QECXXX LED Search Results

QECXXX

Abstract: QSC113 QSC114C QECXXX LED
Contextual Info: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)

phototransistor infrared

Contextual Info: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)

QSC133

Contextual Info: PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSC133 DESCRIPTION PACKAGE DIMENSIONS U _ .1 2 6 3.20 R EFER EN C E SURFACE 106(2.69) The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FEATURES .042 (1.0 7 )

C11351

Contextual Info: ] • PLASTIC SILICON PHOTOTRANSISTOR optoelectronics QSC112/113/114 DESCRIPTION PACKAGE DIMENSIONS The QSC11X is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. FEATURES Tight production distribution. Steel lead frames for improved reliability in solder

B345

Abstract: wcn1
Contextual Info: [*13 PLASTIC SILICON PHOTODARLINGTON HteuM* OPTOELECTRONICS QSC133 DESCRIPTION PACKAGE DIMENSIONS L _ .126 3.20 106(2.69) REFERENCE SURFACE The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FEATURES .042 (1.07)-*

QECXXX

Contextual Info: PLASTIC SILICON PHOTODARLINGTON OPTOELECTROmCS QSC133 PA C K A G E DIM ENSIONS d e s c r ip t io n L _ 126 3.20 R EFER ENC E SURFACE .106(2.69) The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FE A T U R B t

QSC112

Abstract: QSC113 QSC114 QECXXX LED
Contextual Info: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)

Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor tm Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder

Infrared Phototransistor

Abstract: Phototransistor qsc112 specification qsc112 QSC113 QSC114 QSC113_0040D
Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor tm Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder

QSC11

Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • ■ ■ ■ The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. Tight production distribution PACKAGE DIMENSIONS

QSC113_0040D

Abstract: Infrared Phototransistor QSC112 QSC113 QSC114
Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder

4n35 optocoupler spice model

Abstract: L14F1 phototransistor datasheet MOC3043-M spice model H11F1 SPICE MODEL h11D1 spice MOC3010 spice L14F1 PHOTOTRANSISTOR slotted optocouplers DARLINGTON phototransistor l14f1 spice MOC3011
Contextual Info: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM