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    QFN DENSITY Search Results

    QFN DENSITY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15PN-000 High-Density D-Subminiature (HD15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62SK-000 High-Density D-Subminiature (HD62 Female D-Sub) Connector, 62-Position Socket Contacts, Solder-Cup Terminals Datasheet

    QFN DENSITY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


    Original     		PDF

    P23C

    Abstract: p31c p15c sidactor P07C p09c
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3.3x3.3 QFN Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients.


    Original     		PDF E133083 P23C p31c p15c sidactor P07C p09c

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil

    JESD22-A113

    Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
    Text: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.


    Original     		PDF IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		PDF TB389

    Untitled

    Abstract: No abstract text available
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3.3x3.3 QFN Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients.


    Original     		PDF E133083

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		PDF EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil

    p31b

    Abstract: JESD22-A104 TEST CONDITION K EIA-481-d p35b marking p31b marking P26B P0080Q12ALRP p06a P06A diode P31A
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3x3 QFN Description Q2L Series 3x3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients. Q2L Series


    Original     		PDF E133083 Electric69 p31b JESD22-A104 TEST CONDITION K EIA-481-d p35b marking p31b marking P26B P0080Q12ALRP p06a P06A diode P31A

    Untitled

    Abstract: No abstract text available
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3.3x3.3 QFN Pb e3 RoHS Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients.


    Original     		PDF E133083

    MAX3737

    Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 NE164
    Text: 19-2818; Rev 2; 7/04 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN MAX3737ETJ+ -40°C to +85°C 32 Thin QFN MAX3737EGJ -40°C to +85°C +Denotes lead-free packaging. 32 QFN 26 APCFILT1 27 APCFILT2


    Original     		PDF OC-48 100mA MAX3737ETJ MAX3737ETJ+ MAX3737EGJ MAX3737 MAX3737 HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 NE164

    MAX3737

    Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		PDF MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737 HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472

    MAX3737

    Abstract: No abstract text available
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control PART TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		PDF MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737

    p31b

    Abstract: p06a p11-b marking p31b
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3x3 QFN Description Q2L Series 3x3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients. The series provides a low profile, chip scale surface


    Original     		PDF E133083 p31b p06a p11-b marking p31b

    mc13718

    Abstract: Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR MC13717 Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight
    Text: Freescale Semiconductor Advance Information MC13790/D Rev. 1.1, 11/2004 MC13790 Package Information QFN Package Case 1506-01 QFN–76 MC13790 Ordering Information Integrated Power Management IC Device Operating Temperature Range Package MC13790 TA = –20°C to 70°C


    Original     		PDF MC13790/D MC13790 MC13790 MC13717 MC13790application, MC13790/D mc13718 Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		PDF SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station

    440G

    Abstract: ATXN6077A CYWUSB6935 LR06
    Text: CYWUSB6935 WirelessUSB LR 2.4-GHz DSSS Radio SoC 1.0 Features • 2.4-GHz radio transceiver The CYWUSB6935 is offered in an industrial temperature range 48-pin QFN and a commercial temperature range 48-pin QFN. • Operates in the unlicensed Industrial, Scientific, and


    Original     		PDF CYWUSB6935 CYWUSB6935 48-pin 95-dBm 13-MHz 440G ATXN6077A LR06

    LT3080

    Abstract: 446V LT1991 LTC2656 LTC2656-H LTC2656-HI6 LTC2656-L LTC2656-LI LTC2656-LI6 LTC2656-LT3080
    Text: Eight 16-Bit, Low INL, VOUT DACs in a 4mm x 5mm QFN Package: Unparalleled Density and Flexibility Leo Chen While 16-bit VOUT DACs are not uncommon, the combination of low INL ±4 LSB and high density (eight DACs in a 4mm × 5mm QFN package) allows the LTC2656 to fit an unparalleled range of sockets.


    Original     		PDF 16-Bit, 16-bit LTC2656 LTC2656s LTC2656 LT3080 446V LT1991 LTC2656-H LTC2656-HI6 LTC2656-L LTC2656-LI LTC2656-LI6 LTC2656-LT3080

    qfn Substrate design guidelines

    Abstract: j-std-001d IPC-SM-782 MO-220 TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid


    Original     		PDF TB389 qfn Substrate design guidelines j-std-001d IPC-SM-782 MO-220

    J-STD-005

    Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging


    Original     		PDF TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN

    qfn 48 7x7 stencil

    Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical


    Original     		PDF

    440G

    Abstract: ATXN6077A CYWUSB6935 LR06 zero crossing detector using psoc
    Text: CYWUSB6935 WirelessUSB LR 2.4-GHz DSSS Radio SoC 1.0 Features • 2.4-GHz radio transceiver The CYWUSB6935 is offered in an industrial temperature range 48-pin QFN and a commercial temperature range 48-pin QFN. • Operates in the unlicensed Industrial, Scientific, and


    Original     		PDF CYWUSB6935 CYWUSB6935 48-pin 95-dBm 13-MHz 440G ATXN6077A LR06 zero crossing detector using psoc

    schematic dsrc

    Abstract: AD10 MAX19707 MAX19707ETM MAX19707EVKIT
    Text: 19-3826; Rev 1; 6/07 KIT ATION EVALU LE B A IL A AV 10-Bit, 45Msps, Ultra-Low-Power Analog Front-End Portable Communication Equipment Ordering Information PART* PIN-PACKAGE PKG CODE MAX19707ETM 48 Thin QFN-EP* T4877-4 MAX19707ETM+ 48 Thin QFN-EP* T4877-4


    Original     		PDF 10-Bit, 45Msps, MAX19707ETM T4877-4 MAX19707ETM+ 48-Pin MAX19707 schematic dsrc AD10 MAX19707 MAX19707ETM MAX19707EVKIT