OCT97 Search Results

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-97 9738 B3 CARSEM DM722224AAB 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Electrical Cum % 203/0 0.0% Preconditioning (P/C):

FWX-500A

Abstract: SB98107 FWX-200A FWX-35A FWX-60A
Contextual Info: BIF Document Semiconductor Fuse 35-800A, 250 Volts 359 Size 104 103 FWX-200A FWX-350A FXW-400A FWX-500A FWX-600A FWX-800A Virtual Pre-arcing Time In Seconds 102 101 100 FWX-35A FWX-40A FWX-60A FWX-70A FWX-100A FWX-150A 10–1 10–2 10–3 10–4 2 Minimum Melting

HY628400LL

Contextual Info: HY628400 Series • H Y U N D A 512Kx8bit CM OS SRAM I DESCRIPTION FEATURES The HY628400 is a high-speed, low power and 4M bits C M O S S R A M organized as 524,288 words by 8 bits. The HY628400 uses Hyundai's high performance twin tub C M O S process technology

dallas date code ds1230

Abstract: DS1230
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1230 LPM w/BR1225 Oct-97 9742 H DALLAS DA097425 N/A 34 LPM STRESS/JOB NO. READPOINT (Sample Size/No. of Fails) Hi Temp Storage 70°C, No Bias

9735 h

Abstract: DS1230Y
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1230Y Oct-97 9735 H DALLAS DA097816 N/A 28 MODULE STRESS/JOB NO. READPOINT Sample Size/No. of Fails Storage Life 85°C, No Bias P-20679 48 Hr

Contextual Info: r 6 7 THIS C DRAWING C O P Y R IG H T 15 U N P U B L IS H E D . 19 RELEASED BY AMP IN COR PO RA TE D. FOR ALL 3 4 2 , 19 PUBLICATION R 1 G H IS 5 LOC RLbLRVLD. CM DI ST REVISIONS 53 DESCRIPTION D REV g REDWN PER AMP L O G O AND C A V I T Y N U M B E R S

Contextual Info: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 0.40% 15 HV. Life, 1000 hrs 12 Inf. Life, 48 hrs 9 0.20% 6 0.10% Start Dec 95 Data Limited 3 0.00% Jun-96 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Sep-96 Dec-96 Mar-97 Jun-97 Sep-97 CUMULATIVE DATA DS1000 125°C, 7.0 V

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Oct-97 9739 CARSEM DM729067AKB 0.8µ OX/NI EPROM 06 TSOC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Bake, 125°C, 24 Hr

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-97 9732 A5 CARSEM DM721163ACA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Bake, 125°C, 24 Hr

bussmann semiconductor fuse

Abstract: bussmann semiconductor fuse FWX FWX-500A transistor a 1413 FWX-200A FWX-35A FWX-60A bussmann fwx fuse FWX-350A
Contextual Info: BIF Document Semiconductor Fuse 35-800A, 250 Volts 359 Size 104 103 FWX-200A FWX-350A FXW-400A FWX-500A FWX-600A FWX-800A Virtual Pre-arcing Time In Seconds 102 101 100 FWX-35A FWX-40A FWX-60A FWX-70A FWX-100A FWX-150A 10–1 10–2 10–3 10–4 2 Minimum Melting

IRPT1059A

Abstract: irpt1061 IRPT1061A
Contextual Info: Revised 5/11/99 www.irf.com Solutions From IR Catalog of Available Documents TM powIRtrain IR ProCenter Fax-On-Demand 310 252-7100 Products Description Document# Pages Date 801 9 May-97 IRPT1057A: 0.75 hp, 180-240V AC input, 3-phase Module 60112 12 Oct-97

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1210 Oct-97 9643 C1 HYUNDAI DL728002AAC 3.0µ OX/NI 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Bake, 125°C, 24 Hr

P-20606

Abstract: c19643 DS1868 p19500 p1908 DD642 P19-50 B59728 P2050
Contextual Info: RELIABILITY MONITOR STRESS: Infant / High Voltage Life 125°C, 7.0 V. 6.0 V. DS1302 PRODUCT DS1302 DS1302 DS1302 DS1868 DS21S07A DS21S07A DS21S07A DS2401 DS2401 DS2401 DS80C320 DS80C320 DS80C320 DS80C320 MONITOR DATE JOB NO. Mar-97 Jun-97 Sep-97 Feb-97 Feb-97

Contextual Info: Pomona Model 5344 BNC Female CRIMP STYLE COAXIAL CONNECTOR MATERIALS: Body: Brass Center Contact: Beryllium Copper Dielectric: PTFE FINISH: Body: Tarnish Resistant Center Contact: Gold Plated RATING: Operating Voltage: 500 VRMS Nominal Impedance: 50 Ohms

2N6764 JANTX

Abstract: 91447 IR2113L
Contextual Info: Government / Space Products Catalog of Available Documents Revised 5/11/99 www.irf.com IR ProCenter Fax-On-Demand 310 252-7100  Radiation-Hardened HEXFET Description Datasheets IRH7054 IRH7130 IRH7150 IRH7230 IRH7250 IRH7250SE IRHF7330SE IRHF7430SE IRH7450

IRFBE30 equivalent

Abstract: irf9640 REPLACEMENT GUIDE IRGKI200F06 IRGP440U replacement IRF3205 smd IRGBC20FD2 IRFK3D450 IRFBg30 equivalent IRGNIN150M06 irc540
Contextual Info: Electronic Switches Catalog of Available Documents Revised 8/27/98 www.irf.com IR ProCenter Fax-On-Demand 310 252-7100  HEXFET Power MOSFETs Description Gen Package Document # Pages Date 11 10 12 7 May-97 May-97 91615 91650 91651 90454 90592 90565 90566

Power output ic la 4451 datasheet

Abstract: XC9536-VQ44 output ic la 4451 datasheet la 4451 xc9536vq44 interfacing cpld xc9572 with keyboard Cognex XC9572-15PC44C bytek 135h sican dsp
Contextual Info: XCELL Issue 26 Third Quarter 1997 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS R The Programmable Logic CompanySM Inside This Issue: GENERAL Editorial: What Do You Think? . 2 New Building in San Jose . 2 Customer Success Story - Cognex . 3

30A10

Abstract: FWA-20A10F FWA-25A10F
Contextual Info: BIF Document Semiconductor Fuse 5-30A, 150 Volts 35785317 Size 10≈ 38 104 6 4 2 103 6 4 2 102 Virtual Pre-Arcing Time In Seconds 6 4 2 101 FWA-5A10F FWA-10A10F FWA-15A10F FWA-20A10F FWA-25A10F FWA-30A10F 6 4 2 100 6 4 2 10–1 6 4 2 10–2 6 4 2 10–3 6

Contextual Info: RELIABILITY MONITOR PRODUCT DS12887 w/BR1225 MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE Oct-97 9651 A2 DALLAS DA89005-1 N/A 24 MODULE STRESS/JOB NO. READPOINT (Sample Size/No. of Fails) Hi Temp Storage 85°C, No Bias

FWP-10B

Abstract: FWP-30B FWP-15B bussmann semiconductor fuse FWP-20B
Contextual Info: BIF Document Semiconductor Fuse 5-30A, 700 Volts 35785316 Size 104 6 4 2 103 6 4 2 102 6 4 Virtual Pre-Arcing Time In Seconds 2 101 6 4 2 100 6 4 FWP-5B FWP-10B FWP-15B FWP-20B FWP-25B FWP-30B 2 10–1 6 4 2 10–2 6 4 2 10–3 6 4 2 10–4 2 4 6 8 101 2 4

2N6782 JANTX

Abstract: 2N6758 JANTX 2N6756 JANTX 2N6766 JANTX 2N6792 JANTX 2N6796U 60022 2N7236 2n6806 jantx 2N6770 JANTX
Contextual Info: Government / Space Products Catalog of Available Documents Revised 8/27/98 www.irf.com IR ProCenter Fax-On-Demand 310 252-7100  Radiation-Hardened HEXFET Document # Pages Date IRH7054 90883 5 Oct-96 IRH7150 90677 13 Oct-96 IRH7250 90697 13 Oct-96 IRH7450SE

Contextual Info: MITSUBISHI LSIs SDRAM Rev.1.2 0cr97 M5M4V64S30ATP-8A,-8, -10 64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM PRELIMINARY Some of contents are subject to change without notice. PIN CONFIGURATION (TOP VIEW) DESCRIPTION The M5M4V64S30ATP is a 4-bank x 2097152-word x 8-bit

1k40

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1232 Oct-97 9730 C1 HYUNDAI DL719711ABD 3.0µ OX/NI 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Electrical

P-20697

Abstract: P-20694
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS80C320 Oct-97 9736 B5 ANAM, PI. DK723356AAA 0.8µ OX/NI 40 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-20685, P-20694 READPOINT