PQFP 256 Search Results

CQ208

Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
Contextual Info: HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP. The TQFP package has a nominal thickness of only

Z89223

Abstract: Z89273 Z89323 Z89373 DS000202-DSP0599
Contextual Info: PRODUCT SPECIFICATION Z89223/273/323/373 16-BIT DIGITAL SIGNAL PROCESSORS WITH A/D CONVERTER FEATURES Device Package Z89223 Z89273 Z89323 Z89373 44-PLCC, 44-PQFP 44-PLCC 64-TQFP, 68-PLCC, 80-PQFP 64-TQFP, 68-PLCC, 80-PQFP ROM Kwords Operating Range OTP (Kwords)

PACKAGE DIMENSIONS

Contextual Info: Package Diagrams Index of Package Diagrams 100-Ball caBGA Package . 12 120-Pin PQFP Package . 12 128-Pin PQFP Package . 13 128-Pin TQFP Package . 13

Contextual Info: PRODUCT SPECIFICATION Z89223/273/323/373 16-BIT DIGITAL SIGNAL PROCESSORS WITH A/D CONVERTER FEATURES Device Package Z89223 Z89273 Z89323 Z89373 44-PLCC, 44-PQFP 44-PLCC 64-TQFP, 68-PLCC, 80-PQFP 64-TQFP, 68-PLCC, 80-PQFP ROM Kwords OTP (Kwords) 8 8 8 8

MP7100

Abstract: 84-1MISR4 JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97114, VERSION 1.0 August, 1997 Peripheral Controller with USB Support CY82C693U in 208 Pins PQFP Cypress Semiconductor Peripheral Controller with USB Support Devices:CY82693U Package: 208 pins PQFP QTP# 97114/97135, V1.0

lj26

Abstract: D35B D35A
Contextual Info: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION

d358

Abstract: D35B pitch 0.4 QFP 256p D20B D22B D24B D268 D28B LH5420 LH543620
Contextual Info: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION

intel Q67

Abstract: B50 diode smd FERRITE BEAD 1000 OHM 0805 LXT9785 RJ11 623 IC149-208-061-S5 sn74lvc244ad S54 SMD smd diode s4 2b S53 SMD diode
Contextual Info: LXD9785 PQFP Demo Board with FPGA for RMII-to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249324-001 LXD9785 PQFP Demo Board with FPGA for RMII-to-MII Conversion User Guide.

A3PE1500

Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

smd diode OE R612

Abstract: smd diode u1j ss smii R645 CAP 103 2KV diode U1J EPC1PC8 smd diode R648 SMD R618 R647
Contextual Info: LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249325-001 LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion User Guide.

160 e7

Abstract: 484-pin BGA diodes t25 4 l9 AC22 AE23 AF14 EPF10K30A t25 4 k8 t25 4 H9 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EPF10K30A Device Pin-Outs ver. 1.0 Pin Name 144-Pin TQFP MSEL0 2 77 MSEL1 (2) 76 nSTATUS (2) 35 nCONFIG (2) 74 DCLK (2) 107 CONF_DONE (2) 2 208-Pin PQFP/RQFP 108 107 52 105 155 2 240-Pin PQFP/RQFP 124 123 60 121 179 2 256-Pin FineLine BGA P1 R1 T16 N4 B2

EPF6024A

Contextual Info: EPF6024A Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6024A 208-Pin PQFP EPF6024A 240-Pin PQFP EPF6024A 256-Pin BGA EPF6024A 256-Pin FineLine BGA EPF6024A MSEL (2) 33 46 52 T3 L5 nSTATUS (2) 56 80 92 W11 K8 nCONFIG (2) 53 77 89 Y11 N8 DCLK (2) 128

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

D35B 60

Abstract: D35B D35B 60 37 D35A D10A D11A D12A D15A LH5420 LH543620
Contextual Info: LH5420 256 x 36 × 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 × 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width • Selectable 36/18/9-bit Word Width

Contextual Info: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)

EPF6016

Abstract: 216 C9 T20 ver 2
Contextual Info: EPF6016 Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6016 208-Pin PQFP EPF6016 240-Pin PQFP EPF6016 256-Pin BGA EPF6016 MSEL (2) 33 46 52 T3 nSTATUS (2) 56 80 92 W11 nCONFIG (2) 53 77 89 Y11 DCLK (2) 128 184 212 C10 CONF_DONE (2) 105 150 172 E18 INIT_DONE (3)

D2SB 73

Contextual Info: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 • PQFP to PGA Package Conversion * x 36-bit FIFO Buffers • Full 36-bit Word Width • Selectable 36/18/9-bit Word Width

smd diode R648

Abstract: TVS diode r725 smd diode R646 amp 4546 smd diode u1j hp r707 Diode smd f6 smd R552 smd diode R645 diode U1J
Contextual Info: LXD9785 PQFP Demo Board with FPGA for SS-SMII Fiber -to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249323-001 LXD9785 PQFP Demo Board with FPGA for SS-SMII (Fiber)-to-MII Conversion User Guide.

16V8H-15

Abstract: 20-2136J res 10k sip 16V8H-15 pc IC 4020 pulse TRANSFORMER valor res 0402 MSL-260-G-H ic 0808 data sheet 16v8h
Contextual Info: PLX Technology PCI9060 DEMO List of Materials 06/16/96 Description Qty Vendor Vendor Part Reference Designator PCB,PCI9060 DEMO,Rev A IC,PCI9060,PQFP IC,80960CA,33 MHz,PQFP IC,82596CA,33 MHz,PFQP IC,82C503,PLCC IC,16550A,PLCC IC,Static Ram, 32Kx8, 15 nsec, 28 Pin 300 Mil SOJ

m 208 b1

Abstract: EPM7256E EPM7256S
Contextual Info: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,

EPM7256E

Abstract: EPM7256S
Contextual Info: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,

EP20K100E

Abstract: t25 4 j5
Contextual Info: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8

14X14

Abstract: 14x14-64 PQFP 128 14x20
Contextual Info: %s AMI A M I SE M IC O N D U C T O R PQFP Packaging Capabilities . . Description Surface Mount The Plastic Quad Flatpack PQFP is a high-density, low-cost package for high leadcount applications. It uses a smaller lead-to-lead spacing than the PLCC and has gull-wing leads which permit better inspection of leads

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –