect water level sensor to msp430 DIODE c336 MSP430C337 MSP430P337 MSP430C336 2R5 PTC LS29
Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

MSP430C336

Abstract: MSP430C337 MSP430P337 LS29 MSP430E
Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

MSP430C336

Abstract: MSP430C337 MSP430P337
Contextual Info: MSP430x33x MIXED SIGNAL MICROCONTROLLERS SLAS163 – FEBRUARY 1998 D D D D D D D D D D D VSS1 Xin Xout/TCLK XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI R33 R23 R13 R03 S29/O29/CMPI S28/O28 S27/O27 S26/O26 S25/O25 S24/O24 S23/O23 VCC1 CIN TP0.0 TP0.1 TP0.2 TP0.3 TP0.4

O28 Package

Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

WF2M32-XXX5

Contextual Info: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES „ „ Access Time of 90, 120, 150ns „ Organized as 2Mx32 Packaging: „ • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

Contextual Info: fax id: 2053 CYPRESS PRELIMINARY C YM 1861V33 2,048K X 32 3.3V Static RAM Module Features • H igh-density 3.3V 64-megabit SRAM module • 32-bit Standard F ootprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs packages mounted on an epoxy laminate substrate. Four chip

footprint cqfp 240

Contextual Info: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES „ Commercial, Industrial, and Military „ Access Time of 90, 120, 150ns Temperature Ranges „ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .

O28 Package

Contextual Info: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

MACH131SP-5YC-7YI

Abstract: 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

28 MHZ crystal

Abstract: 4 MHz crystal laptop motherboard circuit diagram marking t9d O28 Package OSC XTAL 32.768KHZ xtal 32.768 CY2291 CY2291F CY2291I
Contextual Info: CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I Three-PLL General Purpose EPROM Programmable Clock Generator Features Benefits • Three integrated phase-locked loops Provides all necessary system clocks in a single package • EPROM programmability

mach210 die

Abstract: AP-Q mach schematic mach 1 family MACH Programmer PAL 007 PAL 007 A PAL 007 c Pal programming MACH111SP
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages SpeedLocking – guaranteed fixed timing up to 16 product terms

MACH211SP

Abstract: mach schematic MACH111SP
Contextual Info: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages

smd a17 power

Abstract: 94611 smd a7 transistor smd transistor a4 smd transistor A6 3 WS512K32-XXX top mark smd A9
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120nS ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611

ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM

Abstract: SPLL
Contextual Info: CY2291/CY2291F/CY2291I CY2292/CY2292F/CY2292I CY2295/CY2295I Three-PLL General Purpose EPROM Programmable Clock Generator Features Benefits • Three integrated phase-locked loops Provides all necessary system clocks in a single package • EPROM programmability

Contextual Info: WE128K32-XXX HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Times of 120, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400 ■ ■ ■ ■ ■ ■ ■ ■

smd A018

Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm

CQFP 52 lead

Abstract: footprint cqfp 68 ACT-F4M32A
Contextual Info: ACT–F4M32A High Speed 128 Megabit Sector Erase FLASH Multichip Module Advanced CIRCUIT TECHNOLOGY Features www.aeroflex.com/act1.htm • 8 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 4M x 32 ■ +5V Power Supply / +5V Programing Operation