QFN LAND PATTERN Search Results

QFN 5x5

Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should

QFN 5X5

Abstract: "thermal via" qfn land pattern
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should

TB389

Contextual Info: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing

J-STD-005

Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

qfn Substrate design guidelines

Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid

J-STD-005

Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging

Contextual Info: FAX# 408 944-0970 TITLE 16 LEAD QFN 3x3mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-16LD-PL-1 Rev A B ECN 102711HC04 102914PM02 Originator S. YEH E. dlSantos Change New release Update land pattern drawing UNIT MM Reason Per George C. Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A ECN 112111HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 28 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-28LD-PL-9 Rev A ECN 010512HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 16 LEAD QFN 3x3mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-16LD-PL-1 Rev A ECN 102711HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 14 LEAD QFN 2.5x2.5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN2525-14LD-PL-1 Rev A ECN 042412HC07 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 20 LEAD QFN 3x4mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN34-20LD-PL-1 Rev A ECN 110311HC05 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 24 LEAD QFN 4x4mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-24LD-PL-1 Rev A ECN 112111HC01 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-2 Rev A ECN 022813HC08 Originator A. Kungo Change New Release UNIT MM Reason Replaces MLF55Q-32LD-PD-1

Contextual Info: FAX# 408 944-0970 TITLE 16 LEAD QFN 4.0 x 4.0 mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-16LD-PL-1 Rev A ECN 041912HC36 Originator S. YEH Change New release UNIT MM Reason Per George C.

Contextual Info: FAX# 408 944-0970 TITLE 24 LEAD QFN 3x3mm PACKAGE (Flip Chip) OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-24LD-PL-9 UNIT MM ° Rev A ECN 042412HC06 Originator S. YEH Change New release Reason Per George C.

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.1204 LC5 – 5 x 5 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC5 PCB Land Pattern

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0106 LC3 – 3 x 3 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC3 PCB Land Pattern

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0806 LC4 – 4 x 4 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC4 PCB Land Pattern

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0108 LC3C – 3 x 3 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC3C PCB Land Pattern

Contextual Info: FAX# 408 944-0970 TITLE 28 LEAD QFN 5X6mm PACKAGE (Co-Package) OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN56-28LD-PL-2 Lead Frame NiPdAu Via size/Pitch Solder stencil opening/Pitch Comments 0.300-0.350mm/0.80mm 1.55x1.20mm/1.75mm Must be connected to GND plane

Contextual Info: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A B ECN 112111HC04 091014HC05 Originator S. YEH E. dlSantos Change New release Update typo error on note #4 UNIT MM Reason Per George C. Typo error

Contextual Info: FAX# 408 944-0970 TITLE 16 LEAD QFN 4.0 x 4.0 mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-16LD-PL-2 Lead Frame NiPdAu UNIT MM Lead Finish NiPdAu NOTE: 1. MAX PACKAGE WARPAGE IS 0.05mm. 2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.