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    QFN YAMAICHI SOCKET Search Results

    QFN YAMAICHI SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    QFN YAMAICHI SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NP404

    Abstract: NP474 Yamaichi Electronics NP473 tip 0401 qfn YAMAICHI SOCKET
    Text: QFN Test & Burn-in Sockets for QFNs NP473 • NP473 • For Series odd pin counts on each side • Applicable Package Sizes • Outline Dimensions: 25.0 W x 25.0(D) x 20.5(H)mm NP404 • NP404 Unit:mm • For even pin counts on each side Series • Applicable Package Sizes


    Original     		PDF NP473 NP404 NP473/NP404 1000MW 100VDC 100VAC NP404 NP474 Yamaichi Electronics NP473 tip 0401 qfn YAMAICHI SOCKET

    socket Yamaichi IC299

    Abstract: 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET
    Text: Test Contactors IC299 Series IC299- 100 30 Design No. Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: NOTE: High speed / low inductance QFP and SOP’s. Insulator: Contact: Plating: Socket Series No. of Leads Characteristics


    Original     		PDF IC299 IC299- 000Mminimum 10mA/20mV ele00 8965mm 9035mm socket Yamaichi IC299 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    CRYSTAL 4MHz smd 2pin

    Abstract: MSP430F2618IPM MSP-FET430F5137RF900 SLAU278H YAMAICHI ic357 MSP-TS430PZ100C ic357 MSP430G2452 MSP-TS430PN80USB 32,768 SMD Quarz
    Text: MSP430 Hardware Tools User's Guide Literature Number: SLAU278H May 2009 – Revised December 2011 2 SLAU278H – May 2009 – Revised December 2011 Submit Documentation Feedback Copyright 2009–2011, Texas Instruments Incorporated Contents . 9


    Original     		PDF MSP430 SLAU278H SLAU278H MSP-FET430PIF CRYSTAL 4MHz smd 2pin MSP430F2618IPM MSP-FET430F5137RF900 YAMAICHI ic357 MSP-TS430PZ100C ic357 MSP430G2452 MSP-TS430PN80USB 32,768 SMD Quarz

    MSP430V

    Abstract: ASX-531 SLAU278J EM430F6147RF900 ASX-531CS MSP-EXP430G2 B42 diode smd SLAU371 MSP430F5438 user guide MSP430G2XXX
    Text: MSP430 Hardware Tools User's Guide Literature Number: SLAU278J May 2009 – Revised June 2012 Contents . 7 Get Started Now! . 11


    Original     		PDF MSP430 SLAU278J MSP-FET430PIF eZ430-F2013 MSP430V ASX-531 EM430F6147RF900 ASX-531CS MSP-EXP430G2 B42 diode smd SLAU371 MSP430F5438 user guide MSP430G2XXX

    pj 69 SMD diode

    Abstract: MSP430F2618IPM 47/pj 69 SMD diode TMS 3621 14 pin JTAG CONNECTOR SLAU367 smd diode code pj 43 pinhead SMD PJ 77 smd diode code pj 65
    Text: MSP430 Hardware Tools User's Guide Literature Number: SLAU278R May 2009 – Revised May 2014 Contents Preface . 8 1 Get Started Now! . 11


    Original     		PDF MSP430 SLAU278R pj 69 SMD diode MSP430F2618IPM 47/pj 69 SMD diode TMS 3621 14 pin JTAG CONNECTOR SLAU367 smd diode code pj 43 pinhead SMD PJ 77 smd diode code pj 65

    ic59-64075-G4

    Abstract: IC51-0242-802 PC4600 ic59-64075 Eletech Electronics f 4556 IC51-0844-401-1 QFP 128 lead .5mm M32182 M32R
    Text: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of


    Original     		PDF

    ic59-64075-G4

    Abstract: IC51-0242-802 zigzag 40pin connector IC51-0844-401-1 M32R M32170T-SDI 100P6-B Eletech Electronics f 4556 M3888 QFP 128 lead .5mm
    Text: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of


    Original     		PDF

    740-Family

    Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
    Text: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual


    Original     		PDF 64-pin, 80-pin, 100pin PCA7754 PCA7755A PCA7755B PCA7756 SEAL100FP SEAL64FP SEAL80FP 740-Family 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798

    DB354

    Abstract: QFN40 SDIP32-SO34 QFN-40 DB552 DB601 ST7260 ST7 series MCU TQFP48 UM0102
    Text: UM0102 User manual ST7MDTU3-EMU3 Probe user guide Introduction The ST7-EMU3 series emulators are the third generation of high-end emulators for ST7. They are designed to provide a complete range of advanced debugging features. In addition, they contain all the adapters, connectors and sockets you need to emulate any


    Original     		PDF UM0102 DB354 QFN40 SDIP32-SO34 QFN-40 DB552 DB601 ST7260 ST7 series MCU TQFP48 UM0102

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    Untitled

    Abstract: No abstract text available
    Text: IC299 S e rie s IC299-100 30 Socket Series No. of Leads H Design N a } - Insulation Resistance: I.OOOMQminimum at 500 VDC W ithstanding Voltage: 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV Initial -30"C - +125‘C


    OCR Scan     		PDF IC299 IC299-100 10mA/20mV 8965m 9035m

    Untitled

    Abstract: No abstract text available
    Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact


    OCR Scan     		PDF