SmD TRANSISTOR a42
Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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vjp44a
Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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MS011798
vjp44a
MO-16B-AB
TA11B
TF11B
cu50
ad 153 transistor
transistor bd 905
transistor BC 185
mkt 344
MS-026-bcd
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VBH48A
Abstract: VPC176A PQFP 176 pqfp144 VQZ120A PLASTIC FLAT PACKAGE VBG48A VEF44A VEJ44A VGB52A
Text: Plastic Quad Flat Package PQFP 32 Lead Molded Plastic Quad Flat Package NS Package Number VBE32A 2000 National Semiconductor Corporation MS101167 www.national.com Plastic Quad Flat Package (PQFP) May 1999 Plastic Quad Flat Package (PQFP) 44 Lead (10mm x 10mm) Molded Plastic Quad Flat Package, EIAJ
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VBE32A
MS101167
VEF44A
VEJ44A
VEK44A
VGZ44A
VBH48A
VPC176A
PQFP 176
pqfp144
VQZ120A
PLASTIC FLAT PACKAGE
VBG48A
VEF44A
VEJ44A
VGB52A
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
iso 1043-1 polypropylene
j1344
sae j1344
W28B
D1972
DIN6120
d24j
TA11A
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
sae j1344
j1344
w28c
iso 1043-1 polypropylene
bga Shipping Trays
MEC34
BGA OUTLINE DRAWING
TSOP package tray
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T03A
Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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