PLASTIC 32-PIN 300 MIL SOIC Search Results

Plastic 32-pin 300 mil SOIC

Abstract: CELP CELP2X80
Contextual Info: A Package Diagrams Plastic Dual In-line Package PDIP ro o p . . 32-pin 300 mil 32-pin 400 mil Min Max Min Max Min Max Min Max - 0.175 • 0.175 - 0.180 ■ 0.200 A1 0.010 - 0.010 - 0.020 - 0.015 - . B 0.046 0.054 0.058 0.064 0.045 0.055 0.045 0.065 b 0.018 0.024 0.016 0.022 0.015 0.021 0.014 0.022

4L32AI

Abstract: 24LC32AT 4l32a 24AA32A 24LC32A soic 208 mil sn0327 0000-0FFFF g4la I327
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 2.5-5.5 400 kHz I, E 24LC32A Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

Contextual Info: 4 PACKAGE CODES PKG COSE a C S C B iP T IO N PAG E# C5 S ID E B R A Z E D , 3 0 0 M ILS , 2 8 PIN S D1 C E R D IP , 3 0 0 M ILS , 18 P IN S 164 D2 C E R D IP , 3 0 0 M ILS , 2 0 P IN S 1 64 163 D3 C E R D IP , 3 0 0 M ILS , 22 P IN S 164 D3-1 C E R D IP , 4 0 0 M ILS , 22 P IN S

4L32AI

Abstract: 24AA32A 24LC32A MS-001 A14IT
Contextual Info: M 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 24LC32A 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

B503 F

Abstract: 4L32AI marking code 10 lead msop package analog devices marking code gen sm 1812 1 TO 4 CLOCK BUFFER 8-pin SOIC Analog devices marking Information PACKAGE SOIC pic microchip micro 8 pin st 393 8-pin 24AA32A
Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 24LC32A 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

Memory

Contextual Info: 24AA32A/24LC32A 32K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA32A 1.8-5.5 400 kHz 1 I 24LC32A 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

AY0438/P001

Contextual Info: AY0438 M ic r o c h ip 32-Segment CMOS LCD Driver FEATURES PIN CONFIGURATION 40-LEAD DUAL INLINE • Drives up to 32 LCD segments of arbitrary configuration • CMOS process for: wide supply voltage range, lowpower operation, high-noise immunity, wide temperature range

st 24c64

Abstract: 24C64 WP st
Contextual Info: 24AA64/24LC64/24C64 M ic ro c h ip 64K I2C CMOS Serial EEPROM DEVICE SELECTION TABLE PACKAGE TYPE 8L PDIP/SOIC Part Number Vcc Range Max Clock Frequency Temp Ranges 24AA64 1.8-5.5V 400 kHz* C,l 24LC64 2.5-5.5V 400 kHz C,l 24C64 4.5-5.5V 100 kHz C,I,E

tsop tray matrix outline

Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

maxim naming convention

Abstract: AEC-Q100 MAX631ACPA MAX696CWE 81h44 48 Lead Ceramic Quad Flatpack
Contextual Info: Maxim Product Naming Conventions These conventions apply to Maxim-branded products. For Dallas parts, see Dallas Semiconductor Ordering Information Product Numbers for Second-Sourced Parts Second-source products follow the most widely accepted numbering system for that

Contextual Info: fr PERICOM I I I II I II I I I I I t I 1 I I 1 II t I I M I II I II II I M I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I 11 I I I I I I I I I I I I I I I I I I I I I I I Tape and Reel Packing Requirements

14C88

Abstract: 14CA8 sonos 22C48 Plastic 28-pin 300 mil SOIC SIMTEK 16C88 11C68 12c68 130nm CMOS SONOS flash memory
Contextual Info: COMPANY OVERVIEW nvSRAM Features • Unlimited Writes and Reads Simtek Corporation NASDAQ : SMTK , headquartered in Colorado Springs, Colorado, delivers unique integrated NV + SRAM memory products that solve the tough write endurance problems in a variety of applications. Our customers

philips diode PH 33J

Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without

UM61256FK-15

Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch

JEDEC Matrix Tray outlines

Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

ATMEL 234

Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

21189F

Abstract: 24LC64 4L64I 24AA64 MS-001 DS21189F
Contextual Info: 24AA64/24LC64 64K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA64 1.8-5.5 400 kHz 1 I 24LC64 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

24LC64

Abstract: 4L64I DS21189E 4L64 24AA64 24LC64 microchip
Contextual Info: M 24AA64/24LC64 64K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA64 1.8-5.5 400 kHz 1 I 24LC64 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

Contextual Info: 24AA64/24LC64 64K I2C Serial EEPROM Description Device Selection Table Part Number VCC Range Max Clock Frequency Temp Ranges 24AA64 1.8-5.5 400 kHz 1 I 24LC64 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP/MSOP

Contextual Info: AT27C080 Features • • • • • • • • • • Fast Read Access Time -10 0 ns Low Power CMOS Operation 100 fiA max. Standby 30 mA max. Active at 5 MHz Wide Selection of JEDEC Standard Packages 32-Lead 600-mil PDIP and Cerdip 32-Lead 450-mil SOIC SOP

21189H

Abstract: DS21189H 24XX64 G4AB
Contextual Info: 24AA64/24LC64 64K I2C Serial EEPROM Device Selection Table Description Part Number VCC Range Max Clock Frequency Temp Ranges 24AA64 1.8-5.5 400 kHz 1 I 24LC64 2.5-5.5 400 kHz I, E Note 1: 100 kHz for VCC <2.5V Features Package Types PDIP/SOIC/TSSOP /MSOP

28 TSSOP JEDEC Thin Matrix Tray outlines

Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
Contextual Info: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three

4500B

Abstract: 74LS240-74HC240 TC74HC00P toshiba suffixes TC74HC74P
Contextual Info: 3. P RO DU CT O UT LINE OF THE TC74HCxxxA S E R IE S The TC74HCxxxA series is an improved High Speed Logic development of TOSHIBA. Some of these improvements are outlined below: 1 Increased Speed of Operation: Over 20 companies now manufacture the 74HC Beries worldwide. The JEDEC JC40.2 committee

Contextual Info: m ,c r T c h ,p 25AA640/25LC640/25C640 64K SPI Bus Serial EEPROM PACKAGETYPES DEVICE SELECTION TABLE Part Number Vcc Range Max Clock Frequency Temp Ranges 25AA640 1.8-5.5V 1 MHz C,l cs □ 25LC640 2.5-5.5V 2 MHz C,l so □ 25C640 4.5-5.5V 3 MHz C,I,E PDIP/SOIC