PLASTIC QUAD FLAT PACK PQFP Search Results

XC68307

Abstract: xpc821 XC68HC901 XC68EC060 XC68040 XC68330FC XC68060 SPAK821 mc68340rp MC68230
Contextual Info: SG167/D REV 20 µ MOTOROLA Embedded Systems FACT SHEET 3rd QUARTER 1996 FC = Plastic Quad Gull Wing FE = Ceramic Quad (Gull Wing) FG = Plastic Quad Flat Pack (PQFP) FN = Plastic Quad Pack (PLCC) FT = Plastic Flat Pack (28 x 28 mm) FU = Plastic Quad Flat Pack (14 x 14 mm)

plastic quad flat pack

Contextual Info: ISSI PACKAGING INFORMATION PQFP Plastic Quad Flat Pack Package Package Code: PQ D D1 E E1 N 1 L1 L C e SEATING PLANE A2 A b A1 Plastic Quad Flat Pack (PQ) Inches Millimeters Min Max Min Max Millimeters Symbol Min Max Ref. Std. No. Leads (N) 100 A — —

PQFP 132 PACKAGE DIMENSION intel

Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
Contextual Info: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

PCN0714

Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

alpine

Abstract: alpine md53 vl-bus CL-GD5434 cirrus vga ANALOG DEVICE P9B
Contextual Info: CL-GD543X/'4X Alpine Fam ily VGA G U I Accelerators 1. CIRRUS LOGIC PIN INFORMATION The CL-GD543X/’4X VGA GUI controllers are available in a 208-pin PQFP plastic quad flat pack or HQFP (high-performance quad flat pack) configuration. The CL-GD5430/’36/’40 devices can be config­

8086 microprocessor pin description

Abstract: KU80486SX KU80486SXSA KU80486SXSA33 D1846 242202 chip 8-pin t24 SL ENHANCED INTELSX2 sb80486sx general cross references
Contextual Info: A EMBEDDED Intel486 SX PROCESSOR • 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor — 208-Lead Shrink Quad Flat Pack (SQFP) ■ 5-Volt Processor Burst Bus Cycles — 196-Lead Plastic Quad Flat Pack

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

Contextual Info: 2 Pinout The 21143 is offered in two package styles: a 144-pin plastic quad flat pack PQFP and a 144-pin thin quad flat pack (TQFP). The tables in this section provide a description of the pins and their respective signal definitions. Table 1 lists the tables in this section. Figure 2 shows the 21143 pinout for both the

PCN0602

Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

Nitto

Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 MP-8000 JEDEC22 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack PQFP (CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

ET1-6T

Abstract: block diagram for RF transmitter AND RECEIVER op
Contextual Info: STB3300 GSM RECEIVER / TRANSMITTER . . ADVANCE DATA GSM RECEIVER/TRANSMITTER DIRECT CONVERSION ARCHITECTURE I/Q INPUTS AND OUTPUTS PQFP32 Plastic Quad Flat Pack DESCRIPTION The STB3300 is a partially integrated GSM receiver/transmitter. The only additions required are

92c50

Abstract: symbios
Contextual Info: SYM92C500 ORDERING INFORMATION BACKGROUND INFORMATION The SYM92C500 is available in a 160-pin Plastic Quad Flat Pack PQFP . Use the following part number when ordering. Additional information can be found in the following documents: 1. Local Area Networks:

CN8471AEPF

Abstract: CN8471AEBG CN8472AEBG CN8472AEPF CN8474AEBG CN8474AEPF CN8478 CN8478EBG CN8478EPF CN8478/74A/72A/71A
Contextual Info: CN8478/74A/72A/71A Multichannel Synchronous Communications Controller MUSYCC Data Sheet 500183A January 2002 Ordering Information Model Number Version Package Temperature Range CN8471AEPF 32-Channel 208-Pin Plastic Quad Flat Pack (PQFP) –40 °C to +85 °C

PE-65421

Abstract: fil-mag* 23z91sm LAXET304 PT3877 LT6032 Pulse Engineering Valor transformers PE-64502 PE64502
Contextual Info: NCR92C122 ORDERING INFORMATION BACKGROUND INFORMATION The NCR92C122 is available in a 100-pin Plastic Quad Flat Pack PQFP . Use the following part number when ordering. Additional information can be found in the following documents: Package Type 100-pin PQFP

Contextual Info: *7M , SGS-THOMSON IMIltgisPISflfagiflsMlllga STB3300 GSM RECEIVER/TRANSMITTER ADVANCE DATA • GSM RECEIVER/TRANSMITTER ■ DIRECT CONVERSION ARCHrTECTURE ■ l/Q INPUTS AND OUTPUTS PQFP32 Plastic Quad Flat Pack DESCRIPTION The STB3300 is a partially integrated GSM re­

Contextual Info: Order this document by DSP56L002/D MOTOROLA SEMICONDUCTOR DSP56L002 TECHNICAL DATA Plastic Quad Flat Pack PQFP Available in a 132 pin, surface mount package. Advance Information 24-Bit General Purpose Digital Signal Processor 3.3 Volt Operation - Lower Power Consumption

transport demultiplexer

Abstract: DIGITAL COLOR TV RECEIVER details "Frame rate conversion"
Contextual Info: . Advance IBM39STB130x0 STB130x0 Digital Audio/Video Decoders Features Overall • Audio/video synchronization • Audio and video error detection, concealment, and notification • 208 pin, plastic quad flat pack PQFP package Audio Decoder • Audio Decoder with two channel outputs (six

PAL OSD

Abstract: MD-720-3 colour television block diagram NTSC system decoder IBM hard MD 202 IEC958 MA10 MA11 STB13000 STB13010
Contextual Info: . IBM39STB130x0 STB130x0 A/V Transport/Decoders Features Overall • Audio/video synchronization • Audio and video error detection, concealment, and notification • 208 pin, plastic quad flat pack PQFP package Audio Decoder • Audio Decoder with two channel outputs (six

QFP100 Quad Flat Pack dimensions

Abstract: 100-PIN MC68307 MC68307CFG16 MC68307FG16 MC68307FG16V MC68307PU16 MC68307PU16V MC68307PU8V QFP-100
Contextual Info: SECTION 12 ORDERING INFORMATION AND MECHANICAL DATA This section contains the ordering information, pin assignments, and package dimensions for the MC68307. 12.1 STANDARD ORDERING INFORMATION Frequency MHz Supply Voltage (V) 100-Pin Plastic Quad Flat Pack (FG Suffix)

APTX

Abstract: GSM transmitter receiver gsm receiver transmitter 1600 oscilator PQFP32 STB3300 oscilator
Contextual Info: SGS-THOMSON HL[ STB3300 GSM RECEIVER / TRANSMITTER ADVANCE DATA GSM RECEIVER/TRANSMITTER DIRECT CONVERSION ARCHrTECTURE t/Q INPUTS AND OUTPUTS PQFP32 Plastic Quad Flat Pack DESCRIPTION The STB3300 is a partially integrated GSM re­ ceiver/transmitter. The only additions required are

Contextual Info: CN8478/74A/72A/71A Multichannel Synchronous Communications Controller MUSYCC Data Sheet 28478-DSH-002-C November 2005 Ordering Information Ordering Number Version Package Temperature Range 28475-17 32-Channel 208-Pin Plastic Quad Flat Pack (PQFP) –40 °C to +85 °C