PIN DIODE MODEL SPICE Search Results

PIN diode SPICE model

Abstract: Microwave PIN diode spice Microwave PIN diode pin diode ge-2 transistor TM 937 UMX5601 V920 pin model spice MSC Microwave
Contextual Info: Spice Model Data for UMX5601 PIN Diode TM SPICE MODEL DATA The overall SPICE PIN diode model developed for the UMX5601 exhibits the equivalent circuit shown below where: - CPACK is the package capacitance L CONTACT is the contact inductance CI is the punch through I-region capacitance

BA679

Contextual Info: VISHAY BA679_Spice Vishay Semiconductors BA679 Spice Parameters * Technology: DISCRETE DIODE * Device: PIN Diode BA 679 * Type: Typical nom * Model established: 03-95, by B. Beckmann, TM1iC63-HN + IS = 718p RS = 1.37 N = 1.889 IBV= 100p + CJO=1.19p VJ = 240m M = 175m FC = 500m

di292

Abstract: pj 26 diode MJ-05 ci3022 ci470 SCM30 ci573 CMOS spice model di2910 RI57
Contextual Info: Spice Models InputBuff Operation Guide How to Use InputBuff Overview Pin VPWR should be connected to the system positive supply and be between 4.5 and 5.5 volts with respect to ground. Pin VGND should be connected to system ground. This memo responds to customer requests for a SPICE model for the HOTLink TTL and ECL input buffers. The requested uses of the output model include:

pj 59

Abstract: PJ216 pj 26 diode PJ 75 PJ 67 PJ 74 PJ-25 ci3015 pj 84 pj 50 diode
Contextual Info: fax id: 5113 Spice Models InputBuff Operation Guide How to Use InputBuff Overview Pin VPWR should be connected to the system positive supply and be between 4.5 and 5.5 volts with respect to ground. Pin VGND should be connected to system ground. This memo responds to customer requests for a SPICE model for the HOTLink TTL and ECL input buffers. The requested uses of the output model include:

di292

Abstract: CMOS spice model ci470 CI573 pj 26 diode i2931 di640 ci547 RI57 W1-300
Contextual Info: Spice Models for HOTLink spect to ground. Pin VGND should be connected to InputBuff Operation Guide system ground. Overview Pin A is the modeled input pin. The TTLinput buffĆ This memo responds to customer requests for a er is valid for all of the TTL inputs on the

PIN diode SPICE model

Abstract: NET028 NET045 NET051 pin diode model spice R2080
Contextual Info: PAROLI SPICE Simulation Models for I/O’s Appnote 84 by Jürgen Blank EQUIVALENT CIRCUITS FOR PAROLI INPUT AND OUTPUT INTERFACES, VERSION 52 1. OVERVIEW 2. PAD MODELING This application note is designed to provide equivalent circuit models that represent the current PAROLI modules input and

k0304

Abstract: K0204 N03m DIODE C06 15 k0203 26M transistor 473e K0607WB resistor 56E L05 diode
Contextual Info: AND8010/D ECLinPS Lite MC100LVELT22 SPICE Model Kit Prepared by Paul Shockman http://onsemi.com APPLICATION NOTE ON Semiconductor Logic Applications Engineering Introduction The objective of this kit is to provide schematic and SPICE parameter information for performing system level

N03m

Abstract: 794e k0203 N04m MC100LVELT22 motorola LOGIC L05 diode k0305 NE 544 spice model
Contextual Info: AND8010/D  ECLinPS Lite MC100LVELT22 SPICE Model Kit Prepared by Paul Shockman http://onsemi.com APPLICATION NOTE Motorola Logic Applications Engineering Introduction The objective of this kit is to provide schematic and SPICE parameter information for performing system level

MSWSH-020-24

Abstract: MEST2G-025-10
Contextual Info: Spice Models for Aeroflex / Metelics PIN Diode Switch Elements CHIP Robert Caverly Non-Linear Diode SPICE N=1 PIN Diode SPST & SPDT Switch Elements S Par's Is mA Iknee mA Repi Ohm s CJmod Series PIN Y Y 2.50E-07 5 1000 0.04 MEST2GFC-010-25 Series Pin N N

PIN diode SPICE model

Abstract: MSWSS-020-40 MSWSHB-020-30 Diodes D250 MSWSH 040-40 MMSPN050-53 MEST2G-080-25 MEST2G-050-80 MSWSH-020-24 MSWSHC-040-40
Contextual Info: Spice Models for Aeroflex / Metelics PIN Diode Switch Elements CHIP Robert Caverly Non-Linear Diode SPICE N=1 PIN Diode SPST & SPDT Switch Elements S Par's Is mA Iknee mA Repi Ohm s CJmod el Rlim Ω t nSec W um CJ50 pF Rs Ω PKG Series PIN Y Y 2.50E-07

GB20SHT06-CAU SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB20SHT06-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB20SHT06-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc.

1N8030-GA SPICE

Contextual Info: 1N8030-GA SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the 1N8030-GA. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155

Contextual Info: GB05SLT12-252 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SLT12-252. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 04-SEP-2013 $ * * GeneSiC Semiconductor Inc.

GB02SHT03-46 SPICE

Contextual Info: GB02SHT03-46 SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the GB02SHT03-46. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 29-AUG-2014 $ * * GeneSiC Semiconductor Inc. *

GB20SHT12-CAU SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB20SHT12-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB20SHT12-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * *

GB05SHT06-CAL SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB05SHT06-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SHT06-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * * * * * * * $Revision: 1.0 $Date: 05-SEP-2013

Contextual Info: GB01SLT06-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SLT06-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.

GAP3SHT33-CAU SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GAP3SHT33-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GAP3SHT33-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 04-SEP-2013 $ * *

GB05SHT06-CAU SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB05SHT06-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SHT06-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * * * * * * * $Revision: 1.0 $Date: 05-SEP-2013

1N8026-GA SPICE

Contextual Info: 1N8026-GA SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the 1N8026-GA. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155

GB01SHT06-CAL SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB01SHT06-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SHT06-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc.

GB01SHT12-CAL SPICE

Abstract: high-temperature-sic-bare-die
Contextual Info: Die Datasheet GB01SHT12-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SHT12-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * *

Contextual Info: GB01SLT12-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SLT12-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.

Contextual Info: GAP3SLT33-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GAP3SLT33-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.