PGA PACKAGE WEIGHT Search Results

O28 Package

Contextual Info: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: White Electronic Designs WS1M32-XXX 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply • 84 lead, 28mm CQFP, Package 511 Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)*

schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Contextual Info: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

Contextual Info: White Electronic Designs WS512K32V-XXX ADVANCED* 512Kx32 SRAM 3.3V MODULE FEATURES Access Times of 70, 85, 100, 120ns TTL Compatible Inputs and Outputs Packaging Low Voltage Operation: • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401

Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS512K32V-XXX

Abstract: WS512K32V-XG2UX
Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

WF128K32-XXX5

Contextual Info: WF128K32-XXX5 White Electronic Designs 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES n Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400 n 5 Volt Programming. 5V ± 10% Supply

CQFP

Abstract: WF512K32 WF512K32N-XH1X5 WF512K32-XXX5
Contextual Info: White Electronic Designs WF512K32-XXX5 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES Access Times of 60, 70, 90, 120, 150ns Packaging Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400(1 .

WF128K32-XXX5

Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

WF1M32B-XXX3

Abstract: WF1M32B-XG2TX3 1m 0880
Contextual Info: White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES • Access Times of 100, 120, 150ns ■ Boot Code Sector Architecture Bottom Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401)

A11A17

Abstract: WF1M32B-XXX3
Contextual Info: White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES „ Access Times of 100, 120, 150ns • Boot Code Sector Architecture Bottom ■ Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400)

WF128K32-XXX5

Abstract: 5962-9471604HAX
Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

Contextual Info: WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES • Access Times of 50*, 60, 70, 90, 120, 150ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

WSF41632-22XX

Contextual Info: WSF41632-22XX 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE PRELIMINARY* FEATURES FLASH MEMORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Packaging • 66-pin, PGA Type, 1.385 inch square HIP, Hermetic Ceramic HIP (Package 402)

WS128K32V-XG1UX

Abstract: WS128K32V-XG2TX WS128K32V-XH1X
Contextual Info: WS128K32V-XXX 128Kx32 3.3V SRAM MULTICHIP PACKAGE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35ns ■ 3.3 Volt Power Supply ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic

RTU A08

Abstract: RTU A01 BUS-66300 bus-65112 BUS-65600 bus-66312 smd code A04 tpw14 A07 smd smd code A06
Contextual Info: CT2566 MIL-STD-1553 to Microprocessor Interface Unit Features A E RO www.aeroflex.com C F LE X LA ISO 9001 E I NC . • 78 Pin, 2.1" x 1.87" x .25" PGA type package • 82 Lead, 2.2" x 1.61 x .18" Flat Package CIRCUIT TECHNOLOGY S Second Source Compatible to the BUS-66300

5962-9461110HAX

Contextual Info: WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES ! Access Times of 15*, 17, 20, 25, 35, 45, 55ns ! TTL Compatible Inputs and Outputs ! Packaging ! 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

WS512K32

Abstract: WS512K32-XXX
Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5V Power Supply ■ Packaging ■ Low Power CMOS • 66 pin, PGA H 1 Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).