BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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QFN 56 7x7 footprint
Abstract: QFN 56 7x7 0.5 TEXTOOL 56 qfn 7x7
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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JEDEC Drawing MO-220 qfn
Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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Unit2607
REJ01K0003-0300
1000-pin bga 0,8 mm
HQFP1414-64
HLQFP 176 Package
BGA and QFP Package mounting
HLQFP1414-100
MO-235 FOOTPRINT
QFN 64 8x8 footprint
footprint WSON
LFPAK footprint Renesas
"General Catalog"
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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mlag
Abstract: A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
Text: Shortform Catalog August 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog August 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-081213
mlag
A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
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prt0
Abstract: No abstract text available
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB
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CY7C6431x
CY7C6434x,
CY7C6435x
prt0
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micrel shortform
Abstract: MIC33163 SM802
Text: February 2015 Shortform Catalog Shortform Catalog February 2015 2015 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-022415
micrel shortform
MIC33163
SM802
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MIC33163
Abstract: voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765
Text: September 2014 Shortform Catalog Shortform Catalog September 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-090514
MIC33163
voip ata soc
MICREL top marking for DSC557-0344FI0T
ksz8765
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Untitled
Abstract: No abstract text available
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB
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CY7C6431x
CY7C6434x,
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mic3712
Abstract: XGPON ONU
Text: February 2014 Shortform Catalog Shortform Catalog February 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-021414
mic3712
XGPON ONU
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TAG 302-600
Abstract: PE42924
Text: Changing RF Design. Forever. TM 2013 Commercial Products Product Selection Guide First Edition Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor NASDAQ: PSMI is a fabless provider of high-performance radio-frequency (RF)
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PE33632
Abstract: PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694
Text: 2010 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS : The Green RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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and940
10B-6
PE33632
PE33362
PE33632 die
pe33382
PE42692
PE33362 die
PE42510A1
PE4340
PE33631
PE42694
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302831
Abstract: QFN 56 7x7 footprint h/qfn 48 7x7 footprint
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features • Powerful Harvard-architecture processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0 V to 5.5 V operating voltage without USB
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CY7C6431x
CY7C6434x,
CY7C6435x
302831
QFN 56 7x7 footprint
h/qfn 48 7x7 footprint
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SY55852
Abstract: No abstract text available
Text: Shortform Catalog September 2012 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog September 2012 2012 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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747-NUHO
M0009-090112
SY55852
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Untitled
Abstract: No abstract text available
Text: Shortform Catalog February 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog February 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-021913
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bt 1696
Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are
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microcontroller based energy meters 8051
Abstract: Ember EM357 EM-357 EM357 interface zigbee with 8051 CEL EM357 ZICM357SP0 ZICM357P2 8051 c programming examples pcb design of zigbee
Text: MeshConnect EM357 Modules The MeshConnect™ EM357 module ZICM357P2 is based on the Ember EM357 system on chip (SoC). The module includes a high performance Renesas power amplifier that increases power out to +20 dBM, making it one of the most powerful modules on the
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EM357
ZICM357P2)
ZICM2410P0-1
ZICM2410P0-1C
ZICM2410P2-2
ZICM2410P2-1C
ZICM2410QN48
microcontroller based energy meters 8051
Ember EM357
EM-357
interface zigbee with 8051
CEL EM357
ZICM357SP0
ZICM357P2
8051 c programming examples
pcb design of zigbee
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Untitled
Abstract: No abstract text available
Text: Data Sheet PD720201/μPD720202 ASSP USB3.0 HOST CONTROLLER R19DS0047EJ0500 Rev.5.00 Jan. 17, 2013 1. OVERVIEW The μPD720201 and μPD720202 are Renesas’ third generation Universal Serial Bus 3.0 host controllers, which comply with Universal Serial Bus 3.0 Specification, and Intel’s eXtensible Host Controller Interface
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PD720201/Î
PD720202
R19DS0047EJ0500
PD720201
PD720202
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Untitled
Abstract: No abstract text available
Text: NCP5395G 2/3/4-Phase Controller with On Board Gate Drivers for CPU Applications • • • • • • • • • • • • • • • • • • • • • • • Meets Intel’s VR11.1 and AMD’s 6 Bit Code Specifications Enhanced Power Saving Function
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NCP5395G
US07057381)
NCP5395G/D
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