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Samtec Inc


Samtec Inc ASP-231080-01 Samtec Free Sample
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P23108 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
P2272 Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)	Original	DS1210S DN801581AAC P22330 P22398 P22690 P22728 P22729 P22730 P22731 P2272 P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q	PDF
DS87520 Abstract: P2305 P23855 Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855	PDF
DS1620 C2 Abstract: 9814 DS1621 P22328 DS2165Q Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti	Original	DM821478AIB DS2502 P23041 DS2153Q P23108 P22556 DN811539AAB DN733468AAB DS2108 DS1620 C2 9814 DS1621 P22328 DS2165Q	PDF
DS87520 Abstract: dm8304 P2271 DS2165Q Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	DS1232L DL817678ABB P22755 P22778 J-STD-020 DS87520 DN825394AAB DS87C520 P23306 dm8304 P2271 DS2165Q	PDF
DS1232L Abstract: DS1620 C2 ti 9815 Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:	Original	DM821478AIB DS2502 P23041 DM821478AIB P23123 DK826585AA DS1232L DS1620 C2 ti 9815	PDF
DS2175D1 Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA	Original	DM832008AIA DK826547AA DS2401 P23371 P23673 DS80C320 DK826547AA DS2175D1	PDF