QFN-48 LAND PATTERN TI Search Results

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

qfn 32 land pattern

Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Contextual Info: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

Contextual Info: SM802XXX Flexible Ultra-Low Jitter Clock Synthesizer Clockworks FLEX General Description Features The SM802xxx series is a member of the ClockWorks™ family of devices from Micrel and provide an extremely low-noise timing solution for applications such as 1-100

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

qfn 6x6 foot print

Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN
Contextual Info: Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona

QFN-6x6 0.5mm

Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Contextual Info: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona

AN3111

Abstract: qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint
Contextual Info: AN3111 Rev 4, 01/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe

AN3111

Abstract: AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint
Contextual Info: AN3111 Rev 5, 04/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe

qfn 48 7x7 stencil

Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
Contextual Info: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die

HMC916LP3

Abstract: SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3
Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Package Type: 6L LP2, 16L LP3 Package Style: 16L 3x3mm QFN Package

Contextual Info: A3988 Quad DMOS Full Bridge PWM Motor Driver Features and Benefits Description The A3988 is a quad DMOS full-bridge driver capable of driving up to two stepper motors or four DC motors. Each full-bridge output is rated up to 1.2 A and 36 V. The A3988 includes fixed off-time pulse width modulation PWM current

TB466

Abstract: qfn 32 land pattern moisture sensitivity ISL29001
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Contextual Info: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor

EMC4001

Contextual Info: USB2514 USB 2.0 High-Speed 4-Port Hub Controller PRODUCT FEATURES Data Brief General Description „ The SMSC 4-Port Hub is low power, OEM configurable, MTT multi transaction translator hub controller IC with 4 downstream ports for embedded USB solutions. The

LVEP222

Abstract: MC100LVE222 NB100LVEP222 lqfp52 AG QC TRANSISTOR
Contextual Info: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential

Contextual Info: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential

QFN 64 8x8 footprint

Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
Contextual Info: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential

qfn 48 7x7 stencil

Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Contextual Info: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical

GRM1555C1H1R0BZ01

Abstract: GRM1555C1H1R0BZ01E P12* RF qfn 3X3 land pattern LQG15HN12NJ02D RF5188 RF5188PCBA-41X GRM1555C1H1R
Contextual Info: RF5188 RoHS Compliant & Pb-Free Product 3V 1950MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE Typical Applications • 3V W-CDMA Band 1 Handsets • 3V TD-SCDMA Handsets • Multi-Mode W-CDMA 3G Handsets • Spread-Spectrum Systems Product Description The RF5188 is a high-power, high-efficiency linear amplifier module specifically designed for 3V handheld systems. The device is manufactured on an advanced third

P12* RF

Contextual Info: RF5188 3V W-CDMA LINEAR POWER AMPLIFIER MODULE RoHS Compliant & Pb-Free Product Typical Applications • 3V W-CDMA Handsets • Spread-Spectrum Systems • Multi-Mode W-CDMA 3G Handsets Product Description The RF5188 is a high-power, high-efficiency linear amplifier module specifically designed for 3V handheld systems. The device is manufactured on an advanced third

im1615

Abstract: LQG15HN12NJ02D
Contextual Info: RF5188 3V W-CDMA LINEAR POWER AMPLIFIER MODULE Typical Applications • 3V W-CDMA Handsets • Spread-Spectrum Systems • Multi-Mode W-CDMA 3G Handsets Product Description The RF5188 is a high-power, high-efficiency linear amplifier module specifically designed for 3V handheld systems. The device is manufactured on an advanced third