QFN PACKAGE JUNCTION TO PCB THERMAL RESISTANCE Search Results

land pattern for DFN

Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
Contextual Info: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

thermal analysis on pcb

Abstract: AND8432
Contextual Info: AND8432 Thermal Considerations for a 4x4 mm QFN Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview board−to−ambient thermal resistance which is controlled by board size, materials, layout, and thermal boundary conditions , can easily range from about 15°C/W up to in

to220 pcb footprint

Abstract: "thermal via" PCB D2PAK LFPAK footprint Renesas LFPAK footprint POWERPAK SO8 TO220 HEATSINK DATASHEET thermal PCB D2PAK sot669 lfpak LFPAK package
Contextual Info: LFPAK The Toughest Power-SO8 The evolution of Power MOSFET packages Typical TO220 construction TO220 is the ‘original’ through-hole power package. It is suitable for through-hole mounting and low-cost wave soldering. It also provides very low thermal resistances when mounted to a suitable heatsink.

Contextual Info: APPLICATION NOTE Mounting Considerations for Exposed-Paddle Packages Introduction Many of Skyworks products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, which provides

NCS5650

Abstract: AND8402
Contextual Info: AND8402 Thermal Considerations for the NCS5650 Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview Note 1 . On the other hand, because of the small footprint of the package, board−to−ambient thermal resistance (which

EN5336

Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via"
Contextual Info: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal

EN5312

Abstract: EN5311 EP5362 EP5352 Enpirion EN5311 EN5311QI EN5312QI EP5352QI EN5311Q "exposed pad" PCB via
Contextual Info: THERMAL NOTE EN5311/EN5312/EP5352/EP5362/EP5382QI DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5311QI, EN5312QI, EP5352QI, EP5362QI and EP5382QI DC-DC converters are packaged in 5x4x1.1mm 20-pin QFN packages that have the same thermal characteristics. The QFN

Contextual Info: DRV8800 DRV8801 SLVS855F – JULY 2008 – REVISED JANUARY 2012 www.ti.com DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

Contextual Info: DRV8800 DRV8801 SLVS855F – JULY 2008 – REVISED JANUARY 2012 www.ti.com DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

EN5336Q

Abstract: EN5335Q EN5336 QFN PACKAGE Junction to PCB thermal resistance via diameter pitch J-STD-020A
Contextual Info: THERMAL NOTE EN5335Q/EN5336Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5335Q and EN5336Q DC-DC converters are packaged in 10x7.5x1.85mm 44-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed

SLVS855F

Contextual Info: DRV8800 DRV8801 SLVS855F – JULY 2008 – REVISED JANUARY 2012 www.ti.com DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

Contextual Info: DRV8800 DRV8801 www.ti.com SLVS855H – JULY 2008 – REVISED NOVEMBER 2013 DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

ultrasound transducer 100KHz

Abstract: ultrasound transducer circuit driver EL7457 ultrasound transducer high power driver QFN-4x4 ultrasonic transducer circuit EL7457CU EL7457CU-T13 EL7457CU-T7 FN7288
Contextual Info: EL7457 Data Sheet June 10, 2004 40MHz Non-Inverting Quad CMOS Driver Features The EL7457 is a high speed, noninverting, quad CMOS driver. It is capable of running at clock rates up to 40MHz and features 2A peak drive capability and a nominal on-resistance of just 3Ω. The EL7457 is ideal for driving

si514

Abstract: SI510
Contextual Info: AN765 T HERMAL A NALYSIS OF S I L I C O N L ABS T I M I N G D EVICES 1. Introduction The junction temperature of semiconductor devices affects reliability and performance of Integrated Circuits ICs , including timing devices. This application note provides the following:

Contextual Info: DRV8800 DRV8801 www.ti.com SLVS855I – JULY 2008 – REVISED JANUARY 2014 DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [rDS on ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

Contextual Info: DRV8833 SLVSAR1B – JANUARY 2011 – REVISED AUGUST 2011 www.ti.com DUAL H-BRIDGE MOTOR DRIVER Check for Samples: DRV8833 FEATURES 1 • 2 • • • Dual-H-Bridge Current-Control Motor Driver – Capable of Driving Two DC Motors or One Stepper Motor – Low MOSFET On-Resistance:

EL7457CS

Abstract: EL7457CS-T13 EL7457
Contextual Info: EL7457 Data Sheet May 18, 2004 40MHz Non-Inverting Quad CMOS Driver Features The EL7457 is a high speed, noninverting, quad CMOS driver. It is capable of running at clock rates up to 40MHz and features 2A peak drive capability and a nominal on-resistance of just 3Ω. The EL7457 is ideal for driving

Contextual Info: DRV8800 DRV8801 www.ti.com SLVS855G – JULY 2008 – REVISED OCTOBER 2013 DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

Contextual Info: DRV8800 DRV8801 SLVS855F – JULY 2008 – REVISED JANUARY 2012 www.ti.com DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES 1 • • • • • • • • 2 • • Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

QFN PACKAGE Junction to PCB thermal resistance

Abstract: SMP1325-085LF 201648
Contextual Info: DATA SHEET SMP1325-085LF: Surface Mount PIN Diode for High Power Switch Applications Applications • Low loss, high power switches • Low distortion attenuators Features • Low-thermal resistance: 40 °C/W • Suitable for 50 W Continuous Wave T/R switches

JEDEC qfn pin1 location tape

Contextual Info: DRV8800 DRV8801 www.ti.com SLVS855D – JULY 2008 – REVISED APRIL 2010 DMOS FULL-BRIDGE MOTOR DRIVERS Check for Samples: DRV8800, DRV8801 FEATURES • • 1 • • • • • • • • 2 Low ON-Resistance [Rds ON ] Outputs Overcurrent Protection Motor Lead Short-to-Supply Protection

Contextual Info: DATA SHEET SMP1325-085LF: Surface Mount PIN Diode for High Power Switch Applications Applications • Low loss, high power switches • Low distortion attenuators Features • Low-thermal resistance: 40 °C/W • Suitable for 50 W Continuous Wave T/R switches