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Super Micro Computer Inc MCP-230-74201-0B SC742 BLACK TOP COVER
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P23074 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
dallas date code ds12887 Abstract: dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074 Text: RELIABILITY MONITOR STRESS: ULTRASOUND CONDITIONS: J-STD-020 MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS1233 A5 JAN 99 P23064 9842 CARSEM DM823017AB SOT-223 DS1803 A2 NOV 98 P22797 9833 CHIPPAC, KOREA DS1869 A3 MAR 99 P23360	Original	PDF	J-STD-020 DM823017AB DS1233 DS1803 DS1869 DS2109 DS2153 DS2175 DS5002 P23064 dallas date code ds12887 dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074
DS87520 Abstract: P2305 P23855 Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	PDF	DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855
DS87520 Abstract: dm8304 P2271 DS2165Q Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	PDF	DS1232L DL817678ABB P22755 P22778 J-STD-020 DS87520 DN825394AAB DS87C520 P23306 dm8304 P2271 DS2165Q
TSOC 6 Abstract: P22713 P23162 dallas date code ds12887 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: +85°C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY DS1620 D1 SEP 98 P22710 9746 LOT NO. PACKAGE ALPHTK-BANGKOK NSEB DJ711527ABD 8PN SOIC, 208MIL READ POINT QTY FAIL 50 42	Original	PDF	DS1620 P22710 DJ711527ABD 208MIL J-STD-020 DS1232L DS1233 DS1267 TSOC 6 P22713 P23162 dallas date code ds12887