PAL22VP10CM Search Results

Contextual Info: PAL22V10C _ PAL22VP10C Universal PAL Device SEMICONDUCTOR Features • • Ultra high speed supports today’s and tomorrow’s fastest microprocessors 10 user>programmable output macrocells — Output polarity control — Registered or combinatorial

L22V10C-10PC

Contextual Info: PAL22V10C PAL22VP10C y CYPRESS Universal PAL Device B iC M O S process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the fam iliarsum -of-products A N D -O R logic structure and a new concept, the program ­ m able m acrocell. • 10 user-programmable output

PAL22V10C-7JC

Abstract: 22V10C 22V10C-10 CERAMIC LEADLESS CHIP CARRIER PAL22V10C-10JC K73 Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PAL22V10C10DC PAL22V10C7JC PAL22VP10C-10JC
Contextual Info: PAL22V10C PAL22VP10C CYPRESS • 10 user-programmable output macrocells — Output polarity control — Registered or combinatorial operation — 2 new feedback paths PAL22VP10C • Synchronous PRESET, asynchronous RESET, and PRELOAD capability for flexible design and testability

10DC IR 3 PINS

Contextual Info: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR • Ultra high speed supports today's and tomorrow's fastest microprocessors — tp j * user-programmable output macrocells — Output polarity control BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the

22V10C

Abstract: PAL22V10C-7DC
Contextual Info: — . _ PAL22V10C _ PAL22VP10C SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 6 ns — tsu = 3 ns — fMAX = 117 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­

PAL22

Contextual Info: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR Universal PAL Device BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the familiar sum-of-products AND-OR log­ ic structure and a new concept, the pro­ grammable macrocell. • 10 user-programmable output