PQFN 5 LEADS Search Results

Contextual Info: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully

Contextual Info: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5826DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5839 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 35 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5826DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5839 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 35 A  Auto DCM (Low-Side Gate Turn Off) Using

Contextual Info: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using

AP070G

Abstract: MAAP-000070-TR0500 AP070 500 watt RF amplifier GHz MAAP-000070-PKG003 MAAP-000070-SMB003 S2083 VD12
Contextual Info: MAAP-000070-PKG003 Rev. B Amplifier, Power, 1.6W 10.0—13.25 GHZ PIN 1 N/C N/C RF IN N/C The 5 mm PQFN package has a lead-free finish of leads that are RoHS compliant and is compatible with a 260oC reflow temperature. The package also features low lead inductance and an

PQFN package power freescale

Abstract: PQFN 5 leads PQFN 180901 g
Contextual Info: DETAIL G P IN 1 INDEX DETAIL M 1. 00 0. 82 0 . 1 C A B rh 0. 0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. t i t l e THERMALLY VIEW MECHANICAL OUTLINE ENHANCED POWER QUAD FLAT N O N -LE A D E D PACKAGE PQFN 16 TERMINAL, 0 .8 PITCH (5 X 5 X 2 .1 )

MAAP-000070-PKG003

Abstract: AP070G MAAP-000070-MCH000 MAAP-000070-SMB003 MAAP-000070-SMB004 S2083 VD12 im339
Contextual Info: RoHS Compliant MAAP-000070-PKG003 Amplifier, Power, 1.6W 10.0-13.25 GHz PIN 1 N/C N/C N/C VGG Each device is 100% RF tested to ensure performance compliance. The part is fabricated using M/A-COM’s GaAs Multifunction Self-Aligned Gate (MSAG) Process. The 5 mm PQFN package has a lead-free finish of leads that

PQFN

Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN

PQFN

Abstract: DUAL ROW QFN leadframe PQFN footprint "exposed pad" PCB via JESD51-5 AN2467 PQFN package power freescale PQFN 8 leads
Contextual Info: Freescale Semiconductor Application Note AN2467 Rev. 4.0, 4/2007 Power Quad Flat No-Lead PQFN Package 1 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance attributes such as Moisture Sensitivity