PQFP 132 Search Results

Contextual Info: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

mounting pad PQFP

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

amp pga socket

Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

18022

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

132 pin PGA socket

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

amp pga socket

Abstract: AMS-QQ-N-290
Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

VBH48A

Abstract: VPC176A PQFP 176 pqfp144 VQZ120A PLASTIC FLAT PACKAGE VBG48A VEF44A VEJ44A VGB52A
Contextual Info: Plastic Quad Flat Package PQFP 32 Lead Molded Plastic Quad Flat Package NS Package Number VBE32A 2000 National Semiconductor Corporation MS101167 www.national.com Plastic Quad Flat Package (PQFP) May 1999 Plastic Quad Flat Package (PQFP) 44 Lead (10mm x 10mm) Molded Plastic Quad Flat Package, EIAJ

Contextual Info: Order Number: EB382/D Rev. 0, 3/2001 Semiconductor Products Sector Engineering Bulletin MC68302FC 132-Lead PQFP Motorola is pleased to announce improvements in the manufacturability of 68302 products assembled in 132-lead PQFP. The manufacturability improvements consist of: 1 conversion to a non-MCR Molded

A3PE1500

Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

A3PE600L

Abstract: 896-Pin FBGA 896 A3PE3000L A3P1000 IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29
Contextual Info: Military ProASIC3/EL Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

smd diode OE R612

Abstract: smd diode u1j ss smii R645 CAP 103 2KV diode U1J EPC1PC8 smd diode R648 SMD R618 R647
Contextual Info: LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249325-001 LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion User Guide.

PQFP 132 PACKAGE DIMENSION intel

Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
Contextual Info: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch

DIODE C136

Abstract: smd diode R616 smd diode R622 smd diode R648 smd diode d136 SMD diode 4449 T2D DIODE 46 QFP 136 pines T2D 21 R645
Contextual Info: LXD9785 PQFP Demo Board with FPGA for SS-SMII-to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249326-001 LXD9785 PQFP Demo Board with FPGA for SS-SMII-to-MII Conversion User Guide.

Contextual Info: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)

smd diode R648

Abstract: TVS diode r725 smd diode R646 amp 4546 smd diode u1j hp r707 Diode smd f6 smd R552 smd diode R645 diode U1J
Contextual Info: LXD9785 PQFP Demo Board with FPGA for SS-SMII Fiber -to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249323-001 LXD9785 PQFP Demo Board with FPGA for SS-SMII (Fiber)-to-MII Conversion User Guide.

lj26

Abstract: D35B D35A
Contextual Info: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION

d358

Abstract: D35B pitch 0.4 QFP 256p D20B D22B D24B D268 D28B LH5420 LH543620
Contextual Info: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION

land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

EPM7128E

Abstract: PQFP-100 EPM7128S
Contextual Info: EPM7128E & EPM7128S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 84-Pin PLCC 100-Pin PQFP 100-Pin TQFP 1 , (2) 160-Pin PQFP INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (3) TMS (3) TCK (3) TDO (3) GNDINT GNDIO VCCINT (5.0 V only) VCCIO (3.3 V or 5.0 V)

m0-112

Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

EPM7128S

Abstract: EPM7128E
Contextual Info: EPM7128E & EPM7128S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 84-Pin PLCC 100-Pin PQFP 100-Pin TQFP 1 , (2) 160-Pin PQFP INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (3) TMS (3) TCK (3) TDO (3) GNDINT GNDIO VCCINT (5.0 V only) VCCIO (3.3 V or 5.0 V)

m 208 b1

Abstract: EPM7256E EPM7256S
Contextual Info: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,