PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC Search Results

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
Contextual Info: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)

kyocera CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
Contextual Info: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count

DS810

Contextual Info: data sheet CERAMIC / HERMETIC LCC Leadless Chip Carrier Package LCC Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized

Contextual Info: SUPERTEX INC 01 Dif| 07735^5 OOGlfiD? 8773295 SUPERTEX INC OtE 01807 &• D HV02 une -O S 16-Channel Matrix TFEL Panel Display Row Driver Ordering Information Package Options Device 40-Pin Ceramic DIP 36-Pin Leadless Chip Carrier 36-Pin Leaded Chip Carrier

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 64 CERAMIC LEADLESS CHIP CARRIER LCC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 CERAMIC LEADLESS CHIP CARRIER
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC To Top / Package Lineup / Package Index LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal

PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC To Top / Package Lineup / Package Index LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal

PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal

LCC-48C-A01

Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFN048-C-S560-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC To Top / Package Lineup / Package Index LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC64 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 LCC-64C-A01 QFN064-C-S720-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC To Top / Package Lineup / Package Index LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

CERAMIC LEADLESS CHIP CARRIER

Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
Contextual Info: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal LCC-64C-A01 64-pad ceramic LCC (LCC-64C-A01)

Contextual Info: tSENSITRON UC1625L SEMICONDUCTOR DATASHEET 4062 PART NUMBER: UC1625L REV. ENG. BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS

Contextual Info: SENSITRON SEMICONDUCTOR UC1625L DATASHEET 4062 PART NUMBER: UC1625L REV. A BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS

LCC28

Abstract: UC1625L
Contextual Info: tSENSITRON UC1625L SEMICONDUCTOR DATASHEET 4062 PART NUMBER: UC1625L REV. ENG. BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)

WQFN032-C-R450-1

Abstract: C038
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)

WQFN032-G-R450-1

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)

QFN048-C-S560-1

Abstract: LCC-48C-A01
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal LCC-48C-A01 48-pad ceramic LCC (LCC-48C-A01)

QFN016-G-S250-1

Abstract: LCC-16C-F01 R030
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)